Method of Manufacturing Piezoelectric Microactuators Having Wrap-Around Electrodes

Patent metadata

Field	Value
Publication number	US-2025279116-A1
Application number	US-202519213900-A
Country	US
Kind code	A1
Filing date	May 20, 2025
Priority date	Mar 5, 2018
Publication date	Sep 4, 2025
Grant date	—

Abstract

A method of manufacturing a piezoelectric microactuator having a wrap-around electrode includes forming a piezoelectric element having a large central electrode on a top face, and having a wrap-around electrode that includes the bottom face, two opposing ends of the device, and two opposing end portions of the top face. The device is then cut through the middle, separating the device into two separate piezoelectric microactuators each having a wrap-around electrode.

First claim

We claim:

1 . A system for printing conductive and non-conductive adhesives onto one or more suspension components, the system comprising:
a machine base configured to receive at least one suspension component; a printing device including at least one aperture, the at least one aperture is configured to be positioned over a location on the at least one suspension component where adhesive material is to be deposited; an application device configured to move in a shearing direction about the printing device and deposit the adhesive material into the at least one aperture.

2 . The system of claim 1 , wherein the machine base is configured to receive a panel of more than one suspension component, wherein each of the suspension components includes at least one location where the adhesive material is to be deposited.

3 . The system of claim 1 , wherein the printing device includes either a screen or a stencil.

4 . The system of claim 1 , wherein the adhesive material includes conductive adhesive material.

5 . The system of claim 1 , wherein the adhesive material includes non-conductive adhesive material.

6 . The system of claim 1 , wherein the adhesive material is a viscous fluid.

7 . The system of claim 1 , further comprising a heat source configured to cure the adhesive material deposited into the at least one aperture.

8 . The system of claim 1 , further comprising a UV light source configured to cure the adhesive material deposited into the at least one aperture.

9 . The system of claim 1 , wherein the at least one aperture is sized to receive a desired volume of adhesive material.

10 . The system of claim 9 , wherein the at least one aperture has a diameter in the range of about 0.5 mm to 5.0 mm.

11 . The system of claim 9 , wherein the at least one aperture has a diameter in the range of about 2.5 mm to 3.0 mm.

12 . The system of claim 1 , wherein the adhesive is deposited on the suspension component at a location that imparts a structural effect on the suspension component.

13 . The system of claim 12 , wherein the adhesive deposited on the suspension component increases the torsional stiffness of the suspension component.

14 . A method of printing adhesive on a suspension component, comprising the steps of:
loading one or more suspension components onto a machine base; placing a screen or stencil over the one or more suspension components, the screen or stencil including one or more apertures formed therein; applying adhesive material to the screen or stencil at a first location; positioning a squeegee at the first location with the adhesive material; and moving the squeegee across the screen or stencil to deposit the adhesive material into the one or more apertures.

15 . The method of claim 14 , further comprising:
partially curing the adhesive material deposited into the at least one aperture.

16 . The method of claim 14 , wherein the loading step further comprises loading a panel comprising a plurality of suspension components, and each of the suspension components in the panel includes at least one location where the adhesive material is to be deposited.

17 . The method of claim 14 , wherein the first location is a distal location, and the squeegee moves across the screen or stencil in a proximal direction.

18 . The method of claim 14 , wherein the adhesive material includes conductive adhesive material.

19 . The method of claim 14 , wherein the adhesive material includes non-conductive adhesive material.

20 . The method of claim 14 , wherein the adhesive material is a viscous fluid.

21 . The method of claim 14 , wherein the one or more apertures is sized to receive a desired volume of adhesive material.

22 . The method of claim 21 , wherein the one or more apertures has a diameter in the range of about 0.5 mm to 5.0 mm.

23 . The method of claim 21 , wherein the one or more apertures has a diameter in the range of about 2.5 mm to 3.0 mm.

24 . The method of claim 14 , wherein the adhesive is deposited on the suspension component at a location that imparts a structural effect on the suspension component.

25 . The method of claim 24 , wherein the adhesive deposited on the suspension component increases the torsional stiffness of the suspension component.

Assignees

• Magnecomp Corp

Inventors

• Ee Kuen Chee
• Zhang Long

Classifications

• H10N30/073

  by fusion of metals or by adhesives · CPC title

• G11B5/48

  Disposition or mounting of heads {or head supports} relative to record carriers {(mounting of head within housing G11B5/105); arrangements of heads, e.g. for scanning the record carrier to increase the relative speed (driving of both record carriers and head G11B15/18; guiding record carriers G11B15/60; head selecting circuits G11B15/12)} · CPC title

• G11B21/10

  Track finding or aligning by moving the head {; Provisions for maintaining alignment of the head relative to the track during transducing operation, i.e. track following (characterised by the track access method G11B21/08)} · CPC title

• G11B5/56

  with provision for moving the head {support} for the purpose of adjusting the position of the head relative to the record carrier, e.g. manual adjustment for azimuth correction or track centering ({G11B5/52,} G11B5/54, G11B5/58 take precedence) · CPC title

• B32B37/04

  characterised by the partial melting of at least one layer · CPC title