Embeddable Ultrahigh Temperature Sensors and Method For Making

US2025271309A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2025271309-A1
Application numberUS-202519204887-A
CountryUS
Kind codeA1
Filing dateMay 12, 2025
Priority dateAug 27, 2019
Publication dateAug 28, 2025
Grant date

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  1. Title

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  2. Abstract

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  4. Key dates

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  5. First independent claim

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Abstract

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A microstructure device includes a heterogenous fiber formed of two materials having different compositions, the heterogenous fiber including a junction between the first and second materials. The first material is silicon carbide (SiC) and the second material is carbon (C). The junction may form an angle between the first and second materials.

First claim

Opening claim text (preview).

1 . A microstructure device comprising: a heterogenous fiber formed of two materials having different compositions, the heterogenous fiber including a junction between the first and second materials; wherein the first material is silicon carbide (SiC) and the second material is carbon (C). 2 . The microstructure device of claim 1 , wherein the first material is selected from the group consisting of an n-type silicon carbide (SiC) and a p-type silicon carbide (SiC). 3 . The microstructure device of claim 1 , wherein a diameter of the heterogenous fiber is in a range of 2 um to 100 um. 4 . The microstructure device of claim 1 , wherein the junction forms an angle in the fiber between the two materials. 5 . The microstructure device of claim 4 , wherein the angle is between 0 and 90 degrees. 6 . The microstructure device of claim 1 , further comprising a third material, having different composition from the first and second materials, the third material forming a shell around the first and second materials and the junction. 7 . The microstructure device of claim 6 , wherein the third material is selected from a group consisting of an oxide and a carbide. 8 . A process for forming a microstructure device, the process comprising: exposing a first fiber formed of silicon carbide (SiC) to focused laser radiation in the presence of hexane, wherein a second fiber of carbon (C) grows from the first fiber in a direction of the focused laser radiation; and adjusting the focus of the laser radiation to adjust a length of the second fiber. 9 . The process of claim 8 , wherein the exposing is performed under pressure in a reaction chamber. 10 . The process of claim 8 , wherein the pressure is 200 Torr. 11 . The process of claim 8 , wherein the laser radiation is produced by a 2.78 um laser with a power of approximately 2 Watts. 12 . The process of claim 8 , wherein the first fiber has a diameter of 50 micrometers. 13 . The process of claim 8 , further comprising exposing the tip of the first fiber to produce the second fiber in a direction of the first fiber's axis. 14 . The process of claim 8 , further comprising exposing the first fiber on a side thereof to produce the second fiber at an angle to the direction of the first fiber's axis. 15 . The process of claim 14 , wherein the angle is greater than 0 degrees. 16 . The process of claim 14 , wherein the angle is 90 degrees.

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Classifications

  • comprising compounds containing germanium or silicon · CPC title

  • comprising compounds containing boron, carbon, oxygen or nitrogen · CPC title

  • comprising inorganic compositions · CPC title

  • Thermoelectric active materials · CPC title

  • using microstructures, e.g. made of silicon · CPC title

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What does patent US2025271309A1 cover?
A microstructure device includes a heterogenous fiber formed of two materials having different compositions, the heterogenous fiber including a junction between the first and second materials. The first material is silicon carbide (SiC) and the second material is carbon (C). The junction may form an angle between the first and second materials.
Who is the assignee on this patent?
Leidos Inc
What technology area does this patent fall under?
Primary CPC classification G01K7/028. Mapped technology areas include Physics.
When was this patent published?
Publication date Thu Aug 28 2025 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).