Multilayer ceramic capacitor and method of manufacturing the same

Patent metadata

Field	Value
Publication number	US-2026074111-A1
Application number	US-202519051064-A
Country	US
Kind code	A1
Filing date	Feb 11, 2025
Priority date	Sep 9, 2024
Publication date	Mar 12, 2026
Grant date	—

Abstract

A multilayer ceramic capacitor including a capacitor body including a dielectric layer and an internal electrode layer, and an external electrode disposed on an outer surface of the capacitor body, wherein the internal electrode layer includes nickel (Ni), aluminum (Al), and silicon (Si), and an Al/Si weight ratio is about 0.01 to about 1.

First claim

What is claimed is:

1 . A multilayer ceramic capacitor, comprising
a capacitor body including a dielectric layer and an internal electrode layer, and an external electrode disposed on an outer surface of the capacitor body, wherein the internal electrode layer includes nickel (Ni), aluminum (Al), and silicon (Si), and an Al/Si weight ratio in the internal electrode layer is 0.01 to 1.

2 . The multilayer ceramic capacitor of claim 1 , wherein
the internal electrode layer includes aluminum (Al) in an amount of 0.01 parts by weight to 1 part by weight based on 100 parts by weight of nickel (Ni).

3 . The multilayer ceramic capacitor of claim 1 , wherein
the internal electrode layer includes silicon (Si) in an amount of 0.01 parts by weight to 8 parts by weight based on 100 parts by weight of nickel (Ni).

4 . The multilayer ceramic capacitor of claim 1 , wherein
the internal electrode layer further includes one or more selected from tin (Sn), barium (Ba), titanium (Ti), and dysprosium (Dy).

5 . The multilayer ceramic capacitor of claim 1 , wherein
the internal electrode layer includes an internal electrode layer interface region defined as a region from an interface of the dielectric layer and the internal electrode layer to a depth of 100 nm into the internal electrode layer.

6 . The multilayer ceramic capacitor of claim 5 , wherein
the internal electrode layer interface region includes a secondary phase including aluminum (Al), silicon (Si), and barium (Ba).

7 . The multilayer ceramic capacitor of claim 1 , wherein
the dielectric layer includes a barium titanate-based compound including barium (Ba) and titanium (Ti).

8 . The multilayer ceramic capacitor of claim 7 , wherein
the dielectric layer further includes aluminum (Al) and silicon (Si).

9 . The multilayer ceramic capacitor of claim 8 , wherein
the dielectric layer includes aluminum (Al) in an amount of 0.05 parts by mole to 10 parts by mole based on 100 parts by mole of barium (Ba).

10 . The multilayer ceramic capacitor of claim 8 , wherein
the dielectric layer includes silicon (Si) in an amount of 0.05 parts by mole to 10 parts by mole based on 100 parts by mole of barium (Ba).

11 . The multilayer ceramic capacitor of claim 1 , wherein
the dielectric layer includes a dielectric layer interface region defined as a region from an interface of the dielectric layer and the internal electrode layer to a depth of 100 nm into the dielectric layer.

12 . The multilayer ceramic capacitor of claim 11 , wherein
the dielectric layer interface region includes a secondary phase including aluminum (Al), silicon (Si), and barium (Ba).

13 . The multilayer ceramic capacitor of claim 1 , wherein
the dielectric layer includes a plurality of dielectric grains and grain boundaries disposed between the plurality of the dielectric grains.

14 . The multilayer ceramic capacitor of claim 13 , wherein
the grain boundaries include secondary phases including aluminum (Al), silicon (Si), and barium (Ba).

15 . A method of manufacturing a multilayer ceramic capacitor, comprising
mixing nickel (Ni) and an aluminum (Al)-containing compound to prepare a conductive paste; manufacturing a dielectric green sheet from a dielectric slurry, and applying the conductive paste on a surface of the dielectric green sheet to form a conductive paste layer; manufacturing a dielectric green sheet stack by stacking a plurality of the dielectric green sheet on which the conductive paste layer is formed; manufacturing a capacitor body including a dielectric layer and an internal electrode layer by firing the dielectric green sheet stack; and forming an external electrode on an outer surface of the capacitor body, wherein at least one selected from the conductive paste and the dielectric slurry includes a silicon (Si)-containing compound, the internal electrode layer includes nickel (Ni), aluminum (Al), and silicon (Si), and the aluminum (Al)-containing compound and the silicon (Si)-containing compound are included in a content ratio such that an Al/Si weight ratio in the internal electrode layer is 0.01 to 1.

16 . The method of claim 15 , wherein
the conductive paste further includes a tin (Sn)-containing compound.

17 . The method of claim 15 , wherein
the dielectric slurry includes a barium titanate-based compound.

18 . The method of claim 17 , wherein
the dielectric slurry further includes a dysprosium (Dy)-containing compound.

19 . The method of claim 15 , wherein the conductive paste includes the silicon (Si)-containing compound,
wherein the silicon (Si)-containing compound includes SiO 2 , and wherein the aluminum (Al)-containing compound includes Al 2 O 3 .

20 . A multilayer ceramic capacitor, comprising
a capacitor body including a dielectric layer and an internal electrode layer, and an external electrode disposed on an outer surface of the capacitor body, wherein the internal electrode layer includes aluminum (Al), and silicon (Si), and an Al/Si weight ratio in the internal electrode layer is 0.01 to 1.

21 . The multilayer ceramic capacitor of claim 20 , wherein
the internal electrode layer further includes nickel (Ni), the internal electrode layer includes aluminum (Al) in an amount of 0.01 parts by weight to 1 part by weight based on 100 parts by weight of nickel (Ni), and the internal electrode layer includes silicon (Si) in an amount of 0.01 parts by weight to 8 parts by weight based on 100 parts by weight of nickel (Ni).

22 . The multilayer ceramic capacitor of claim 21 , wherein
the dielectric layer includes a barium titanate-based compound including barium (Ba) and titanium (Ti), the dielectric layer includes aluminum (Al) in an amount of 0.05 parts by mole to 10 parts by mole based on 100 parts by mole of barium (Ba), the dielectric layer includes silicon (Si) in an amount of 0.05 parts by mole to 10 parts by mole based on 100 parts by mole of barium (Ba), the dielectric layer comprises a dielectric layer interface region defined as a region from an interface of the dielectric layer and the internal electrode layer to a depth of 100 nm into the dielectric layer, and the dielectric layer interface region includes a secondary phase including aluminum (Al), silicon (Si), and barium (Ba).

Assignees

• Samsung Electro Mech

Inventors

• Kim Nayoung
• Hwang Hyunjun
• Jang Changsoo
• Kang Suji
• Jang Won Seok
• Park Jinkyung
• Kim Jungmin
• Kim Hongseok

Classifications

• H01G4/2325

  characterised by the material of the terminals · CPC title

• H01G4/008

  Selection of materials · CPC title

• H01G4/1227

  based on alkaline earth titanates · CPC title

• H01G4/30

  Stacked capacitors (H01G4/33 takes precedence) · CPC title

• H01G4/0085 Primary

  Fried electrodes · CPC title