Liquid-cooling cooler for power module of electric vehicle

Patent metadata

Field	Value
Publication number	US-2026020185-A1
Application number	US-202418769340-A
Country	US
Kind code	A1
Filing date	Jul 10, 2024
Priority date	Jul 10, 2024
Publication date	Jan 15, 2026
Grant date	—

Abstract

A liquid-cooling cooler for an electric vehicle power module includes a liquid-cooling plate and a plurality of fin regions. A first rectangular region formed by outward extension of four sides of a projection of a heat source is defined as a heat source fin region among the plurality of fin regions. A second rectangular region extending outward from the heat source fin region in a counter flow direction of the coolant is defined as an upstream fin region. A third rectangular region extending outward from the heat source fin region in a flow direction of the coolant is defined as a downstream fin region. A fin density of the heat source fin region is greater than that of the downstream fin region, and the fin density of the downstream fin region is greater than or equal to that of the upstream fin region.

First claim

What is claimed is:

1 . A liquid-cooling cooler for an electric vehicle power module, comprising:
a liquid-cooling plate having a first heat dissipation surface and a second heat dissipation surface that are opposite to each other, wherein the first heat dissipation surface is configured to be in contact with a coolant, and the second heat dissipation surface is configured to be in contact with a plurality of heat sources of the electric vehicle power module; and a plurality of fin regions being located on the first heat dissipation surface; wherein a first rectangular region formed by outward extension of four sides of a projection of the heat source is defined as a heat source fin region among the plurality of fin regions; wherein a second rectangular region being of same size as the heat source fin region and extending outward from the heat source fin region in a counter flow direction of the coolant, is defined as an upstream fin region among the plurality of fin regions; wherein a third rectangular region being of same size as the heat source fin region and extending outward from the heat source fin region in a flow direction of the coolant, is defined as a downstream fin region among the plurality of fin regions; wherein a fin density of the heat source fin region is greater than a fin density of the downstream fin region, and the fin density of the downstream fin region is greater than or equal to a fin density of the upstream fin region.

2 . The liquid-cooling cooler according to claim 1 , wherein each of the plurality of heat sources is formed of a chip, and the first rectangular region formed by extending at least 1 mm outward from the four sides of the projection of the chip is defined as the heat source fin region.

3 . The liquid-cooling cooler according to claim 1 , wherein each of the plurality of heat sources is formed of two or more chips, and the first rectangular region formed by extending at least 1 mm outward from the four sides of the projection of a smallest rectangle enclosing the two or more chips is defined as the heat source fin region.

4 . The liquid-cooling cooler according to claim 1 , wherein the fin density of each of the fin regions is defined, in each of the fin regions, as a total surface area of fins being divided by a total fin projection area.

5 . The liquid-cooling cooler according to claim 1 , wherein the liquid-cooling plate and a plurality of fins of the fin regions are formed by metal injection molding, forging, or stamping.

6 . The liquid-cooling cooler according to claim 1 , wherein the liquid-cooling plate and a plurality of fins of the fin regions are made of copper, copper alloy, aluminum, or aluminum alloy.

7 . The liquid-cooling cooler according to claim 1 , wherein a fin density ratio of the heat source fin region to the downstream fin region is configured to be from 1 to 1.3.

8 . The liquid-cooling cooler according to claim 1 , wherein a fin density ratio of the heat source fin region to the upstream fin region is configured to be from 1.2 to 1.5.

9 . The liquid-cooling cooler according to claim 1 , wherein a fin density ratio of the downstream fin region to the upstream fin region is configured to be from 1 to 1.5.

10 . A liquid-cooling cooler for an electric vehicle power module, comprising:
a liquid-cooling plate having a first heat dissipation surface and a second heat dissipation surface that are opposite to each other, wherein the first heat dissipation surface is configured to be in contact with a coolant, and the second heat dissipation surface is configured to be in contact with a plurality of heat sources of the electric vehicle power module; and a plurality of fin regions being located on the first heat dissipation surface; wherein a first rectangular region formed by outward extension of four sides of a projection of the heat source is defined as a heat source fin region among the plurality of fin regions; wherein a second rectangular region being of same size as the heat source fin region and extending outward from the heat source fin region in a counter flow direction of the coolant, is defined as an upstream fin region among the plurality of fin regions; wherein a third rectangular region being of same size as the heat source fin region and extending outward from the heat source fin region in a flow direction of the coolant, is defined as a downstream fin region among the plurality of fin regions; wherein a fin density of the heat source fin region is greater than or equal to a fin density of the downstream fin region, and the fin density of the downstream fin region is greater than a fin density of the upstream fin region.

11 . The liquid-cooling cooler according to claim 10 , wherein each of the plurality of heat sources is formed of a chip, and the first rectangular region formed by extending at least 1 mm outward from the four sides of the projection of the chip is defined as the heat source fin region.

12 . The liquid-cooling cooler according to claim 10 , wherein each of the plurality of heat sources is formed of two or more chips, and the first rectangular region formed by extending at least 1 mm outward from the four sides of the projection of a smallest rectangle enclosing the two or more chips is defined as the heat source fin region.

13 . The liquid-cooling cooler according to claim 10 , wherein the fin density of each of the fin regions is defined, in each of the fin regions, as a total surface area of fins being divided by a total fin projection area.

14 . The liquid-cooling cooler according to claim 10 , wherein the liquid-cooling plate and a plurality of fins of the fin regions are formed by metal injection molding, forging, or stamping.

15 . The liquid-cooling cooler according to claim 10 , wherein the liquid-cooling plate and a plurality of fins of the fin regions are made of copper, copper alloy, aluminum, or aluminum alloy.

16 . The liquid-cooling cooler according to claim 10 , wherein a fin density ratio of the heat source fin region to the downstream fin region is configured to be from 1 to 1.3.

17 . The liquid-cooling cooler according to claim 10 , wherein a fin density ratio of the heat source fin region to the upstream fin region is configured to be from 1.2 to 1.5.

18 . The liquid-cooling cooler according to claim 10 , wherein a fin density ratio of the downstream fin region to the upstream fin region is configured to be from 1 to 1.5.

Assignees

• Amulaire Thermal Tech Inc

Inventors

• Yang Ching-Ming
• Lee Kuo-Wei
• Yeh Tze-Yang
• Wu Chien-Cheng
• Wu Chun-Lung
• Huang Yi-Hsin
• Chang Ming-Hsuan

Classifications

• H05K7/20254 Primary

  Cold plates transferring heat from heat source to coolant · CPC title

• H05K7/20927

  Liquid coolant without phase change · CPC title

• H05K7/20263 Primary

  Heat dissipaters releasing heat from coolant · CPC title