Sic epitaxial wafer production method
US-2015354090-A1 · Dec 10, 2015 · US
US8926752B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8926752-B2 |
| Application number | US-52668508-A |
| Country | US |
| Kind code | B2 |
| Filing date | Feb 27, 2008 |
| Priority date | Mar 2, 2007 |
| Publication date | Jan 6, 2015 |
| Grant date | Jan 6, 2015 |
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There is provided a method capable of obtaining an aluminum-based group III nitride crystal layer having a smooth surface and high crystallinity by employing only HVPE in which inexpensive raw materials can be used to reduce production costs and high-speed film formation is possible without employing MOVPE. To produce a group III nitride crystal by HVPE comprising the step of growing a group III nitride crystal layer by vapor-phase growth on a single crystal substrate by contacting the heated single crystal substrate with a raw material gas containing a group III halide and a compound having a nitrogen atom, the group III nitride crystal is grown by vapor-phase growth on the single crystal substrate heated at a temperature of 1,000° C. or more and less than 1,200° C. to form an intermediate layer and then, a group III nitride crystal is further grown by vapor-phase growth on the intermediate layer on the substrate heated at a temperature of 1,200° C. or higher.
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The invention claimed is: 1. A method of producing a group III nitride crystal by vapor-phase growth, comprising the step of growing a group III nitride crystal on a single crystal substrate by contacting the heated single crystal substrate with a raw material gas containing a group III halide and ammonia, wherein the above step comprises an initial growing substep in which a group III nitride crystal layer is grown by vapor-phase growth on the single crystal substrate heated at a…
Chemistry & Metallurgy · mapped topic
Chemistry & Metallurgy · mapped topic
Chemistry & Metallurgy · mapped topic
Chemistry & Metallurgy · mapped topic
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