Display substrate and display apparatus
US-2024431163-A1 · Dec 26, 2024 · US
US2025275405A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2025275405-A1 |
| Application number | US-202519208861-A |
| Country | US |
| Kind code | A1 |
| Filing date | May 15, 2025 |
| Priority date | Jul 31, 2020 |
| Publication date | Aug 28, 2025 |
| Grant date | — |
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A display apparatus including a substrate including a display area and a peripheral area outside the display area, a first pad disposed on a first insulating layer in the peripheral area, a second pad disposed on a second insulating layer different from the first insulating layer, a third pad disposed on the second insulating layer, a first auxiliary pad overlapping the first pad, a second auxiliary pad overlapping the second pad, a third auxiliary pad overlapping the third pad, a first connection line disposed on the first insulating layer and connected to the first pad, a second connection line disposed on the second insulating layer and connected to the second pad, and a third connection line disposed on the second insulating layer, connected to the third pad, and disposed between the first connection line and the second connection line.
Opening claim text (preview).
What is claimed is: 1 . An electronic apparatus including a display apparatus, comprising: a substrate comprising a display area and a peripheral area outside the display area; a first pad disposed on a first insulating layer in the peripheral area; a second pad disposed adjacently to the first pad in a first direction in the peripheral area, the second pad being disposed on a second insulating layer different from the first insulating layer; a third pad disposed adjacently to the first pad in a second direction crossing the first direction in the peripheral area, the third pad being disposed on the second insulating layer; a first auxiliary pad overlapping the first pad in a plan view; a second auxiliary pad overlapping the second pad in the plan view; a third auxiliary pad overlapping the third pad in the plan view; a first connection line disposed on the first insulating layer and connected to the first pad; a second connection line disposed on the second insulating layer and connected to the second pad; a third connection line disposed on the second insulating layer, connected to the third pad, and disposed between the first connection line and the second connection line; and a third layer covering the second pad and the third pad, wherein the first auxiliary pad is disposed on the third layer and electrically connected to the first pad; wherein the second auxiliary pad is disposed on the third layer and electrically connected to the second pad; and wherein the third auxiliary pad is disposed on the third layer and electrically connected to the third pad. 2 . The electronic apparatus of claim 1 , wherein the second insulating layer covers the first pad. 3 . The electronic apparatus of claim 1 , wherein the first connection line and the first pad comprise the same layer structure, the second connection line and the second pad comprise the same layer structure, and the third connection line and the third pad comprise the same layer structure. 4 . The electronic apparatus of claim 1 , wherein the first, second, and third connection lines extend in a direction towards the display area. 5 . The electronic apparatus of claim 4 , wherein the first connection line is electrically connected to a first data line over the display area, the second connection line is electrically connected to a second data line over the display area, and the third connection line is electrically connected to a third data line over the display area. 6 . The electronic apparatus of claim 5 , wherein the third data line is disposed between the first data line and the second data line. 7 . The electronic apparatus of claim 1 , further comprising: a first test line disposed on the first insulating layer and connected to the first pad; a second test line disposed on the second insulating layer and connected to the second pad; and a third test line disposed on the second insulating layer, connected to the third pad, and disposed between the first test line and the second test line. 8 . The electronic apparatus of claim 7 , wherein the second insulating layer covers the first test line. 9 . The electronic apparatus of claim 7 , wherein the first test line and the first pad comprise the same layer structure, the second test line and the second pad comprise the same layer structure, and the third test line and the third pad comprise the same layer structure. 10 . The electronic apparatus of claim 7 , wherein the first, second, and third test lines extend in a direction away from the display area. 11 . The electronic apparatus of claim 10 , wherein each of the first, second, and third test lines is electrically connected to a corresponding test transistor, respectively. 12 . The electronic apparatus of claim 10 , further comprising bridge lines electrically connecting the first, second, and third test lines to corresponding test transistors, respectively. 13 . The electronic apparatus of claim 12 , wherein the bridge lines are disposed on a third layer covering the second test line and the third test line. 14 . The electronic apparatus of claim 1 , wherein a distance between an edge of the first pad in a direction to the second pad and an edge of the second pad in a direction to the first pad is about 10.5 μm to about 22 μm. 15 . The electronic apparatus of claim 1 , wherein a width of the first pad in a direction to the second pad is about 6 μm to about 25.5 μm. 16 . The electronic apparatus of claim 1 , wherein a width of each of the first to third connection lines is about 2 μm to about 3 μm. 17 . The electronic apparatus of claim 1 , wherein the first auxiliary pad overlaps the third connection line in the plan view. 18 . The electronic apparatus of claim 1 , wherein the electronic apparatus is a smartphone. 19 . An electronic apparatus including a display apparatus, comprising: a substrate comprising a display area and a pad area; a first pad disposed on a first layer in the pad area; a second pad in the pad area, the second pad being separated from the first pad in a first direction, the second pad being disposed on a second layer different from the first layer; a third pad, a fourth pad, and a fifth pad in the pad area, the third pad, the fourth pad, and the fifth pad being arranged along a second direction different from the first direction; a first connection line between the first pad and the second pad, the first connection line being connected to the third pad; a second connection line between the first connection line and the second pad, the second connection line being connected to the fourth pad; and a third connection line between the second connection line and the second pad, the third connection line being connected to the fifth pad; wherein the first connection line and the third connection line are disposed on the second layer, and wherein the second connection line is disposed on the first layer. 20 . The electronic apparatus of claim 19 , wherein the second layer covers the second connection line.
Manufacture or treatment specially adapted for the organic devices covered by this subclass · CPC title
Forming conductive regions or layers, e.g. electrodes · CPC title
comprising red-green-blue [RGB] subpixels · CPC title
Passivation; Containers; Encapsulations · CPC title
Interconnections, e.g. wiring lines or terminals · CPC title
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