Thermally conductive silicone resin composition

Patent metadata

Field	Value
Publication number	US-2026062600-A1
Application number	US-202519380125-A
Country	US
Kind code	A1
Filing date	Nov 5, 2025
Priority date	Dec 26, 2019
Publication date	Mar 5, 2026
Grant date	—

Abstract

One of the objects of the present invention is to provide a thermally conductive silicone resin composition which has good thermal conductivity, a light weight (namely, a light weight per unit volume), and good reliability in high humidity, and a molded body thereof. The present invention provides a thermally conductive silicone resin composition comprising the following components (A) to (E): (A) an organopolysiloxane having at least two alkenyl groups each bonded to a silicon atom in an amount of 100 parts by mass, (B) an organohydrogen polysiloxane having at least two hydrogen atoms each bonded to a silicon atom in an amount such that a ratio of the number of the hydrogen atom bonded to a silicon atom relative to the number of the alkenyl group in component (A) is 0.1 to 2, (C) a thermally conductive filler in an amount of 2500 to 6000 parts by mass, (D) a catalytic amount of an addition reaction catalyst, and (E) an addition-reaction controlling agent in an amount of 0.01 to 1 part by mass, wherein the thermally conductive filler (C) comprises magnesium oxide having a specific surface area of 0.4 m2/g or less in an amount of 20 to 50 wt % and aluminum hydroxide in an amount of 10 to 30 wt %, relative to a total weight of component (C).

First claim

1 . A thermally conductive molded body having a thermal conductivity at 25° C. of 3.5 W/m·K or more, wherein the molded body is obtained by curing a thermally conductive silicone resin composition comprising the following components (A) to (E):
(A) an organopolysiloxane having at least two alkenyl groups each bonded to a silicon atom in an amount of 100 parts by mass,
(B) an organohydrogen polysiloxane having at least two hydrogen atoms each bonded to a silicon atom in an amount such that a ratio of the number of the hydrogen atom bonded to a silicon atom relative to the number of the alkenyl group in component (A) is 0.1 to 2,
(C) a thermally conductive filler in an amount of 2500 to 6000 parts by mass,
(D) a catalytic amount of an addition reaction catalyst, and
(E) an addition-reaction controlling agent in an amount of 0.01 to 1 part by mass, wherein the thermally conductive filler (C) comprises magnesium oxide having a specific surface area of 0.4 m 2 /g or less in an amount of 20 to 50 wt % and aluminum hydroxide in an amount of 10 to 30 wt %, relative to a total weight of component (C).

2 . The thermally conductive molded body according to claim 1 , having a specific gravity of 3.1 g/cm 3 or less.

3 . The thermally conductive molded body according to claim 1 , having an Asker C hardness of 60 or less.

4 . The thermally conductive molded body according to claim 1 , wherein the amount of (C) the thermally conductive filler is an amount of 3500 to 6000 parts by mass.

5 . The thermally conductive molded body according to claim 1 , wherein the amount of magnesium oxide in the thermally conductive filler (C) is 20 to 40 wt %.

6 . The thermally conductive molded body according to claim 1 , wherein the thermally conductive filler (C) comprises at least one selected from aluminum oxide, aluminum nitride, boron nitride, zinc oxide and magnesium hydroxide.

7 . The thermally conductive molded body according to claim 5 , wherein the thermally conductive filler (C) comprises 20 to 70 wt % of aluminum oxide having a volume average particle diameter of 1 to 90 μm, relative to the total weight of component (C).

8 . The thermally conductive molded body according to claim 1 , the addition reaction catalyst (D) is a catalyst selected from the group consisting of elemental platinum group metals, platinum chlorides, chloroplatinic acid, chloroplatinic salts, alcohol-modified chloroplatinic acid, complexes of chloroplatinic acid with olefins, platinum group metals supported on a carrier selected from alumina, silica and carbon, rhodium-olefin complexes, and chlorotris(triphenylphosphine) rhodium.

9 . The thermally conductive molded body according to claim 1 , wherein the volume average particle diameter of the magnesium oxide is 50 to 120 μm.

10 . The thermally conductive molded body according to claim 1 , wherein the volume average particle diameter of the aluminum hydroxide is 1 to 50 μm.

11 . The thermally conductive molded body according to claim 1 , wherein the thermally conductive silicone resin composition further comprises 100 to 300 parts by mass of (F) a dimethylpolysiloxane represented by the following formula (1) and having a trialkoxysilyl group at one end of the molecular chain:

wherein R 5 is, independently of each other, an alkyl group having 1 to 6 carbon atoms and c is an integer of from 5 to 100.

12 . The thermally conductive molded body according to claim 1 , wherein the thermally conductive silicone resin composition further comprises 1 to 40 parts by mass of (G) an organopolysiloxane represented by the following general formula (2):

wherein R 6 is, independently of each other, a monovalent hydrocarbon group having 1 to 8 carbon atoms and no aliphatic unsaturated bond, and d is an integer of from 5 to 2000, and having a kinematic viscosity at 25° C. of 10 to 100,000 mm 2 /s.

13 . The thermally conductive molded body according to claim 1 , wherein the thermally conductive silicone resin composition has a viscosity at 25° C. from 50 Pa·s to 600 Pa·s.

14 . A thermally conductive silicone heat-dissipating sheet comprising a resin film and the thermally conductive molded body according to claim 1 .

15 . The thermally conductive silicone heat-dissipating sheet according to claim 14 , wherein the resin film has a thermal deformation temperature of 100° C. or more.

16 . The thermally conductive silicone heat-dissipating sheet according to claim 14 , wherein the thermally conductive molded body has a specific gravity of 3.1 g/cm 3 or less.

17 . The thermally conductive silicone heat-dissipating sheet according to claim 14 , wherein the thermally conductive molded body has an Asker C hardness of 60 or less.

18 . The thermally conductive silicone heat-dissipating sheet according to claim 14 , wherein the resin film is selected from a PET film and a PBT polycarbonate film.

19 . The thermally conductive silicone heat-dissipating sheet according to claim 14 , wherein the resin film is a PET film.

Assignees

• Shinetsu Chemical Co

Inventors

• Ito Takanori
• Endo Akihiro
• Tsukada Junichi

Classifications

• C08K2201/005

  Additives being defined by their particle size in general · CPC title

• C08K2201/001

  Conductive additives · CPC title

• C08K2003/2227

  of aluminium · CPC title

• C08K2003/222

  Magnesia, i.e. magnesium oxide · CPC title

• C08K3/22

  of metals · CPC title