Display device and manufacturing method thereof

Patent metadata

Field	Value
Publication number	US-2025331395-A1
Application number	US-202418934242-A
Country	US
Kind code	A1
Filing date	Nov 1, 2024
Priority date	Apr 22, 2024
Publication date	Oct 23, 2025
Grant date	—

Abstract

A display device includes a display panel including a first surface and a second surface and displaying an image; a substrate disposed on the second surface of the display panel and including a first substrate surface and a side surface that intersect; a flexible circuit board connected to a portion of the display panel; a pad unit electrically connecting the flexible circuit board and the display panel; and a protective layer disposed on one surface of the flexible circuit board, wherein the one surface of the flexible circuit board is a surface of the flexible circuit board facing the display panel, and the protective layer covers at least a portion of the first substrate surface and the side surface.

First claim

What is claimed is:

1 . A display device comprising:
a display panel including a first surface and a second surface and displaying an image; a substrate disposed on the second surface of the display panel and including a first substrate surface intersecting a side surface of the substrate; a flexible circuit board connected to a portion of the display panel, the flexible circuit board comprising a pad unit; a conductive adhesive layer electrically connecting the flexible circuit board and the display panel; and a protective layer disposed on one surface of the flexible circuit board, wherein the one surface of the flexible circuit board is a surface of the flexible circuit board facing the display panel, and the protective layer covers at least a portion of the first substrate surface and the side surface.

2 . The display device of claim 1 , wherein
the display device includes a first area, a second area, and a bending area disposed between the first area and the second area, the display panel is bendable in the bending area, and the substrate is absent from the bending area.

3 . The display device of claim 1 , further comprising
a bending protective layer disposed on the first surface, wherein at least a portion of the bending protective layer overlaps the substrate.

4 . The display device of claim 1 , wherein
the substrate contacts a portion of the second surface.

5 . The display device of claim 4 , wherein
the second surface is a surface opposite to a surface on which an image of the display panel is displayed.

6 . The display device of claim 1 , wherein
the conductive adhesive layer disposed on the one surface of the flexible circuit board, the conductive adhesive layer contacts the flexible circuit board and the display panel, the protective layer overlaps at least a portion of the conductive adhesive layer, and the first substrate surface is a surface opposite to a surface of the substrate that contacts the display panel.

7 . The display device of claim 1 , wherein
the protective layer has a portion that extends from the flexible circuit board beyond the first substrate surface by a protrusion height, measured in a direction perpendicular to a plane on which the substrate is disposed.

8 . The display device of claim 7 , wherein
the protrusion height is no less than 20 μm and no greater than 60 μm.

9 . The display device of claim 1 , further comprising
a coating layer disposed on the one surface of the flexible circuit board, wherein the protective layer covers at least a portion of the coating layer.

10 . The display device of claim 1 , further comprising
a spacer disposed on the first substrate surface, wherein the spacer contacts less than all of the first substrate surface.

11 . The display device of claim 8 , further comprising
a spacer disposed on the first substrate surface and having a surface that extends farther from the first substrate surface than the protrusion height.

12 . The display device of claim 1 , further comprising
a barrier layer disposed on the second surface of the display panel; and a plate disposed on the barrier layer and positioned to avoid contacting the protective layer.

13 . A manufacturing method of a display device comprising:
providing a display panel having a first surface and a second surface; attaching a base substrate to the second surface of a display panel, the base substrate having a first substrate surface and a side surface that intersect; attaching a flexible circuit board to the display panel; and forming a protective layer on the flexible circuit board, wherein the forming the protective layer includes applying resin on the flexible circuit board to cover at least a portion of the first substrate surface of the base substrate and the side surface of the base substrate.

14 . The manufacturing method of claim 13 , wherein
the display device includes a first area, a second area, and a bending area disposed between the first area and the second area, wherein the display panel is bendable in the bending area, the second surface is a surface opposite to a surface on which an image of the display panel is displayed, the first substrate surface is a surface of the substrate that is opposite to a surface that contacts the display panel, and attaching the base substrate comprises putting the base substrate in contact with the second surface of the display panel.

15 . The manufacturing method of claim 13 , further comprising
using a dispenser to apply the resin, and positioning a nozzle of the dispenser to align with a plane of the side surface.

16 . The manufacturing method of claim 13 , further comprising
using a dispenser to apply the resin, and positioning a nozzle of the dispenser to be spaced apart from a plane of the side surface by less than 150 km.

17 . The manufacturing method of claim 14 , further comprising
removing at least a portion of the base substrate by irradiating the base substrate with a laser, and directing the laser at either a boundary between the bending area and the second area or the second area.

18 . The manufacturing method of claim 17 , further comprising forming
a groove on the base substrate with the laser, wherein a depth of the groove is less than half of a thickness of the base substrate.

19 . The manufacturing method of claim 14 , further comprising
removing less than all of the base substrate, and leaving a portion of the base substrate intact in the second area.

20 . The manufacturing method of claim 19 , further comprising
forming a spacer on the base substrate that remains in the second area, such that the spacer covers a different portion of the base substrate from the protective layer.

Assignees

• Samsung Display Co Ltd

Inventors

• Kim Ki Tae

Classifications

• H10K71/00

  Manufacture or treatment specially adapted for the organic devices covered by this subclass · CPC title

• H10K59/1201

  Manufacture or treatment · CPC title

• C09J9/02

  Electrically-conducting adhesives · CPC title

• H05K1/147

  at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit (H05K1/148 takes precedence) · CPC title

• H10K77/111

  Flexible substrates · CPC title