Multi-channel light receiving/transmitting assembly and optical module

Patent metadata

Field	Value
Publication number	US-2025389914-A1
Application number	US-202318880463-A
Country	US
Kind code	A1
Filing date	Jun 6, 2023
Priority date	Jul 1, 2022
Publication date	Dec 25, 2025
Grant date	—

Abstract

A multi-channel light receiving/transmitting assembly and an optical module. The multi-channel light receiving/transmitting assembly comprises a base ( 310 ), a conductive substrate, a light transmitting assembly, and a light receiving assembly; the conductive substrate is at least partially connected with the base ( 310 ); the light transmitting assembly is used for transmitting an optical signal, and the light transmitting assembly comprises at least two laser chips ( 510 ), wherein the laser chips ( 510 ) are arranged on the base ( 310 ) in parallel in a first direction (X) and are respectively electrically connected with the conductive substrate; the light receiving assembly is used for receiving an externally inputted optical signal, and the light receiving assembly comprises at least two light receiving chips ( 610 ), wherein the light receiving chips ( 610 ) are arranged on the conductive substrate in parallel in the first direction (X) and are respectively electrically connected with the conductive substrate; the light transmitting assembly and the light receiving assembly are staggered in a second direction (Y), the second direction (Y) is perpendicular to the first direction (X), and the second direction (Y) and the first direction (X) are both parallel to the upper surface of the base ( 310 ), so as to solve the technical problem of difficulty in expanding more channels due to the fact that a device of a traditional light transmitting assembly occupies a relatively large space.

First claim

1 . A multi-channel optical transceiver assembly, comprising:
a base ( 310 ); a conductive substrate, at least partially overlapping the base ( 310 ); an optical-transmitting assembly, configured to emit optical signals, wherein the optical-transmitting assembly comprises at least two laser chips ( 510 ), the at least two laser chips ( 510 ) are arranged side by side on the base ( 310 ) along a first direction (X) and electrically connected to the conductive substrate respectively; and an optical-receiving assembly, configured to receive optical signals input from outside, wherein the optical-receiving assembly comprises at least two optical-receiving chips ( 610 ), and the at least two optical-receiving chips ( 610 ) are arranged side by side on the conductive substrate along the first direction (X) and electrically connected to the conductive substrate respectively; wherein, the optical-transmitting assembly and the optical-receiving assembly are arranged in a staggered manner along a second direction (Y), the second direction (Y) is perpendicular to the first direction (X), and both the first direction (X) and the second direction (Y) are parallel to the upper surface of the base ( 310 ).

2 . The multi-channel optical transceiver assembly according to claim 1 , wherein:
one end of the conductive substrate is adjacent to the laser chip ( 510 ) and provided with an transmitting-end electrical connection portion, and the transmitting-end electrical connection portion is electrically connected to the optical-transmitting assembly; the conductive substrate is further provided with a receiving-end electrical connection portion, the receiving-end electrical connection portion is electrically connected to the optical-receiving assembly, the optical-receiving chips and the receiving-end electrical connection portion are located on the conductive substrate and on a side of the transmitting-end electrical connection portion that is away from the laser chip ( 510 ).

3 . The multi-channel optical transceiver assembly according to claim 2 , wherein, the conductive substrate comprises:
a multilayer ceramic substrate ( 800 ) including a first end portion and a second end portion oppositely arranged, wherein the first end portion is overlapped to the base ( 310 ); wherein, the laser chips ( 510 ) and a optical-receiving chips ( 610 ) are both electrically connected to the first end portion.

4 . The multi-channel optical transceiver assembly according to claim 3 , wherein:
the first end portion comprises a first plane ( 810 ) and a step surface ( 840 ) lower than the first plane ( 810 ), the transmitting-end electrical connection portion is located on the step surface ( 840 ), and the optical-receiving chips ( 610 ) and the receiving-end electrical connection portion are located on the first plane ( 810 ).

5 . The multi-channel optical transceiver assembly according to claim 4 , wherein:
the second end portion comprises a second plane ( 820 ) and a third plane ( 830 ) disposed opposite to each other, the second plane ( 820 ) and the third plane ( 830 ) are respectively provided with conductive traces extending to the first end portion; wherein, the transmitting-end electrical connection portion and the receiving-end electrical connection portion are both electrically connected to the conductive traces of the second plane ( 820 ) and/or the conductive trace of the third plane ( 830 ); and the conductive substrate further comprises a main control circuit board ( 210 ), a first circuit board ( 220 ) and a second circuit board ( 230 ), wherein the main control circuit board ( 210 ) is electrically connected to the conductive traces of the second plane ( 820 ) and the conductive traces of the third plane ( 830 ) via the first circuit board ( 220 ) and the second circuit board ( 230 ), respectively.

6 . The multi-channel optical transceiver assembly according to claim 2 , wherein, the conductive substrate comprises:
a main control circuit board ( 210 ), wherein the receiving-end electrical connection portion is located on an upper surface of the main control circuit board ( 210 ); and an electrical adapter board ( 900 ), at least partially overlapping the base ( 310 ), wherein one end of the electrical adapter board ( 900 ) is adjacent to the laser chips ( 510 ) and the one end of the electrical adapter board ( 900 ) is provided with the transmitting-end electrical connection portion, and another end of the electrical adapter plate ( 900 ) is electrically connected to a lower surface of the main control circuit board ( 210 ).

7 . The multi-channel optical transceiver assembly according to claim 6 , wherein, the main control circuit board ( 210 ) comprises:
receiving-end signal lines disposed on the upper surface of the main control circuit board ( 210 ) and electrically connected to the receiving-end electrical connection portion; and transmitting-end signal lines disposed on a lower surface of the main control circuit board ( 210 ), wherein the transmitting-end electrical connection portion is provided on an upper surface of the electrical adapter board ( 900 ), the upper surface of another end of the electrical adapter board ( 900 ) is attached to the lower surface of the main control circuit board ( 210 ) and electrically connected to the transmitting-end signal lines to electrically connect the transmitting-end signal lines and the transmitting-end electrical connection portion.

8 . The multi-channel optical transceiver assembly according to claim 2 , wherein, the conductive substrate comprises:
a main control circuit board ( 210 ), wherein one end of the main control circuit board ( 210 ) is overlapped to the base ( 310 ), a step portion is provided at the one end of the main control circuit board ( 210 ), and the step portion is adjacent to the laser chips ( 510 ); wherein, an upper surface of the step portion is lower than the upper surface of the main control circuit board ( 210 ), the transmitting-end electrical connection portion is located on the upper surface of the step portion, and the optical-receiving chips ( 610 ) and the receiving-end electrical connection portion is located on the upper surface of the main control circuit board ( 210 ).

9 . The multi-channel optical transceiver assembly according to claim 1 , further comprising:
a first housing ( 300 ) including an optical window ( 320 ) and an electrical interface ( 330 ), wherein one end of a conductive base is overlapped to the base ( 310 ) in the first housing ( 300 ) and another end of the conductive base extends to the outside of the first housing ( 300 ) through the electrical interface ( 330 ).

10 . The multi-channel optical transceiver assembly according to claim 9 , further comprising:
a transmitting-end optical processing unit, configured to combine signal lights emitted by each of the laser chips ( 510 ); and a receiving-end optical processing unit, configured to demultiplex a composite signal light input from outside and output demultiplexed signal lights, and transmit the demultiplexed signal lights to each of the optical-receiving chips ( 610 ).

11 . The multi-channel optical transceiver assembly according to claim 10 , wherein:
the receiving-end optical processing unit is at least partially stacked on the transmitting-end optical processing unit.

12 . The multi-channel optical transceiver assembly according to claim 10 , further comprising:
a first fiber adapter ( 540 ) disposed at the optical window ( 320 ) of the first housing ( 300 ) and optical connected to the transmitting-end optical processing unit; and a second fiber adapter ( 630 ) disposed at the optical window ( 320

Assignees

• Innolight Tech Suzhou Ltd

Inventors

• Wang Zhenzhong
• Gu Jia
• Liu Shixin
• Chen Long

Classifications

• G02B6/4246

  Bidirectionally operating package structures · CPC title

• G02B6/4271

  with thermo electric cooling · CPC title

• G02B6/428 Primary

  containing printed circuit boards [PCB] · CPC title

• G02B6/42

  Coupling light guides with opto-electronic elements · CPC title

• H04B10/40 Primary

  Transceivers · CPC title