Method for improving connector enclosure adhesion

Patent metadata

Field	Value
Publication number	US-8926337-B2
Application number	US-201213722887-A
Country	US
Kind code	B2
Filing date	Dec 20, 2012
Priority date	Aug 24, 2012
Publication date	Jan 6, 2015
Grant date	Jan 6, 2015

Abstract

An improved method is employed to attach an enclosure to a connector body having relatively small geometry. One or more bonding channels are disposed in the outside surface of the connector body. During assembly of an enclosure over the connector body, a bonding material is distributed within the bonding channels and subsequently cured. The bonding channels and the bonding material are designed to employ capillary wicking to aid in the distribution of the bonding material within the bonding channels.

First claim

What is claimed is:

1. A connector comprising:
a body having first and second faces on opposite sides of the body and an outside surface that extends between the first and second faces;
a bonding channel extending along the outside surface of the body, the bonding channel having an entry at the first face;
a plug extending from the second face of the body to a distal end of the connector;
a plurality of contacts carried by the plug; and
an enclosure that surrounds the outs…

Assignees

• Apple Inc

Inventors

• Siahaan Edward
• Webb Michael

Classifications

• H01R13/46 Primary

  Electricity · mapped topic

• H01R13/504 Primary

  Electricity · mapped topic

• H01R43/00

  Electricity · mapped topic

• H01R24/60

  Electricity · mapped topic

• Y10T29/49208

  Cross-Sectional Technologies · mapped topic