Divided active electromagnetic interference filter module and manufacturing method thereof

Patent metadata

Field	Value
Publication number	US-2026045926-A1
Application number	US-202519366739-A
Country	US
Kind code	A1
Filing date	Oct 23, 2025
Priority date	Mar 28, 2019
Publication date	Feb 12, 2026
Grant date	—

Abstract

An active compensation device including a first element group including an integrated sensing/compensation unit configured to generate a sensing signal corresponding to at least one of common-mode noise and differential-mode noise on at least two high-current paths, and a second element group including a compensation control unit including a negative impedance converter and configured to generate a compensation signal corresponding to the sensing signal and provide the compensation signal to the integrated sensing/compensation unit. The compensation control unit further including a stabilization unit configured to prevent oscillation caused by the sensed noise. The first element group and the second element group are mounted on a single substrate.

First claim

What is claimed is:

1 . An active compensation device comprising:
a first element group comprising an integrated sensing/compensation unit configured to generate a sensing signal corresponding to at least one of common-mode noise and differential-mode noise on at least two high-current paths; and a second element group comprising a compensation control unit comprising a negative impedance converter and configured to generate a compensation signal corresponding to the sensing signal and provide the compensation signal to the integrated sensing/compensation unit, the compensation control unit further comprising a stabilization unit configured to prevent oscillation caused by the sensed noise, wherein the first element group and the second element group are mounted on a single substrate.

2 . The active compensation device of claim 1 , wherein:
the substrate comprises one surface and another surface opposite to the one surface; the first element group is arranged on the one surface of the substrate; and the second element group is arranged on the other surface of the substrate.

3 . The active compensation device of claim 1 , wherein:
the substrate comprises one surface and another surface opposite to the one surface; the first element group is arranged on the one surface of the substrate; and the second element group is arranged in a space of the one surface of the substrate where the first element group is not arranged.

4 . The active compensation device of claim 1 , wherein:
the first element group comprises a plurality of integrated sensing/compensation units; the second element group comprises a plurality of compensation control units; and the plurality of compensation control units are implemented as a single integrated circuit chip.

5 . The active compensation device of claim 4 , wherein:
the substrate comprises one surface and another surface opposite to the one surface; the first element group is arranged on the one surface of the substrate; and the second element group is arranged on the other surface of the substrate.

6 . The active compensation device of claim 1 , wherein:
the integrated sensing/compensation unit comprises a choke coil comprising:
a conductor comprising a through hole;
at least two high-current path windings passing through at least the through hole and connected to each of the at least two high-current paths; and
a sensing/compensation winding insulated from the at least two high-current paths and passing through at least the through hole; and
the at least two high-current path windings are asymmetrically wound around the conductor, respectively.

7 . The active compensation device of claim 6 , wherein:
the integrated sensing/compensation unit is further configured to provide the sensing signal corresponding to the noise to the compensation control unit through the sensing/compensation winding; and the compensation control unit is further configured to provide the compensation signal to the integrated sensing/compensation unit through the sensing/compensation winding.

8 . The active compensation device of claim 6 , wherein:
the choke coil comprises:
a primary side on which the at least two high-current path windings are arranged; and
a secondary side on which the sensing/compensation winding is arranged; and
a voltage induced on the secondary side is generated as the sensing signal, based on a magnetic field induced by noise on the primary side.

9 . The active compensation device of claim 6 , wherein the at least two high-current path windings have different numbers of turns, respectively.

10 . The active compensation device of claim 6 , wherein the at least two high-current path windings have different degrees of winding density, respectively.

11 . The active compensation device of claim 6 , wherein the at least two high-current path windings have different winding angles, respectively.

12 . The active compensation device of claim 6 , wherein the at least two high-current path windings are different from each other in overlap winding.

13 . The active compensation device of claim 6 , wherein at least one of the at least two high-current path windings has a different number of overlaps when overlapped.

14 . The active compensation device of claim 1 , wherein:
the at least two high-current paths are provided on the substrate; the integrated sensing/compensation unit is connected to the at least two high-current paths; and the compensation control unit is insulated from the at least two high-current paths.

15 . The active compensation device of claim 1 , wherein:
the compensation control unit further comprises:
an amplification unit configured to generate an amplified signal corresponding to the sensing signal; and
a target unit configured to generate the compensation signal corresponding to the amplified signal;
the stabilization unit is connected to the target unit; and a magnitude of impedance of the target unit and the stabilization unit is greater than a magnitude of total input impedance viewed from the compensation control unit toward the integrated sensing/compensation unit.

16 . The active compensation device of claim 1 , wherein the compensation control unit comprises at least one amplifier, and the at least one amplifier is implemented as a single integrated chip.

Assignees

• Em Coretech Inc
• Ulsan Nat Inst Science & Tech Unist

Inventors

• Kim Jin Gook
• Jeong Sang Yeong
• Kwon Jeong Bin

Classifications

• H03H7/427

  Common-mode filters (H02J3/01 and H02M1/126 takes precedence) · CPC title

• H05K2201/1006

  Non-printed filter · CPC title

• H03H1/0007 Primary

  of radio frequency interference filters · CPC title

• H05K1/14

  Structural association of two or more printed circuits (providing electric connection to or between printed circuits H05K1/11, H01R12/00) · CPC title