Modifiable structures
US-2024389713-A1 · Nov 28, 2024 · US
Diamond bonded construction with reattached diamond body
US8925656B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8925656-B2 |
| Application number | US-90308110-A |
| Country | US |
| Kind code | B2 |
| Filing date | Oct 12, 2010 |
| Priority date | Oct 12, 2009 |
| Publication date | Jan 6, 2015 |
| Grant date | Jan 6, 2015 |
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Abstract
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Diamond bonded construction comprise a diamond body attached to a support. In one embodiment, an initial substrate used to sinter the body is interposed between the body and support, and is thinned to less than 5 times the body thickness, or to less than the body thickness, prior to attachment to the support to relieve stress in the body. In another embodiment, the substrate is removed after sintering, and the body is attached to the support. The support has a material construction different from that of the initial substrate, wherein the initial substrate is selected for infiltration and the support for end use properties. The substrate and support include a hard material with a volume content that may be the same or different. Interfaces between the body, substrate, and/or support may be nonplanar. The body may be thermally stable, and may include a replacement material disposed therein.
First claim
Opening claim text (preview).
What is claimed is: 1. A diamond bonded construction comprising: a diamond body comprising a matrix phase of intercrystalline bonded diamond, and a plurality of interstitial regions dispersed within the matrix phase; a metallic substrate attached to the diamond body; and a metallic support attached to the substrate; wherein the substrate and support each comprise a carbide-containing material, wherein the support has a material composition that is different from that of the…
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Cross-Sectional Technologies · mapped topic
Chemistry & Metallurgy · mapped topic
Cross-Sectional Technologies · mapped topic
Fixed Constructions · mapped topic
Cross-Sectional Technologies · mapped topic
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Frequently asked questions
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- What does patent US8925656B2 cover?
- Diamond bonded construction comprise a diamond body attached to a support. In one embodiment, an initial substrate used to sinter the body is interposed between the body and support, and is thinned to less than 5 times the body thickness, or to less than the body thickness, prior to attachment to the support to relieve stress in the body. In another embodiment, the substrate is removed after si…
- Who is the assignee on this patent?
- Shen Yuelin, Zhang Youhe, Smith International
- What technology area does this patent fall under?
- Primary CPC classification B22F7/06. Mapped technology areas include Operations & Transport.
- When was this patent published?
- Publication date Tue Jan 06 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).