Circuit board, lens driving device, and camera module including the same

Patent metadata

Field	Value
Publication number	US-2025280494-A1
Application number	US-202519210226-A
Country	US
Kind code	A1
Filing date	May 16, 2025
Priority date	Sep 16, 2021
Publication date	Sep 4, 2025
Grant date	—

Abstract

A circuit board according to an embodiment includes: an insulating part; and a pattern part disposed on the insulating part, wherein the insulating part includes first and second insulating regions spaced apart from each other with an open region interposed therebetween, the pattern part includes: a first terminal portion disposed in a plurality of first side regions of the first insulating region adjacent to the open region; a second terminal portion disposed on a plurality of second side regions of the second insulating region facing the plurality of first side regions with the open region interposed therebetween; and a connecting portion disposed in the open region and connecting between the first and second terminal portions, wherein the connecting portion includes a plurality of bent portions connecting between the first terminal portion and the second terminal portion disposed in the first side region and the second side region that do not face each other and formed at a plurality of corners of the open region, the plurality of bent portions are bent to rotate in the same direction as each other, each of the first terminal portion, the second terminal portion, and the connecting portion includes a metal layer and a surface treatment layer disposed on the metal layer, and the metal layer includes a first metal layer and a second metal layer that is disposed on the first metal layer and has an electrical conductivity different from that of the first metal layer.

First claim

What is claimed is:

1 . A circuit board comprising:
an insulating part; and a signal pattern part disposed on the insulating part, wherein the insulating part includes a first insulating region and a second insulating region surrounding the first insulating region with an open region therebetween, wherein the signal pattern part includes a plurality of first terminal parts disposed on the first insulating region, a plurality of second terminal parts disposed on the second insulating region, and a plurality of connection parts disposed in the open region and connecting between the plurality of first terminal parts and the plurality of second terminal parts, and wherein each of the first terminal parts, the second terminal parts, and the connection parts includes an alloy layer, and a metal layer surrounding the alloy layer.

2 . The circuit board of claim 1 , wherein the metal layer includes a first metal layer surrounding an upper surface and a side surface of the alloy layer.

3 . The circuit board of claim 1 , wherein the plurality of connection parts include a plurality of bent portions formed at a plurality of corner portions of the open region.

4 . The circuit board of claim 2 , wherein an electrical conductivity of the first metal layer is higher than an electrical conductivity of the alloy layer.

5 . The circuit board of claim 2 , wherein a first metal layer of each connection part is disposed entirely on upper, side, and lower surfaces of an alloy layer of the connection part.

6 . The circuit board of claim 2 , wherein a first metal layer of each first terminal part is disposed on upper and side surfaces of an alloy layer of the first terminal part, and is disposed on a part of a lower surface of the alloy layer of the first terminal part.

7 . The circuit board of claim 6 , wherein the lower surface of the alloy layer of the first terminal part includes a first-first lower surface overlapping the first insulating region in a thickness direction, and a first-second lower surface other than the first-first lower surface, and
wherein the first metal layer of the first terminal part is disposed on the first-second lower surface of the alloy layer of the first terminal part.

8 . The circuit board of claim 2 , wherein a first metal layer of the second terminal part is disposed on upper and side surfaces of an alloy layer of the second terminal part, and is disposed on a part of the lower surface of the alloy layer of the second terminal part.

9 . The circuit board of claim 8 , wherein the lower surface of the alloy layer of the second terminal part includes a second-first lower surface overlapping the second insulating region in a thickness direction, and a second-second lower surface other than the second-first lower surface, and
wherein the first metal layer of the second terminal part is disposed on the second-second lower surface of the alloy layer of the second terminal part.

10 . The circuit board of claim 2 , wherein each of the first terminal part, the second terminal part, and the connection part includes a surface treatment layer disposed on the first metal layer.

11 . The circuit board of claim 10 , wherein each of the first terminal part, the second terminal part, and the connection part includes a second metal layer disposed on a lower surface of the alloy layer, and
wherein the first metal layer is disposed on an upper surface of the alloy layer, a side surface of the alloy layer, a side surface of the second metal layer, and a lower surface of the second metal layer.

12 . The circuit board of claim 11 , wherein the surface treatment layer of each of the first terminal part, the second terminal part, and the connection part does not contact the alloy layer and the second metal layer of each of the first terminal part, the second terminal part, and the connection part.

13 . The circuit board of claim 3 , wherein a thickness of the first metal layer is in a range of 0.5 μm to 4.0 μm.

14 . The circuit board of claim 2 , comprising:
a dummy pattern part disposed on the insulating part and separated from the signal pattern part.

15 . The circuit board of claim 14 , wherein the dummy pattern part includes an alloy layer and a first metal layer corresponding to the signal pattern part.

16 . The circuit board of claim 2 , wherein the alloy layer has a slope whose width gradually increases from an upper surface to a lower surface, and
wherein the first metal layer has a slope corresponding to the slope of the alloy layer and is disposed on a side surface of the alloy layer.

17 . A lens driving device comprising:
a fixed part; a first moving part disposed to be relatively movable with respect to the fixed part; and a circuit board according to claim 1 , including a region connected to the fixed part and a region connected to the first moving part.

18 . The lens driving device of claim 17 , comprising:
an image sensor disposed on the circuit board, wherein the image sensor is electrically connected to the signal pattern part of the circuit board.

19 . A camera module comprising:
a lens driving device according to claim 15 , wherein the lens driving device includes a second moving part, which is disposed inside the first moving part and is capable of moving relative to the fixed part and the fixed moving part in an optical axis direction.

Assignees

• Lg Innotek Co Ltd

Inventors

• Kwon Na Kyung
• Kim Hae Sik

Classifications

• H05K2201/098

  Special shape of the cross-section of conductors, e.g. very thick plated conductors · CPC title

• H05K2201/0394

  Conductor crossing over a hole in the substrate or a gap between two separate substrate parts · CPC title

• H05K2201/10121

  Optical component, e.g. opto-electronic component · CPC title

• H05K2201/10151

  Sensor · CPC title

• H05K1/09

  Use of materials for the {conductive, e.g. } metallic pattern · CPC title