Display module

Patent metadata

Field	Value
Publication number	US-2026047324-A1
Application number	US-202519028041-A
Country	US
Kind code	A1
Filing date	Jan 17, 2025
Priority date	Aug 7, 2024
Publication date	Feb 12, 2026
Grant date	—

Abstract

A display module may include a heat sink having an accommodation recess, a display disposed within the accommodation recess, a cover glass disposed on the heat sink and vertically overlapping at least a portion of the display, and a substrate extending from the accommodation recess to an outside of the heat sink, and having at least a portion disposed on the display to be electrically connected to the display.

First claim

What is claimed is:

1 . A display module, comprising:
a heat sink having an accommodation recess; a display disposed within the accommodation recess; a cover glass disposed on the heat sink and vertically overlapping at least a portion of the display; and a substrate extending from the accommodation recess to an outside of the heat sink, at least a portion of which is disposed on the display to be electrically connected to the display.

2 . The display module of claim 1 , further comprising an adhesive layer disposed between the heat sink and the cover glass.

3 . The display module of claim 2 , wherein the adhesive layer extends between the substrate and the heat sink and between the substrate and the cover glass.

4 . The display module of claim 2 , wherein the adhesive layer is in contact with an edge region of the heat sink and an edge region of the cover glass.

5 . The display module of claim 2 , wherein the adhesive layer comprises an epoxy resin.

6 . The display module of claim 1 , further comprising a heat dissipation layer disposed on at least one of an upper surface and a lower surface of the substrate, and comprising a metal tape.

7 . The display module of claim 6 , wherein the heat dissipation layer further comprises a protection film disposed on the metal tape.

8 . The display module of claim 1 , further comprising an anisotropic conductive film disposed between the display and the substrate.

9 . The display module of claim 1 , wherein the display comprises a lens disposed at an uppermost portion of the display.

10 . The display module of claim 1 , further comprising a thermal interface material disposed between a bottom surface of the accommodation recess and the display.

11 . The display module of claim 1 , wherein the display is spaced apart from a wall surface of the accommodation recess.

12 . The display module of claim 1 , wherein the display comprises a semiconductor substrate.

13 . A display module, comprising:
a heat sink having an accommodation recess; a display disposed within the accommodation recess and comprising a semiconductor substrate comprising a backplane, and a frontplane disposed on the backplane and comprising an LED chip and a lens disposed on the LED chip; a cover glass disposed on the heat sink and vertically overlapping at least a portion of the display; and a substrate extending from the accommodation recess to an outside of the heat sink and electrically connected to the backplane.

14 . The display module of claim 13 , further comprising an adhesive layer disposed between the heat sink and the cover glass.

15 . The display module of claim 13 , further comprising a heat dissipation layer disposed on at least one of an upper surface and a lower surface of the substrate, and comprising a metal tape.

16 . A display module, comprising:
a heat sink having an accommodation recess; a display disposed within the accommodation recess and comprising a semiconductor substrate comprising a backplane, and a frontplane disposed on the backplane and comprising an organic light-emitting layer and a lens disposed on the organic light-emitting layer; a cover glass disposed on the heat sink and covering at least a portion of the display; and a substrate extending from the accommodation recess to an outside of the heat sink and electrically connected to the backplane.

17 . The display module of claim 16 , wherein:
the organic light-emitting layer is configured to emit a white light; and the frontplane further comprises a color filter disposed between the organic light-emitting layer and the lens.

18 . The display module of claim 16 , wherein the organic light-emitting layer is configured to emit red, green, and blue lights.

19 . The display module of claim 16 , further comprising an adhesive layer disposed between the heat sink and the cover glass.

20 . The display module of claim 16 , further comprising a heat dissipation layer disposed on at least one of an upper surface and a lower surface of the substrate, and comprising a metal tape.

Assignees

• Samsung Electronics Co Ltd

Inventors

• Kim Sounguk
• Choi Yun Seok
• Yoo YongMin
• Han Insik
• Song Jikho
• Choi Inho

Classifications

• H10K59/8794 Primary

  Arrangements for heating and cooling · CPC title

• H10K59/879 Primary

  comprising refractive means, e.g. lenses · CPC title

• H10K59/87

  Passivation; Containers; Encapsulations · CPC title

• G02B27/017

  Head mounted · CPC title

• H05K7/20963 Primary

  Heat transfer by conduction from internal heat source to heat radiating structure (H05K7/20972 takes precedence) · CPC title