Forming device

US2025387822A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2025387822-A1
Application numberUS-202519311516-A
CountryUS
Kind codeA1
Filing dateAug 27, 2025
Priority dateMay 24, 2023
Publication dateDec 25, 2025
Grant date

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A forming device includes: a fluid supply unit that is disposed at an end portion of a metal pipe material and that supplies a fluid into the metal pipe material through an opening of the end portion; and a sealing mechanism that performs sealing against leakage of the fluid from the metal pipe material when the fluid is supplied by the fluid supply unit into the metal pipe material that is heated by a heating unit, in which the sealing mechanism performs the sealing by contact between the metal pipe material and a non-resin material, without applying an axial force to the metal pipe material.

First claim

Opening claim text (preview).

What is claimed is: 1 . A forming device comprising: a fluid supply unit that is disposed at an end portion of a metal pipe material and that supplies a fluid into the metal pipe material through an opening of the end portion; and a sealing mechanism that performs sealing against leakage of the fluid from the metal pipe material when the fluid is supplied by the fluid supply unit into the metal pipe material that is heated by a heating unit, wherein the sealing mechanism performs the sealing by contact between the metal pipe material and a non-resin material, without applying an axial force to the metal pipe material. 2 . The forming device according to claim 1 , wherein the fluid supply unit is disposed in an inner portion of the metal pipe material, and the sealing mechanism is disposed in at least one of the inner portion and an outer portion of the metal pipe material, and performs the sealing using a sealing surface moved by the sealing mechanism in a radial direction toward the metal pipe material when the fluid is supplied by the fluid supply unit. 3 . The forming device according to claim 2 , wherein the sealing mechanism includes a nozzle base member, a nozzle member that is provided on a front side of a shaft portion of the nozzle base member, a clamp mechanism that is provided on an outer peripheral portion of the nozzle member and that clamps the metal pipe material, and a hydraulic cylinder. 4 . The forming device according to claim 1 , further comprising: a holding unit for the sealing so that the metal pipe material does not buckle when the fluid is supplied by the fluid supply unit. 5 . The forming device according to claim 4 , further comprising: a forming die that forms a metal pipe from the metal pipe material and that includes a lower main die and an upper main die that are formed of a steel block. 6 . The forming device according to claim 5 , wherein the holding unit holds the metal pipe material disposed between the lower main die and the upper main die. 7 . The forming device according to claim 4 , wherein the holding unit includes a lower electrode and an upper electrode that interpose vicinities of end portions of the metal pipe material from an up-down direction. 8 . The forming device according to claim 5 , wherein the lower main die and the upper main die are provided with respective recessed portions in which the metal pipe material is accommodated, and in a state in which the lower main die and the upper main die are in close contact with each other, the respective recessed portions form a space having a target shape in which the metal pipe material is to be formed. 9 . The forming device according to claim 5 , further comprising: a drive mechanism that moves at least one of the lower main die and the upper main die. 10 . The forming device according to claim 9 , wherein the drive mechanism includes a slide that moves the upper main die so that the lower main die and the upper main die are joined together, a pull-back cylinder as an actuator that generates a force for pulling the slide upward, a main cylinder as a drive source that downward-pressurizes the slide, and a drive source that applies a driving force to the main cylinder. 11 . The forming device according to claim 5 , further comprising: a cooling unit that cools the forming die. 12 . The forming device according to claim 11 , wherein the cooling unit includes flow paths formed inside the lower main die and the upper main die, and a water circulation mechanism that supplies a cooling water to the flow paths and causes the cooling water to circulate through the flow paths. 13 . The forming device according to claim 9 , further comprising: a control unit that repeatedly performs an operation of forming the metal pipe material using the forming die. 14 . The forming device according to claim 13 , wherein the control unit closes the forming die by controlling the drive mechanism to lower the upper main die and bring the upper main die closer to the lower main die.

Assignees

Inventors

Classifications

  • B21D26/02Primary

    by applying fluid pressure · CPC title

  • Deforming tubular bodies (corrugating tubes by applying fluid pressure B21D15/03, B21D15/10) · CPC title

  • B21D26/045Primary

    Closing or sealing means · CPC title

  • Heating or cooling · CPC title

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Frequently asked questions

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What does patent US2025387822A1 cover?
A forming device includes: a fluid supply unit that is disposed at an end portion of a metal pipe material and that supplies a fluid into the metal pipe material through an opening of the end portion; and a sealing mechanism that performs sealing against leakage of the fluid from the metal pipe material when the fluid is supplied by the fluid supply unit into the metal pipe material that is hea…
Who is the assignee on this patent?
Sumitomo Heavy Industries
What technology area does this patent fall under?
Primary CPC classification B21D26/02. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Thu Dec 25 2025 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).