Front plane laminates with outer surface electrical connections

Patent metadata

Field	Value
Publication number	US-2025264771-A1
Application number	US-202519188725-A
Country	US
Kind code	A1
Filing date	Apr 24, 2025
Priority date	Oct 2, 2020
Publication date	Aug 21, 2025
Grant date	—

Abstract

A light-transmissive substrate having an inner surface, an outer surface opposite the inner surface, and a plurality of through holes. When coupled with a light-transmissive conductive material; such as indium tin oxide (ITO), the substrate provides electrical connections between a light-transmissive electrically-conductive layer, which may be used as a top electrode in an electro-optic display, and contact spots on the outer surface of the light-transmissive substrate. Accordingly, the light-transmissive substrate allows for simpler electrical connections for electro-optic displays, especially for large format devices that may need to be cut or assembled in the field. Additionally, the redundancy of having tens to hundreds of electrical contacts minimizes the chance that a device will be rendered inoperable due to a broken electrical connection.

First claim

1 . A method of forming a light-transmissive conductive material comprising:
providing a light-transmissive substrate having a first surface and a second surface opposite the first surface; creating a plurality of through-holes through the light-transmissive substrate, wherein the through-holes have an average diameter of at least 0.1 micrometers to at most 100 micrometers; and depositing a conductive material selected from aluminum oxide, zinc oxide, indium oxide, indium-tin-oxide, and poly(3,4-ethylenedioxythiophene) on the first surface of the substrate and into the plurality of through-holes, thereby creating: an electrically-conductive layer on the first surface of the light-transmissive substrate, and a plurality of contact spots on the second surface of the light-transmissive substrate wherein the plurality of contact spots are electrically connected to the electrically-conductive layer.

2 . The method of claim 1 , wherein the second surface has at least 10 contact spots per square centimeter to at most 1000 contact spots per square centimeter.

3 . The method of claim 1 , wherein the through-holes have an average diameter of at least 0.5 micrometers to at most 10 micrometers.

4 . The method of claim 1 , wherein creating a plurality of through-holes comprises etching, cutting, or ablation.

5 . The method of claim 1 , wherein creating a plurality of through-holes comprises micro-indenting.

6 . The method of claim 1 , wherein the light transmissive substrate is a polymeric material.

7 . The method of claim 6 , wherein creating a plurality of through-holes comprises softening the polymeric material with heat, stretching the softened polymeric material over a form including a hole pattern, and applying high-pressure gas through the softened polymeric material.

8 . The method of claim 1 , wherein the through-holes have a shape selected from the group consisting of circular, linear, and ellipsoidal.

Assignees

• E Ink Corp

Inventors

• Bouchard Alain

Classifications

• G02F1/16755

  Substrates · CPC title

• G02F1/167 Primary

  by electrophoresis · CPC title

• G02F1/16757

  Microcapsules · CPC title

• G02F1/1676 Primary

  Electrodes · CPC title