Piezoelectric flutter cooling system

Patent metadata

Field	Value
Publication number	US-2026096054-A1
Application number	US-202418900689-A
Country	US
Kind code	A1
Filing date	Sep 28, 2024
Priority date	Sep 28, 2024
Publication date	Apr 2, 2026
Grant date	—

Abstract

Devices and systems for cooling using piezoelectricity are disclosed herein. In one example, a device includes a heat pipe, one or more fins thermally coupled to a first end of the heat pipe, where the fins extend laterally from the heat pipe, and one or more piezoelectric structures coupled to the fins.

First claim

1 . A device, comprising:
a heat pipe; one or more fins thermally coupled to a first end of the heat pipe, wherein the one or more fins extend laterally from the heat pipe; and one or more piezoelectric structures coupled to the one or more fins.

2 . The device of claim 1 , wherein the one or more piezoelectric structures comprise a piezoelectric material.

3 . The device of claim 2 , wherein the piezoelectric material comprises quartz, tourmaline, lead zirconate titanate, barium titanate, polyvinylidene fluoride, zinc oxide, or gallium nitride.

4 . The device of claim 2 , wherein the piezoelectric material comprises:
silicon and oxygen; barium, titanium, and oxygen; zinc and oxygen; gallium and nitrogen; lead, zirconium, titanium, oxygen; or carbon, hydrogen, and fluorine.

5 . The device of claim 1 , further comprising a power supply to apply a voltage to the one or more piezoelectric structures.

6 . The device of claim 1 , further comprising a heat sink coupled to the first end of the heat pipe, wherein the one or more fins are disposed above the heat pipe, and wherein the heat sink is disposed below the heat pipe.

7 . The device of claim 1 , further comprising a plate thermally coupled to a second end of the heat pipe, wherein the plate is to be thermally coupled to an electronic component.

8 . The device of claim 7 , further comprising the electronic component, wherein the electronic component comprises processing circuitry, memory circuitry, storage circuitry, or communication circuitry.

9 . The device of claim 1 , wherein the one or more fins comprise a rectangular shape.

10 . The device of claim 1 , wherein the one or more fins comprise a curved shape.

11 . The device of claim 1 , wherein the one or more fins comprise a symmetric shape.

12 . A piezoelectric cooling device, comprising:
a heat transfer device; one or more fins thermally coupled to a first end of the heat transfer device, wherein the one or more fins extend substantially perpendicular to the heat transfer device; one or more layers of piezoelectric material on the one or more fins; and a power supply to apply a voltage to the one or more layers of piezoelectric material.

13 . The piezoelectric cooling device of claim 12 , wherein the heat transfer device comprises a heat pipe.

14 . The piezoelectric cooling device of claim 12 , further comprising a heat sink coupled to the first end of the heat transfer device, wherein the one or more fins are disposed above the heat transfer device, and wherein the heat sink is disposed below the heat transfer device.

15 . The piezoelectric cooling device of claim 12 , further comprising a heater plate thermally coupled to a second end of the heat transfer device, wherein the heater plate is to be thermally coupled to an electronic component.

16 . A system, comprising:
a heat pipe; one or more fins thermally coupled to a first end of the heat pipe, wherein the one or more fins extend laterally from the heat pipe; one or more piezoelectric structures coupled to the one or more fins; and an integrated circuit thermally coupled to a second end of the heat pipe.

17 . The system of claim 16 , further comprising a power supply to apply a voltage to the one or more piezoelectric structures.

18 . The system of claim 16 , further comprising a heater plate, wherein the integrated circuit is thermally coupled to the heater plate, and wherein the heater plate is thermally coupled to the second end of the heat pipe.

19 . The system of claim 16 , wherein the integrated circuit comprises a system-on-a-chip, a central processing unit, a graphics processing unit, a network interface controller, a storage device, a memory controller, or an input/output controller.

20 . The system of claim 16 , further comprising a circuit board, wherein the integrated circuit is coupled to the circuit board.

Assignees

• Intel Corp

Inventors

• Nien Shih Wei
• Sung Pei Yang
• Liu Chun-Ting
• Weng Chung-Hsun
• Bawa Ritu
• Konakalla Srinivasarao
• Alva Samarth
• Kamat Satyajit Siddharay
• Sen Arnab
• Saha Krishnendu
• Kurma Raju Prakash

Classifications

• H05K7/20409

  Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing · CPC title

• H10N30/204

  using bending displacement, e.g. unimorph, bimorph or multimorph cantilever or membrane benders · CPC title

• H05K7/20254

  Cold plates transferring heat from heat source to coolant · CPC title

• H05K7/20336

  Heat pipes, e.g. wicks or capillary pumps · CPC title

• H05K7/20209 Primary

  Thermal management, e.g. fan control · CPC title