Resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminate, and wiring board

Patent metadata

Field	Value
Publication number	US-2026002021-A1
Application number	US-202319105266-A
Country	US
Kind code	A1
Filing date	Aug 8, 2023
Priority date	Aug 26, 2022
Publication date	Jan 1, 2026
Grant date	—

Abstract

A resin composition contains a polyphenylene ether compound (A), a reactive compound (B) having an unsaturated double bond in a molecule, and at least one additive (C) selected from the group consisting of a heavy metal deactivator (C1) having at least one of an amino group and a triazole structure and a phenolic hydroxyl group in a molecule, a phosphite-based antioxidant (C2) having a tertiary butyl group and a phosphite structure in a molecule, and a hindered phenol-based antioxidant (C3) having a tertiary butyl group and a phenolic hydroxyl group in a molecule.

First claim

1 . A resin composition comprising:
a polyphenylene ether compound (A); a reactive compound (B) having an unsaturated double bond in a molecule; and at least one additive (C) selected from the group consisting of a heavy metal deactivator (C1) having at least one of an amino group and a triazole structure and a phenolic hydroxyl group in a molecule, a phosphite-based antioxidant (C2) having a tertiary butyl group and a phosphite structure in a molecule, and a hindered phenol-based antioxidant (C3) having a tertiary butyl group and a phenolic hydroxyl group in a molecule.

2 . The resin composition according to claim 1 , wherein the polyphenylene ether compound (A) includes at least one of a polyphenylene ether compound (A1) having at least one selected from the group consisting of a hydroxyl group, a carboxyl group, an unsaturated double bond group, and an ester bond in a molecule or a preliminary reaction product (A2) obtained by previously reacting a mixture containing a polyphenylene ether compound (a2-1) having at least one selected from the group consisting of a hydroxyl group, a carboxyl group, and an ester bond in a molecule and a compound (a2-2) that reacts with at least one of a hydroxyl group, a carboxyl group, and an ester bond.

3 . The resin composition according to claim 2 , wherein the preliminary reaction product (A2) includes a preliminary reaction product obtained by previously reacting a polyphenylene ether compound having a hydroxyl group in a molecule and an acid anhydride having an acid anhydride group in a molecule.

4 . The resin composition according to claim 1 , wherein the reactive compound (B) includes at least one selected from the group consisting of an allyl compound, an acrylate compound, a methacrylate compound, a polybutadiene compound, a styrene compound, and a maleimide compound.

5 . The resin composition according to claim 1 , wherein a content of the polyphenylene ether compound (A) is 20 to 80 parts by mass with respect to 100 parts by mass of a sum of the polyphenylene ether compound (A) and the reactive compound (B).

6 . The resin composition according to claim 1 , further comprising a benzoxazine compound (D).

7 . The resin composition according to claim 1 , comprising at least one of the phosphite-based antioxidant (C2) and the hindered phenol-based antioxidant (C3) and the heavy metal deactivator (C1) as the additive (C).

8 . The resin composition according to claim 1 , further comprising an inorganic filler.

9 . The resin composition according to claim 8 , wherein the inorganic filler is subjected to surface treatment with a silane coupling agent.

10 . A prepreg comprising:
the resin composition according to claim 1 or a semi-cured product of the resin composition; and a fibrous base material.

11 . A film with resin comprising:
a resin layer containing the resin composition according to claim 1 or a semi-cured product of the resin composition; and a support film.

12 . A metal foil with resin comprising:
a resin layer containing the resin composition according to claim 1 or a semi-cured product of the resin composition; and a metal foil.

13 . A metal-clad laminate comprising:
an insulating layer containing a cured product of the resin composition according to claim 1 ; and a metal foil.

14 . A metal-clad laminate comprising:
an insulating layer containing a cured product of the prepreg according to claim 10 ; and a metal foil.

15 . A wiring board comprising:
an insulating layer containing a cured product of the resin composition according to claim 1 ; and a wiring.

16 . A wiring board comprising:
an insulating layer containing a cured product of the prepreg according to claim 10 ; and a wiring.

Assignees

• Panasonic Ip Man Co Ltd

Inventors

• Ogushi Hajime
• Hirono Hayate
• Mito Takatoshi
• Isaji Koichi
• Fujisawa Hiroyuki

Classifications

• H05K1/0366

  reinforced, e.g. by fibres, fabrics (H05K1/036 takes precedence) · CPC title

• C08L2203/20

  use in electrical or conductive gadgets · CPC title

• C08L2201/08

  Stabilised against heat, light or radiation or oxydation · CPC title

• C08K13/06

  Pretreated ingredients and ingredients covered by the main groups C08K3/00 - C08K7/00 · CPC title

• C08K9/06

  with silicon-containing compounds · CPC title