Semiconductor device with a micromechanical component

Patent metadata

Field	Value
Publication number	US-2025353734-A1
Application number	US-202318854861-A
Country	US
Kind code	A1
Filing date	May 8, 2023
Priority date	May 30, 2022
Publication date	Nov 20, 2025
Grant date	—

Abstract

A semiconductor device. The semiconductor device includes a micromechanical component, an injection-molded body with at least one recess formed on the injection-molded body, which is framed by a lateral wall region of the injection-molded body and is at least partially covered by a base region of the injection-molded body on a first side of the recess, and a lid which is fastened directly or via at least one intermediate component to the lateral wall region and covers the recess on its second side. A through-opening is formed on the base region of the injection-molded body. The at least one lateral wall of which extends from the recess to an outer base surface of the base region faces away from the recess. The micromechanical component is arranged in the through-opening such that the micromechanical component mechanically contacts the at least one lateral wall of the through-opening.

First claim

1 - 11 . (canceled)

12 . A semiconductor device, comprising:
a micromechanical component; an injection-molded body with at least one recess formed on the injection- molded body, the recess being framed by a lateral wall region of the injection-molded body and being at least partially covered on a first side of the recess by a base region of the injection-molded body; and a lid, which is fastened to the lateral wall region directly or via at least one intermediate component, on a second side of the recess facing away from the first side of the recess and covers the recess on the second side; wherein the base region of the injection-molded body includes a through-opening, at least one lateral wall of the through-opening extending from the recess to an outer base surface of the base region facing away from the recess; and wherein the micromechanical component is arranged in the through-opening such that the micromechanical component mechanically contacts the at least one lateral wall of the through-opening.

13 . The semiconductor device according to claim 12 , wherein the micromechanical component includes at least one structured or unstructured substrate including at least one semiconductor material, and wherein the micromechanical component is arranged in the through-opening such that at least one outer surface of the at least one substrate of the micromechanical component mechanically contacts the at least one lateral wall of the through-opening.

14 . The semiconductor device according to claim 12 , wherein the recess is covered on its first side by the base region of the injection-molded body and by the micromechanical component arranged in the through-opening.

15 . The semiconductor device according to claim 12 , wherein the lid is fastened to the lateral wall region in an airtight and gas-tight manner directly or via the at least one intermediate component, and the mechanical contact of the at least one lateral wall of the through-opening with the micromechanical component is airtight and gas-tight, whereby the recess is sealed in an airtight and gas-tight manner from an outer volume of the semiconductor device using the injection-molded body, the lid, and the micromechanical component.

16 . The semiconductor device according to claim 15 , wherein the micromechanical component arranged in the through-opening includes at least one deformable membrane, on a respective first membrane surface of which a pressure prevailing in the outer volume acts, and on a respective second membrane surface of which, facing away from the first membrane surface, a reference pressure enclosed in the recess acts.

17 . The semiconductor device according to claim 12 , wherein the micromechanical component arranged in the through-opening includes a spacer at its end aligned with the recess, and wherein at least one spacer side surface of the spacer mechanically contacts the at least one lateral wall of the through-opening.

18 . The semiconductor device according to claim 12 , wherein the micromechanical component arranged in the through-opening includes an application-specific circuit device, and wherein at least one lateral surface of the application-specific circuit device mechanically contacts the at least one lateral wall of the through-opening.

19 . The semiconductor device according to claim 12 , wherein the semiconductor device is a pressure sensor, or a sound sensor, or a microphone.

20 . A production method for a semiconductor device, the method comp the following steps:
forming an injection-molded body for a micromechanical component with a recess formed on the injection-molded body, the recess being framed by a lateral wall region of the injection-molded body and being at least partially covered on a first side of the recess by a base region of the injection-molded body; and fastening a lid on a second side of the recess facing away from the first side of the recess, directly or via at least one intermediate component, to the lateral wall region such that the lid covers the recess on its second side; wherein, when forming the injection-molded body, a through-opening is formed at the base region of the injection-molded body, an at least one lateral wall of which extends from the recess to an outer base surface, facing away from the recess, of the base region, and the micromechanical component is arranged in the through-opening such that the micromechanical component makes mechanical contact with the at least one lateral wall of the through-opening.

21 . The production method according to claim 20 , wherein the micromechanical component is overmolded with a molding compound of the subsequent injection-molded body using a punch to form the injection-molded body.

22 . The production method according to claim 21 , wherein a film is arranged between the punch and the micromechanical component before the micromechanical component is overmolded with the molding compound of the subsequent injection-molded body, which is removed after the micromechanical component has been overmolded with the molding compound and the punch has been removed from the overmolded micromechanical component.

Assignees

• Bosch Gmbh Robert

Inventors

• Reinmuth Jochen
• Jemili Amin
• Haag Frieder

Classifications

• B81C2203/0154

  Moulding a cap over the MEMS device · CPC title

• B81C1/00333

  Aspects relating to packaging of MEMS devices, not covered by groups B81C1/00269 - B81C1/00325 · CPC title

• B81B2203/0315

  Cavities · CPC title

• B81B2201/0264

  Pressure sensors · CPC title

• B81B2201/0257

  Microphones or microspeakers · CPC title