Inverse taper overhang

Patent metadata

Field	Value
Publication number	US-2025324862-A1
Application number	US-202519176434-A
Country	US
Kind code	A1
Filing date	Apr 11, 2025
Priority date	Apr 12, 2024
Publication date	Oct 16, 2025
Grant date	—

Abstract

In some embodiments, the present disclosure provides devices. The devices include a backplane. A plurality of overhang structures are disposed over the backplane. Each overhang structure is defined by a top extension of a top structure extending laterally past a bottom structure. The bottom structure is disposed over the backplane. Adjacent overhang structures of the plurality of overhang structures define a plurality of sub-pixels. The bottom structure includes a first sub-layer having a lower surface and an upper surface width, in which the first sub-layer is disposed over the backplane. A second sub-layer has a top surface width that is greater than a bottom surface width is disposed over the first sub-layer. Each sub-pixel includes an organic light-emitting diode (OLED) material is disposed under the adjacent overhang structures. A cathode is disposed over the OLED material and under the adjacent overhang structures.

First claim

What is claimed is:

1 . A device, comprising:
a backplane; a plurality of overhang structures disposed over the backplane, each overhang structure defined by a top extension of a top structure extending laterally past a bottom structure, the bottom structure disposed over the backplane, adjacent overhang structures of the plurality overhang structures defining a plurality of sub-pixels, wherein the bottom structure comprises:
a first sub-layer, having a lower surface and an upper surface width, disposed over the backplane; and
a second sub-layer, having a top surface width that is greater than a bottom surface width, disposed over the first sub-layer;
each sub-pixel comprising:
an organic light-emitting diode (OLED) material disposed under the adjacent overhang structures; and
a cathode disposed over the OLED material and under the adjacent overhang structures.

2 . The device of claim 1 , wherein the top extension extends laterally past the second sub-layer.

3 . The device of claim 1 , further comprising an encapsulation layer disposed over a first sidewall of the first sub-layer, a second sidewall of the second sub-layer, and a bottom surface of the top structure.

4 . The device of claim 1 , wherein the first sub-layer comprises a non-conductive material or a conductive material and the second sub-layer comprises a conductive material.

5 . The device of claim 4 , wherein the first sub-layer comprises an inorganic material.

6 . The device of claim 5 , wherein the first sub-layer comprises one or more of silicon nitride (Si 3 N 4 ), silicon oxide (SiO 2 ), or silicon oxynitride (Si 2 N 2 O).

7 . The device of claim 4 , wherein the second sub-layer comprises a metal-containing material.

8 . The device of claim 7 , wherein the second sub-layer comprises one or more of titanium (Ti), indium tin oxide (ITO), indium zinc oxide (IZO), aluminun (Al), aluminum neodymium (AlNd), molybdenum (Mo), molybdenum tungsten (MoW), copper (Cu), or a combination thereof.

9 . The device of claim 4 , wherein the first sub-layer comprises a metal-containing material and the second sub-layer comprises a metal-containing material.

10 . The device of claim 4 , wherein the first sub-layer comprises a metal-containing layer and the second sub-layer comprises a transparent conductive oxide.

11 . The device of claim 4 , wherein the first sub-layer comprises a transparent conductive oxide and the second sub-layer comprises a transparent conductive oxide.

12 . The device of claim 1 , wherein:
the OLED material is disposed over and in contact with the first sub-layer; and the cathode is disposed over the OLED material and in contact with the second sub-layer.

13 . The device of claim 1 , further comprising an assistant electrode disposed between the backplane and the plurality of overhang structures.

14 . A device, comprising:
a backplane; a plurality of overhang structures disposed over the backplane, each overhang structure defined by a top extension of a top structure extending laterally past a bottom structure, the bottom structure disposed over the backplane, adjacent overhang structures of the plurality overhang structures defining a plurality of sub-pixels, wherein the bottom structure comprises:
a first sub-layer, having a lower surface width and an upper surface width, disposed over the backplane; and
a second sub-layer, having a top surface width that is greater than a bottom surface width, disposed over the first sub-layer;
each sub-pixel comprising:
an organic light-emitting diode (OLED) material disposed and under the adjacent overhang structures;
a cathode disposed over the OLED material and under the adjacent overhang structures; and
an encapsulation layer disposed over a first sidewall of the first sub-layer, a second sidewall of the second sub-layer, and a bottom surface of the top structure.

15 . The device of claim 14 , wherein the top extension extends laterally past the second sub-layer.

16 . The device of claim 14 , wherein the encapsulation layer comprises a silicon nitride material, silicon oxynitride material, silicon oxide material, or a combination thereof.

17 . The device of claim 14 , wherein:
the OLED material is disposed over and in contact with the first sub-layer; and the cathode is disposed over the OLED material and in contact with the second sub-layer.

18 . A device, comprising:
a backplane; a plurality of overhang structures, each overhang structure defined by a top extension of a top structure extending laterally past a bottom structure, the bottom structure disposed over the backplane, adjacent overhang structures of the plurality overhang structures defining a plurality of sub-pixels, wherein the bottom structure comprises a top surface width that is greater than a bottom surface width disposed over the backplane; and each sub-pixel comprising:
an organic light-emitting diode (OLED) material disposed over the backplane and under the adjacent overhang structures; and
a cathode disposed over the OLED material and under the adjacent overhang structures.

19 . The device of claim 18 , wherein:
the OLED material is disposed over and in contact with the backplane; and the cathode is disposed over the OLED material and in contact with the bottom structure.

20 . The device of claim 18 , further comprising an assistant electrode disposed between the backplane and the plurality of overhang structures.

Assignees

• Applied Materials Inc

Inventors

• Chen Chung-Chia
• Wang sheng-wen
• Choung Ji Young
• Lin Yu-Hsin
• Lee Jungmin

Classifications

• H10K59/122 Primary

  Pixel-defining structures or layers, e.g. banks · CPC title

• H10K59/80521

  characterised by their shape · CPC title

• H10K2102/101

  comprising transparent conductive oxides [TCO] · CPC title

• H10K59/873 Primary

  Encapsulations · CPC title