Apparatus for manufacturing display device and method for manufacturing display device

Patent metadata

Field	Value
Publication number	US-2026061521-A1
Application number	US-202519216126-A
Country	US
Kind code	A1
Filing date	May 22, 2025
Priority date	Sep 5, 2024
Publication date	Mar 5, 2026
Grant date	—

Abstract

An apparatus for manufacturing a display device includes a stage, a processing laser unit which generates a first laser toward the stage, a flatness sensing unit which generates a second laser toward the stage, a common optical system disposed in optical paths of the first laser and the second laser, and a thickness sensing unit which generates a third laser toward the stage, where the common optical system includes an objective lens through which both the first laser and the second laser pass.

First claim

What is claimed is:

1 . An apparatus for manufacturing a display device, comprising:
a stage; a processing laser unit which generates a first laser toward the stage; a flatness sensing unit which generates a second laser toward the stage; a common optical system disposed in optical paths of the first laser and the second laser; and a thickness sensing unit which generates a third laser toward the stage, wherein the common optical system comprises an objective lens through which both the first laser and the second laser pass.

2 . The apparatus of claim 1 , wherein the common optical system further comprises a beam splitter which transmits at least a portion of each of the first laser and the second laser and reflects another portion of each of the first laser and the second laser,
the processing laser unit is disposed on one side of a first surface of the beam splitter, and the flatness sensing unit is disposed on one side of a second surface of the beam splitter, which is different from the first surface thereof.

3 . The apparatus of claim 2 , wherein a direction in which the first laser is incident on the beam splitter is different from a direction in which the second laser is incident on the beam splitter.

4 . The apparatus of claim 2 , wherein the objective lens is disposed on one side of a third surface of the beam splitter, which is different from the first surface and the second surface thereof.

5 . The apparatus of claim 2 , wherein the beam splitter causes the first laser and the second laser, which are incident from different directions, to be emitted in a same direction.

6 . The apparatus of claim 5 , wherein the common optical system further comprises a beam dump which absorbs at least a portion of the first laser and the second laser, and
the beam dump is disposed on one side of a fourth surface of the beam splitter, which is different from the first to third surfaces thereof.

7 . The apparatus of claim 2 , wherein the beam splitter comprises a prism or a half mirror.

8 . The apparatus of claim 1 , wherein the common optical system further comprises an objective driver which provides a driving force to the objective lens.

9 . The apparatus of claim 8 , wherein the objective driver moves the objective lens to adjust focal positions of the first laser and the second laser.

10 . The apparatus of claim 1 , wherein a separation distance between a focal position of the first laser and a focal position of the second laser is less than or equal to about 50 μm.

11 . The apparatus of claim 1 , wherein a focal position of the second laser is located on a top surface of the stage.

12 . The apparatus of claim 1 , wherein a focal position of the third laser is located on top and bottom surfaces of a target object.

13 . The apparatus of claim 1 , wherein the flatness sensing unit comprises an autofocus sensor.

14 . The apparatus of claim 1 , wherein the thickness sensing unit comprises a confocal sensor.

15 . The apparatus of claim 1 , wherein a wavelength of the first laser is greater than a wavelength of the second laser.

16 . A method for manufacturing a display device, the method comprising:
measuring a thickness of a mother substrate by irradiating top and bottom surfaces of the mother substrate with a first sensing laser; measuring flatness of the mother substrate by irradiating the bottom surface of the mother substrate with a second sensing laser; correcting a focal position of a processing laser by adjusting a position of an optical system based on the measured thickness and flatness of the mother substrate; and forming a cutting line by irradiating the mother substrate with the processing laser, wherein the measuring the flatness, the correcting the focal position of the processing laser, and the forming the cutting line are performed simultaneously.

17 . The method of claim 16 , wherein both the second sensing laser and the processing laser pass through the optical system.

18 . The method of claim 16 , wherein the measuring the flatness and the correcting the focal position of the processing laser comprise tracking, by the second sensing laser, a curvature of the bottom surface of the mother substrate in real time to adjust a position of the optical system, and
the focal position of the processing laser is adjusted together with the position of the optical system.

19 . The method of claim 16 , wherein the focal position of the processing laser is synchronized with a focal position of the second sensing laser through the optical system,
the position of the optical system is corrected based on a change in the focal position of the second sensing laser, and the focal position of the processing laser is corrected together with a correction of the position of the optical system.

20 . An electronic device comprising a display device,
wherein the display device comprising: a stage; a processing laser unit which generates a first laser toward the stage; a flatness sensing unit which generates a second laser toward the stage; a common optical system disposed in optical paths of the first laser and the second laser; and a thickness sensing unit which generates a third laser toward the stage, and wherein the common optical system comprises an objective lens through which both the first laser and the second laser pass.

Assignees

• Samsung Display Co Ltd

Inventors

• Kim Kyu Bum
• Ryu Je Yun
• Kim Jeong Su
• Park Hyun Sung
• Lim Yeon Su
• Chang Jin Won
• Jang Ho Jin
• Joo Chu Jong

Classifications

• B23K26/046

  Automatically focusing the laser beam · CPC title

• B23K26/53

  for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks · CPC title

• B23K26/032

  using optical means · CPC title

• B23K26/36 Primary

  Removing material (B23K26/55, B23K26/57 take precedence) · CPC title

• H10K59/1201

  Manufacture or treatment · CPC title