Method for fabricating a semiconductor device including an embedded semiconductor die
US-2024250004-A1 · Jul 25, 2024 · US
Leadframe for electronic components
US8927342B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8927342-B2 |
| Application number | US-200913124115-A |
| Country | US |
| Kind code | B2 |
| Filing date | Oct 12, 2009 |
| Priority date | Oct 13, 2008 |
| Publication date | Jan 6, 2015 |
| Grant date | Jan 6, 2015 |
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- Title
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Abstract
Official abstract text for this publication.
The present invention specifies a leadframe for electronic components and a corresponding manufacturing process, in which the bonding islands are formed by welding individual, prefabricated segments of a bonding-capable material onto a stamped leadframe.
First claim
Opening claim text (preview).
The invention claimed is: 1. Manufacturing process for a leadframe with the following stages: providing a leadframe from a first material, wherein the leadframe is executed as a stamped preform; positioning of prefabricated segments of a second material at predetermined locations on the leadframe, welding of the positioned segments to the leadframe, wherein the segments of the second material exhibit a surface suitable for wire bonding, and wherein the segments of the second m…
Assignees
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Classifications
Electricity · mapped topic
- H10W70/464Primary
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US8927342B2 cover?
- The present invention specifies a leadframe for electronic components and a corresponding manufacturing process, in which the bonding islands are formed by welding individual, prefabricated segments of a bonding-capable material onto a stamped leadframe.
- Who is the assignee on this patent?
- Goesele Peter, Seger Friedrich, Sinder Josef, and 3 more
- What technology area does this patent fall under?
- Primary CPC classification H10W70/464. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Jan 06 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).