Display device

Patent metadata

Field	Value
Publication number	US-2026033073-A1
Application number	US-202519092274-A
Country	US
Kind code	A1
Filing date	Mar 27, 2025
Priority date	Jul 25, 2024
Publication date	Jan 29, 2026
Grant date	—

Abstract

Disclosed is a display device including a micro light-emitting element. The display device includes: a substrate; a driving chip disposed on the substrate; a protective layer disposed on the substrate so as to surround the driving chip; an insulating layer disposed on the driving chip and the protective layer; a bank layer disposed on the insulating layer, wherein the bank layer has a first receiving groove and a second receiving groove defined therein and adjacent to each other; a light-emitting element disposed in the first receiving groove or the second receiving groove; and an optical insulating layer covering the first receiving groove, the second receiving groove, and the bank layer.

First claim

1 . A display device comprising:
a substrate; a driving chip disposed on the substrate; a protective layer disposed on the substrate and adjacent to the driving chip; an insulating layer disposed on the driving chip and the protective layer; a bank layer disposed on the insulating layer, the bank layer having a first receiving groove and a second receiving groove defined therein and adjacent to each other; a light-emitting element disposed in either the first receiving groove or the second receiving groove; and an optical insulating layer covering the first receiving groove, the second receiving groove, and the bank layer.

2 . The display device of claim 1 , further comprising a connection line, wherein the light-emitting element is electrically connected to the driving chip through the connection line disposed along a sidewall of the bank layer.

3 . The display device of claim 1 , further comprising a solder pattern, wherein in each of the first receiving groove and the second receiving groove, a first electrode is disposed on a bottom surface of each of the first receiving groove and the second receiving groove, and the solder pattern is disposed on the first electrode.

4 . The display device of claim 3 , wherein the light-emitting element is bonded to the first electrode through the solder pattern.

5 . The display device of claim 3 , wherein the first electrode includes a plurality of conductive layers.

6 . The display device of claim 5 , wherein the plurality of conductive layers includes:
a first conductive layer disposed on either the bottom surface of the first receiving groove or the bottom surface of the second receiving groove; a second conductive layer disposed on the first conductive layer; a third conductive layer disposed on the second conductive layer; and a fourth conductive layer disposed on the third conductive layer.

7 . The display device of claim 6 , wherein each of the first conductive layer, the second conductive layer, the third conductive layer, and the fourth conductive layer is made of titanium, molybdenum, aluminum, or titanium and indium tin oxide.

8 . The display device of claim 6 , wherein the second conductive layer includes a reflective material.

9 . The display device of claim 8 , wherein the second conductive layer is a reflector including the reflective material, and
wherein a portion of each of the third conductive layer and the fourth conductive layer is removed or etched to expose an upper surface of the second conductive layer.

10 . The display device of claim 6 , wherein each of the first conductive layer and the third conductive layer includes titanium or molybdenum,
wherein the second conductive layer includes aluminum, and wherein the fourth conductive layer is adhered to the solder pattern and includes indium tin oxide or indium zinc oxide.

11 . The display device of claim 1 , wherein the light-emitting element includes a micro light-emitting element.

12 . The display device of claim 11 , wherein the micro light-emitting element has a vertical structure.

13 . The display device of claim 3 , wherein the light-emitting element is electrically connected to the first electrode by eutectic bonding of the solder pattern.

14 . The display device of claim 13 , wherein the light-emitting element includes:
an anode electrode disposed on the solder pattern; a first semiconductor layer disposed on the anode electrode; an active layer disposed on the first semiconductor layer; a second semiconductor layer disposed on the active layer; a cathode electrode disposed on the second semiconductor layer; and an encapsulation film disposed on at least a portion of each of the first semiconductor layer, the active layer, the second semiconductor layer, the anode electrode, and the cathode electrode.

15 . The display device of claim 14 , wherein the first semiconductor layer and the second semiconductor layer include a nitride semiconductor containing n-type impurities and a nitride semiconductor containing p-type impurities, respectively.

16 . The display device of claim 14 , wherein the encapsulation film surrounds at least a portion of the first semiconductor layer, at least a portion of the active layer, at least a portion of the second semiconductor layer, at least a portion of the anode electrode, and at least a portion of the cathode electrode.

17 . The display device of claim 14 , wherein the solder pattern includes indium (In) and the anode electrode of the light-emitting element includes gold (Au),
wherein heat and pressure are applied to the solder pattern and the anode electrode in a transfer process of the light-emitting element such that the solder pattern and the anode electrode are bonded to each other by the eutectic bonding, so that the light-emitting element is bonded to the first electrode through the solder pattern.

18 . The display device of claim 1 , wherein the substrate includes a display area, a bending area, a first non-display area, and a second non-display area,
wherein the optical insulating layer includes:
a first optical layer disposed on the display area and surrounds the light-emitting element and covers the bank layer; and
a second optical layer disposed on the display area and surrounds the first optical layer.

19 . A display device comprising:
a substrate including a display area and a non-display area; a driving chip disposed on the substrate; an insulating layer disposed on the substrate and adjacent to the driving chip; a light-emitting element electrically connected to the driving chip; a bank layer disposed on the insulating layer, the bank layer having a first receiving groove and a second receiving groove defined therein; and a first optical layer disposed to cover the first receiving groove, the second receiving groove, and the bank layer and to surround the light-emitting element, wherein the light-emitting element is received in either the first receiving groove or the second receiving groove, and wherein the first optical layer is disposed on the first receiving groove and the second receiving groove and covers an entirety of the bank layer.

20 . The display device of claim 19 , further comprising a connection line, wherein the light-emitting element is electrically connected to the driving chip via the connection line extending through the insulating layer.

21 . The display device of claim 19 , wherein the first receiving groove is defined between a first partition wall at one side end of the bank layer and a second partition wall at a center of the bank layer, and
wherein the second receiving groove is defined between the second partition wall at the center of the bank layer and a third partition wall at the other side end of the bank layer.

22 . The display device of claim 19 , wherein each of the first receiving groove and the second receiving groove has a vertical dimension smaller than a vertical dimension of the light-emitting element.

23 . The display device of claim 19 , wherein the display device further comprises:
a second optical layer disposed to surround the first optical layer; a first electrode disposed on a bottom surface of each of the first receiving groove and the second receiving groove; a second electrode disposed on the light-emitting element, the first optical layer, and the second optical layer; a third optical layer disposed on the second electrode; and a black matrix dispose

Assignees

• Lg Display Co Ltd

Inventors

• Kim Jinmo
• Lee Jongwon
• Hong Seungwoo
• Kim Woosub
• Park Hyoungsun

Classifications

• H01L25/0753

  Electricity · mapped topic

• H10H29/8552

  Light absorbing arrangements, e.g. black matrix · CPC title

• H10H29/8325

  Reflective materials · CPC title

• H10H29/37 Primary

  Pixel-defining structures, e.g. banks between the LEDs · CPC title

• H10H29/49 Primary

  Interconnections, e.g. wiring lines or terminals (connection of the pixel electrodes to the driving transistors H10H29/39) · CPC title