Bonding device and method of manufacturing display device using the same

Patent metadata

Field	Value
Publication number	US-2025381767-A1
Application number	US-202519079016-A
Country	US
Kind code	A1
Filing date	Mar 13, 2025
Priority date	Jun 13, 2024
Publication date	Dec 18, 2025
Grant date	—

Abstract

A bonding device includes: a pressure pad; a jig below the pressure pad; and a moving part below the jig, wherein the jig includes: a first jig; and a plurality of second jigs adjacent to the first jig, and wherein the moving part includes: a first moving part below the first jig; and a plurality of second moving parts respectively below the second jigs.

First claim

What is claimed is:

1 . A bonding device comprising:
a pressure pad; a jig below the pressure pad; and a moving part below the jig, wherein the jig comprises: a first jig; and a plurality of second jigs adjacent to the first jig, and wherein the moving part comprises: a first moving part below the first jig; and a plurality of second moving parts respectively below the second jigs.

2 . The bonding device of claim 1 , wherein the plurality of second jigs respectively define corners of the jig.

3 . The bonding device of claim 2 , wherein, in a plan view, the second moving parts respectively overlap the corners of the second jigs that define the corners of the jig.

4 . The bonding device of claim 1 , wherein, in a plan view, the first moving part overlaps a central portion of the first jig.

5 . The bonding device of claim 1 , wherein the second moving parts move the second jigs in an up-and-down direction separately from the first moving part.

6 . The bonding device of claim 1 , wherein, in a plan view, the pressure pad has a round-cornered tetragonal shape.

7 . The bonding device of claim 1 , wherein the first jig has a cross shape.

8 . The bonding device of claim 1 , wherein:
the second jigs are arranged in a first direction and a second direction crossing the first direction; and the first jig is between the second jigs in the first direction, the second direction, a first diagonal direction, and a second diagonal direction, wherein: the first diagonal direction is defined as a direction that crosses the first and second directions in a plan view; and the second diagonal direction is defined as a direction that crosses the first diagonal direction in the plan view.

9 . The bonding device of claim 8 , wherein:
in the plan view, the pressure pad has long sides extending in parallel to the first direction and short sides extending in parallel to the second direction; in a view from the second direction, an upper surface of the pressure pad is parallel to the first direction; in a view from the first direction, a height of the upper surface of the pressure pad gradually increases toward a central portion; and in a view from the first diagonal direction and the second diagonal direction, the height of the upper surface of the pressure pad gradually increases toward the central portion.

10 . The bonding device of claim 8 , wherein, in a view from the first direction, the second direction, the first diagonal direction, and the second diagonal direction, a round edge surface connecting an upper surface and a side surface of the pressure pad to each other has a curved surface.

11 . The bonding device of claim 1 , further comprising a plate below the jig.

12 . The bonding device of claim 11 , wherein the first moving part is below the plate.

13 . The bonding device of claim 11 , wherein the first moving part is below the first jig through a central hole defined in the plate.

14 . The bonding device of claim 11 , wherein the second moving parts are respectively below the second jigs through corner holes defined in the plate.

15 . The bonding device of claim 1 , wherein the pressure pad comprises:
a first pressure pad overlapping the first jig in a plan view; and a plurality of second pressure pads respectively overlapping the second jigs in the plan view.

16 . The bonding device of claim 15 , wherein a hardness of each of the second pressure pads is greater than that of the first pressure pad.

17 . The bonding device of claim 1 , wherein the second jigs are arranged in a first direction and a second direction crossing the first direction, and wherein the first jig comprises:
a plurality of (1-1)-th jigs between the second jigs in the first direction; a plurality of (1-2)-th jigs between the second jigs in the second direction; and a central jig between the (1-1)-th jigs and between the (1-2)-th jigs.

18 . The bonding device of claim 17 , wherein the first moving part comprises a plurality of sub-moving parts below the (1-1)-th jigs, the (1-2)-th jigs, and the central jig.

19 . The bonding device of claim 1 , further comprising a guide film on a rear surface of a display module on the pressure pad,
wherein the guide film comprises a plurality of extension portions extending more outside than the display module.

20 . A bonding device comprising:
a pressure pad; and a jig below the pressure pad, wherein the jig presses the pressure pad, and wherein the jig comprises: a first jig, which moves in an up-and-down direction and defines a central pressing axis corresponding to a pressing location of the pressure pad; and a plurality of second jigs which respectively define corners of the jig, move in an up-and-down direction, and define corner pressing axes adjacent to the corners of the jig corresponding to the pressing location of the pressure pad.

21 . A method of manufacturing a display device, the method comprising:
arranging a display module on a pressure pad on a jig comprising a first jig and a plurality of second jigs adjacent to the first jig; arranging a window on the display module; moving the jig upward to press the pressure pad and bonding the display module to the window; and moving the second jigs further upward to press round corner portions of the pressure pad overlapping the second jigs and bonding first round corner portions of the display module to second round corner portions of the window.

Assignees

• Samsung Display Co Ltd

Inventors

• Park Dongjin
• Kim Youngsu
• Park Cheuljin
• Yoo Kisang
• Yoon Sanghyuck
• Lee Sungkook
• Lee Jaesang

Classifications

• B32B37/10

  characterised by the pressing technique, e.g. using action of vacuum or fluid pressure · CPC title

• B32B38/1833

  Positioning, e.g. registration or centering · CPC title

• H10K59/8722

  Peripheral sealing arrangements, e.g. adhesives, sealants · CPC title

• B32B37/0046 Primary

  characterised by constructional aspects of the apparatus · CPC title

• H10K59/1201

  Manufacture or treatment · CPC title