Initialization device for elastic membrane, polishing apparatus, initialization method for elastic membrane, and life determination method for elastic membrane

Patent metadata

Field	Value
Publication number	US-2025312890-A1
Application number	US-202318859107-A
Country	US
Kind code	A1
Filing date	Jan 20, 2023
Priority date	Apr 27, 2022
Publication date	Oct 9, 2025
Grant date	—

Abstract

The present invention relates to an initialization device for an elastic membrane, a polishing apparatus, an initialization method for an elastic membrane, and a life determination method for an elastic membrane. The initialization device (50) for the elastic membrane (10) includes a pressurizing device (55), an expansion amount detection device (58), and a control device (40) configured to compare an expansion amount detected by the expansion amount detection device (58) with a predetermined target expansion amount, and when the expansion amount reaches the target expansion amount, determine a completion of an initialization of the elastic membrane (10).

First claim

1 . An initialization device for an elastic membrane comprising:
a pressurizing device configured to pressurize the elastic membrane attachable to a substrate holding mechanism of a polishing apparatus to expand the elastic membrane; an expansion amount detection device configured to detect an expansion amount of the elastic membrane; and a control device configured to compare the expansion amount detected by the expansion amount detection device with a predetermined target expansion amount and, when the expansion amount reaches the target expansion amount, determine a completion of an initialization of the elastic membrane.

2 . The initialization device for the elastic membrane according to claim 1 , comprising an attachment portion configured to attach an elastic membrane assembly holding the elastic membrane.

3 . The initialization device for the elastic membrane according to claim 1 , wherein the control device is configured to repeat a pressurizing operation by the pressurizing device until the expansion amount of the elastic membrane reaches the target expansion amount.

4 . The initialization device for the elastic membrane according to claim 1 ,
wherein the pressurizing device comprises:
a ring-shaped pressing jig arranged in a pressure chamber of the elastic membrane; and
a biasing device configured to press the pressing jig against the elastic membrane.

5 . The initialization device for the elastic membrane according to claim 1 , wherein the pressurizing device comprises a pressure regulating device configured to supply a pressurized fluid to a pressure chamber of the elastic membrane and open the pressure chamber of the elastic membrane to an atmosphere.

6 . The initialization device for the elastic membrane according to claim 1 , wherein the initialization device for the elastic membrane comprises a heating structure configured to heat the elastic membrane.

7 . The initialization device for the elastic membrane according to claim 1 ,
wherein the initialization device for the elastic membrane comprises:
a rotation mechanism configured to rotate the elastic membrane; and
a pad member against which the elastic membrane is pressed, and
wherein the control device is configured to:
operate the pressurizing device to press the elastic membrane against the pad member; and
operate the rotation mechanism to rotate the elastic membrane while pressing the elastic membrane against the pad member.

8 . A polishing apparatus comprising:
a substrate holding mechanism to which an elastic membrane is attached; a pressurizing device configured to pressurize the elastic membrane to expand the elastic membrane; an expansion amount detection device configured to detect an expansion amount of the elastic membrane; and a control device configured to compare the expansion amount detected by the expansion amount detection device with a predetermined set expansion amount.

9 . The polishing apparatus according to claim 8 ,
wherein the set expansion amount corresponds to a target expansion amount indicating a target elasticity of the elastic membrane, and wherein when the expansion amount reaches the target expansion amount, the control device is configured to complete an initialization of the elastic membrane.

10 . The polishing apparatus according to claim 8 ,
wherein the set expansion amount corresponds to a replacement expansion amount indicating a replacement time of the elastic membrane, and wherein when the expansion amount reaches the replacement expansion amount, the control device is configured to issue a signal regarding the replacement time of the elastic membrane.

11 . The polishing apparatus according to claim 10 ,
wherein the control device is configured to:
measure a release time until the substrate held by the substrate holding mechanism is released from the elastic membrane; and
determine the replacement time of the elastic membrane based on the measured release time and the calculated expansion amount.

12 . An initialization method for an elastic membrane attachable to a substrate holding mechanism of a polishing apparatus, comprising:
pressurizing the elastic membrane by a pressurizing device to expand the elastic membrane; detecting an expansion amount of the elastic membrane by an expansion amount detection device; and comparing the expansion amount detected by the expansion amount detection device with a predetermined target expansion amount, when the expansion amount reaches the target expansion amount, to determine a completion of an initialization of the elastic membrane.

13 . The initialization method for the elastic membrane according to claim 12 , comprising:
attaching an elastic membrane assembly holding the elastic membrane to an initialization device provided separately from the polishing apparatus; and expanding the elastic membrane by the pressurizing device without holding a substrate to initialize the elastic membrane.

14 . The initialization method for the elastic membrane according to claim 12 , comprising repeating a pressurizing operation by the pressurizing device until the expansion amount of the elastic membrane reaches the target expansion amount.

15 . The initialization method for the elastic membrane according to claim 12 , comprising heating the elastic membrane.

16 . The initialization method for the elastic membrane according to claim 12 , comprising:
pressing the elastic membrane against a pad member; and rotating the elastic membrane while pressing the elastic membrane against the pad member.

17 . The initialization method for the elastic membrane according to claim 12 , comprising polishing a dummy wafer by the substrate holding mechanism to which the elastic membrane is attached to initialize the elastic membrane.

18 . (canceled)

19 . (canceled)

Assignees

• Ebara Corp

Inventors

• Saito Kenichiro
• Murata Seiji
• Terada Tetsuya
• Asano Kentaro

Classifications

• H10P52/00

  Grinding, lapping or polishing of wafers, substrates or parts of devices · CPC title

• B24B49/16 Primary

  taking regard of the load · CPC title

• B24B37/30

  for single side lapping of plane surfaces · CPC title

• B24B41/06

  Work supports, e.g. adjustable steadies (B24B37/27 takes precedence) · CPC title

• B24B49/12

  involving optical means · CPC title