Modular liquid cooling for multi-node computing systems
US-2024389276-A1 · Nov 21, 2024 · US
US2025275079A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2025275079-A1 |
| Application number | US-202519062781-A |
| Country | US |
| Kind code | A1 |
| Filing date | Feb 25, 2025 |
| Priority date | Feb 26, 2024 |
| Publication date | Aug 28, 2025 |
| Grant date | — |
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
What the patent document calls the invention.
A short plain-language summary of the technical disclosure.
Who owns or filed the patent and who is credited as inventor.
Filing, priority, publication, and grant dates set the timeline.
The legal scope of protection — read this for what is actually claimed.
Technology tags used to group this patent with similar filings.
Prior art links and similar publications in this corpus.
Official abstract text for this publication.
Systems, devices, and methods for disaggregating networking components are provided. An example networking chassis includes a first disaggregated server device supported by the networking chassis that includes a first central processing unit (CPU) and a first graphics processing unit (GPU) coupled with the first CPU. The networking chassis further includes a first insertable switch module communicably coupled with the first disaggregated server device that includes first switching chipsets and a first fabric management controller coupled with the first switching chipsets. The first insertable switch module at least partially controls data transmission associated with the first disaggregated server device. The first GPU of the first disaggregated server device is isolated on the first disaggregated server device, supported on the first disaggregated server device in the absence of other GPUs, or is otherwise the only GPU on the first disaggregated server device so as to provide modularity in networking applications.
Opening claim text (preview).
1 . A networking chassis comprising: a first disaggregated server device supported by the networking chassis, the first disaggregated server device comprising: a first central processing unit (CPU); a first graphics processing unit (GPU) coupled with the first CPU, wherein the first CPU and the first GPU are configured to perform one or more computing operations associated with the networking chassis; and a first insertable switch module communicably coupled with the first disaggregated server device comprising: one or more first switching chipsets; and a first fabric management controller operably coupled with the one or more first switching chipsets, wherein the first insertable switch module is configured to at least partially control data transmission associated with the first disaggregated server device. 2 . The networking chassis according to claim 1 , wherein the first GPU of the first disaggregated server device is isolated on the first disaggregated server device. 3 . The networking chassis according to claim 1 , wherein the first GPU is the only GPU on the first disaggregated server device. 4 . The networking chassis according to claim 1 , wherein the first GPU is supported on the first disaggregated server device in the absence of other GPUs on the first disaggregated server device. 5 . The networking chassis according to claim 1 , wherein the first disaggregated server device further comprises one or more first thermal management components. 6 . The networking chassis according to claim 5 , wherein the one or more first thermal management components are configured to independently dissipate heat generated by the first CPU and/or the first GPU. 7 . The networking chassis according to claim 5 , wherein the one or more first thermal management components comprise one or more fans configured to dissipate heat generated by the first CPU and/or the first GPU. 8 . The networking chassis according to claim 1 , wherein the first insertable switch module further comprises one or more first switch thermal management components. 9 . The networking chassis according to claim 8 , wherein the one or more first switch thermal management components are configured to independently dissipate heat generated by the one or more first switching chipsets and/or the first fabric management controller. 10 . The networking chassis according to claim 8 , wherein the one or more first thermal management components comprise one or more fans configured to dissipate heat generated by the one or more first switching chipsets and/or the first fabric management controller. 11 . The networking chassis according to claim 1 , wherein the first disaggregated server device and/or the first insertable switch module are removably attached with the networking chassis. 12 . The networking chassis according to claim 1 , further comprising one or more power supply units (PSUs) configured to provide a direct current (DC) power input to the first disaggregated server device and/or the first insertable switch module. 13 . The networking chassis according to claim 1 , further comprising a second disaggregated server device comprising: a second central processing unit (CPU); a second graphics processing unit (GPU) coupled with the second CPU, wherein the second CPU and second GPU are configured to perform the one or more computing operations associated with the networking chassis. 14 . The networking chassis according to claim 13 , wherein the second GPU of the second disaggregated server device is isolated on the second disaggregated server device. 15 . The networking chassis according to claim 13 , wherein the second GPU is the only GPU on the second disaggregated server device. 16 . The networking chassis according to claim 13 , wherein the second GPU is supported on the second disaggregated server device in the absence of other GPUs on the second disaggregated server device. 17 . The networking chassis according to claim 13 , wherein the first GPU of the first disaggregated server device and the second GPU of the second disaggregated server device are communicably coupled via the first insertable switch module. 18 . The networking chassis according to claim 13 , wherein the first disaggregated server device and the second disaggregated server device are removably attached with the networking chassis. 19 . The networking chassis according to claim 13 , wherein operation of the second disaggregated server device is unimpacted by the removal of the first disaggregated server device. 20 . The networking chassis according to claim 1 , further comprising: a plurality of disaggregated server devices comprising the first disaggregated server device; and a plurality of insertable switch modules comprising the first insertable switch module. 21 . The networking device according to claim 20 , wherein each of the plurality of disaggregated server devices and the plurality of insertable switch module are physically supported by the networking chassis.
having electrical distribution arrangements, e.g. power supply or data communications · CPC title
within server blades for removing heat from heat source · CPC title
Internal mounting support structures, e.g. for supporting printed circuit boards · CPC title
Blade assemblies, e.g. blade cases or inner arrangements within a blade · CPC title
Related publications grouped by family.
Answers are generated from the same data shown on this page.