Port frame, middle frame component, and electronic device

Patent metadata

Field	Value
Publication number	US-2025350675-A1
Application number	US-202318869596-A
Country	US
Kind code	A1
Filing date	Aug 2, 2023
Priority date	Jan 18, 2023
Publication date	Nov 13, 2025
Grant date	—

Abstract

This application provides a port frame, a middle frame component, and an electronic device. The port frame includes a frame body, a connection bump, and a positioning structure. A frame hole is formed on the frame body, the frame body has a frame surface, and the frame surface is configured to come into contact with a first middle frame surface. The frame body may be formed through injection molding of metal powder, to improve structural strength. The connection bump is connected to the frame body, the connection bump has a connection surface that forms an included angle with the frame surface, the connection surface is configured to come into contact with a second middle frame surface, and the connection bump is fixedly connected to the middle frame body, and is electrically connected to both the frame body and the middle frame body.

First claim

1 . A port frame, configured to be fixedly connected to a middle frame body of an electronic device, wherein the middle frame body has a first middle frame surface and a second middle frame surface disposed with an included angle therebetween, and the port frame comprises a frame body and at least one connection bump connected to the frame body;
a frame hole is formed on the frame body, the frame body has a frame surface, and the frame surface is configured to come into contact with the first middle frame surface; and the connection bump has a connection surface that forms an included angle with the frame surface, the connection surface is configured to come into contact with the second middle frame surface, the connection bump is fixedly connected to the middle frame body, and is electrically connected to both the frame body and the middle frame body.

2 . The port frame according to claim 1 , wherein strength of the frame body is greater than strength of the middle frame body.

3 . The port frame according to claim 2 , wherein the frame body is a frame body formed through injection molding of metal powder.

4 . The port frame according to claim 1 , wherein the connection bump has an edge surface facing away from the connection surface, a connection hole penetrating the connection surface and the edge surface is provided on the connection bump, and the connection bump is fixedly connected to the middle frame body through the connection hole.

5 . The port frame according to claim 4 , wherein the connection bump protrudes from the frame surface and avoids a portion of the frame surface, the connection surface is connected to the frame surface and is perpendicular to the frame surface, and the edge surface is parallel to the connection surface and is flush with an edge of the frame surface.

6 . The port frame according to claim 1 , wherein the frame body comprises a frame member, the frame member comprises a first beam, a first connection beam, a second beam, and a second connection beam that are connected end-to-end to enclose and form the frame hole, the first beam is parallel to the second beam and is spaced apart from the second beam, an extension length of the first beam and an extension length of the second beam are both greater than a distance between the first beam and the second beam, the first connection beam has the frame surface, the frame surface is located on an extension path of the first beam, and the connection bump is located on an extension path of the second beam and protrudes from the frame surface in an extension direction of the second beam.

7 . The port frame according to claim 6 , wherein the frame body further comprises a mounting member connected to the frame member and electrically connected to the frame member, the mounting member protrudes from the frame member in an extension direction of a central axis of the frame hole, and the mounting member is configured to be electrically connected to a motherboard of the electronic device.

8 . The port frame according to claim 7 , wherein the mounting member comprises a mounting part connected to the frame member and a boss part connected to an end of the mounting part away from the frame member, the boss part has a mounting surface facing away from the frame member, an area of the mounting surface is greater than a cross-sectional area that is of the mounting part and that is perpendicular to the central axis of the frame hole, and the mounting surface is used for mounting an electrical connection reed that is electrically connected to the motherboard.

9 . The port frame according to claim 7 , wherein two mounting members are disposed, and the two mounting members are respectively connected to a same side of the first connection beam and the second connection beam and extend in a same direction.

10 . The port frame according to claim 1 , wherein the port frame further comprises a positioning structure disposed on the frame body, and the positioning structure is configured to be adaptively connected to a connected-material structure connected to the middle frame body.

11 . The port frame according to claim 10 , wherein the positioning structure comprises at least one positioning bump protruding from the frame body, and the positioning bump is adaptively engaged with the connected-material structure.

12 . The port frame according to claim 11 , wherein the positioning bump comprises a rod-shaped part and a positioning part, the rod-shaped part protrudes from the frame body, the positioning part is connected to an end of the rod-shaped part away from the frame body and extends toward a side surface of the rod-shaped part, and at least the positioning part is capable of being adaptively engaged with a positioning slot on the connected-material structure.

13 . The port frame according to claim 12 , wherein the rod-shaped part and the positioning part jointly form a T-shape.

14 . The port frame according to claim 11 , wherein the positioning structure comprises two positioning bumps, and the two positioning bumps are respectively located on two opposite sides of the frame hole.

15 . A middle frame component, comprising a middle frame body and the port frame according to claim 1 , wherein the middle frame body has an edge part, the edge part has a first middle frame surface and a second middle frame surface that are connected to each other and disposed with an included angle therebetween, the frame surface is configured to come into contact with the first middle frame surface, the connection surface is in contact with the second middle frame surface, and the connection bump is fixedly connected to and electrically connected to the edge part.

16 . The middle frame component according to claim 15 , wherein the middle frame component further comprises an electrical connection reed connected to the frame body, and the electrical connection reed is configured to be electrically connected to the motherboard of the electronic device.

17 . The middle frame component according to claim 16 , wherein two electrical connection reeds are disposed, and the two electrical connection reeds are respectively located on two opposite sides of the frame hole.

18 . The middle frame component according to claim 17 , wherein at least one of the two electrical connection reeds is plate-shaped, and/or at least one of the two electrical connection reeds is L-shaped.

19 . The middle frame component according to claim 15 , wherein a connection hole is provided on the connection bump, a mounting hole is provided on the edge part, the middle frame component further comprises a locking member, and the locking member penetrates the mounting hole and the connection hole, and is configured to fixedly connect the connection bump to the edge part.

20 . The middle frame component according to claim 19 , wherein the locking member is a rivet, and the rivet is circumferentially smooth; the locking member is a screw; or the locking member is a rivet, and there is a knurled structure in a circumference of the rivet.

21 - 23 . (canceled)

Assignees

• Honor Device Co Ltd

Inventors

• Wang Chenyu
• Wang Ya
• Zhao Kuibing
• Yao Wenxing

Classifications

• H04M1/0249

  Details of the mechanical connection between the housing parts or relating to the method of assembly · CPC title

• Y02P10/25

  Process efficiency · CPC title

• H04M1/0274 Primary

  for an electrical connector module · CPC title