Equalization of microelectromechanical sensors using stored measured parameters

Patent metadata

Field	Value
Publication number	US-2025317331-A1
Application number	US-202519081408-A
Country	US
Kind code	A1
Filing date	Mar 17, 2025
Priority date	Apr 8, 2024
Publication date	Oct 9, 2025
Grant date	—

Abstract

Apparatus and methods for equalizing microelectromechanical systems (MEMS) sensors are disclosed. In certain embodiments, measured sensor parameters of a MEMS sensor are stored in a non-volatile memory (NVM) of a sensor signal processor used to process a sensor output signal of the MEMS sensor. The measured sensor parameters are retrieved by a digital signal processor (DSP) and used for equalizing sensor data provided to the DSP by the sensor signal processor during operation. The measured sensor parameters can be determined at test, per individual part, by measurements of the MEMS sensor's characteristics, and thus equalize the MEMS sensor while accounting for manufacturing and/or processing variations.

First claim

What is claimed is:

1 . A method of equalization, the method comprising:
obtaining, from a non-volatile memory, measured sensor parameters of a microelectromechanical systems (MEMS) sensor that is coupled to a sensor signal processor; determining, based on the measured sensor parameters, one or more equalization filter coefficients for an equalizer of a digital signal processor; obtaining, from the sensor signal processor, sensor data indicating a sensor output signal of the MEMS sensor; and equalizing, using the equalization filter of the digital signal processor, the sensor data.

2 . The method of claim 1 , wherein the measured sensor parameters include a resonant frequency and a quality-factor of the MEMS sensor.

3 . The method of claim 2 , wherein the measured sensor parameters further include a measured gain of a signal channel of the sensor signal processor.

4 . The method of claim 1 , wherein the measured sensor parameters include at least one equalization filter coefficient.

5 . The method of claim 1 , wherein the sensor data is in a pulse density modulation (PDM) format.

6 . The method of claim 1 , wherein the non-volatile memory is on the sensor signal processor, the method further comprising obtaining the measured sensor parameters using an interface of the sensor signal processor.

7 . The method of claim 1 , further comprising decimating the sensor data prior to equalizing the sensor data.

8 . The method of claim 1 , further comprising generating the sensor data based on the sensor output signal of the MEMS sensor using an analog front-end circuit of the sensor signal processor, wherein a bandwidth of the analog front-end circuit is a multiple of a resonant frequency of the MEMS sensor.

9 . The method of claim 8 , wherein a signal range of the analog front-end circuit accommodates a peaking of the MEMS sensor arising from a quality-factor of the MEMS sensor.

10 . The method of claim 1 , wherein the MEMS sensor comprises a MEMS accelerometer.

11 . A microelectromechanical systems (MEMS) signal processing system comprising:
a MEMS sensor; a sensor signal processor coupled to the MEMS sensor and configured to output sensor data indicating a sensor output signal of the MEMS sensor, wherein the sensor signal processor comprises a non-volatile memory storing measured sensor parameters of the MEMS sensor; and a digital signal processor configured to receive the sensor data and the measured sensor parameters from the sensor signal processor, the digital signal processor further configured to determine one or more equalization filter coefficients based on the measured sensor parameters and to equalize the sensor data based on the one or more equalization filter coefficients.

12 . The MEMS signal processing system of claim 11 , wherein the measured sensor parameters include a resonant frequency and a quality-factor of the MEMS sensor.

13 . The MEMS signal processing system of claim 12 , wherein the measured sensor parameters further include a measured gain of a signal channel of the sensor signal processor.

14 . The MEMS signal processing system of claim 11 , wherein the measured sensor parameters include at least one equalization filter coefficient.

15 . The MEMS signal processing system of claim 11 , wherein the sensor data is in a pulse density modulation (PDM) format.

16 . The MEMS signal processing system of claim 11 , wherein the digital signal processor is further configured to decimate the sensor data prior to equalizing the sensor data.

17 . The MEMS signal processing system of claim 11 , wherein the sensor signal processor further includes an analog front end circuit configured to generate the sensor data based on the sensor output signal of the MEMS sensor, wherein a bandwidth of the analog front-end circuit is a multiple of a resonant frequency of the MEMS sensor.

18 . The MEMS signal processing system of claim 17 , wherein a signal range of the analog front-end circuit accommodates a peaking of the MEMS sensor arising from a quality-factor of the MEMS sensor.

19 . The MEMS signal processing system of claim 11 , wherein the MEMS sensor comprises a MEMS accelerometer.

20 . A microelectromechanical systems (MEMS) module comprising:
a MEMS sensor; and a sensor signal processor coupled to the MEMS sensor and configured to output sensor data indicating a sensor output signal of the MEMS sensor, wherein the sensor signal processor comprises a non-volatile memory storing measured sensor parameters of the MEMS sensor, wherein the sensor signal processor is further configured to provide the sensor data and the measured sensor parameters to a digital signal processor that equalizes the sensor data based on the measured sensor parameters.

Assignees

• Analog Devices Inc

Inventors

• Nguyen Khiem
• Spirer Adam
• Guo Shanglin
• Pham Long

Classifications

• G01P2015/0868

  using self-test structures integrated into the microstructure · CPC title

• G01P2015/0865

  using integrated signal processing circuitry · CPC title

• G01P2015/0862

  being provided with particular means being integrated into a MEMS accelerometer structure for providing particular additional functionalities to those of a spring mass system · CPC title

• G01P21/00 Primary

  Testing or calibrating of apparatus or devices covered by the preceding groups · CPC title

• G01P15/08 Primary

  with conversion into electric or magnetic values · CPC title