Copper alloy powder for metal am and method for manufacturing additive manufacturing product

Patent metadata

Field	Value
Publication number	US-2025262666-A1
Application number	US-202319102917-A
Country	US
Kind code	A1
Filing date	Oct 24, 2023
Priority date	Oct 24, 2022
Publication date	Aug 21, 2025
Grant date	—

Abstract

This copper alloy powder for a metal AM is used in the metal AM and includes a copper alloy containing Cr and Zr, and a Cr compound layer including a Cr-containing compound is formed on a surface of a copper alloy particle constituting the copper alloy powder.

First claim

1 . A copper alloy powder for a metal AM, which is used for the metal AM, the copper alloy powder comprising:
a copper alloy containing Cr and Zr, wherein the copper alloy has a composition containing 0.5 mass % or more and 1.5 mass % or less of Cr, 0.02 mass % or more and 0.2 mass % or less of Zr, with a balance consisting of copper and impurities, and a Cr compound layer including a Cr-containing compound is formed on a surface of a copper alloy particle constituting the copper alloy powder.

2 . The copper alloy powder for the metal AM according to claim 1 ,
wherein the Cr compound layer contains oxygen.

3 . The copper alloy powder for the metal AM according to claim 1 ,
wherein a Zr-containing compound is distributed on the surface of the copper alloy particle constituting the copper alloy powder.

4 . The copper alloy powder for the metal AM according to claim 1 ,
wherein, in a cross-sectional observation of the copper alloy particle constituting the copper alloy powder, the Cr-containing compound is distributed on a crystal grain boundary.

5 . The copper alloy powder for the metal AM according to claim 1 ,
wherein, in a cross-sectional observation of the copper alloy particle constituting the copper alloy powder, a Zr-containing compound is distributed on a crystal grain boundary.

6 . The copper alloy powder for the metal AM according to claim 1 ,
wherein the Cr-containing compound contains Cr 2 Zr.

7 . The copper alloy powder for the metal AM according to claim 4 ,
wherein the Cr-containing compound contains Cr 2 Zr.

8 . The copper alloy powder for the metal AM according to claim 3 ,
wherein the Zr-containing compound contains Cu 8 Zr 3 .

9 . The copper alloy powder for the metal AM according to claim 5 ,
wherein the Zr-containing compound contains Cu 8 Zr 3 .

10 . The copper alloy powder for the metal AM according to claim 1 ,
wherein a 50% cumulative particle diameter D50 based on a volume, which is measured by a laser diffraction and scattering method, is set to be in a range of 5 μm or more and 120 μm or less.

11 . The copper alloy powder for the metal AM according to claim 1 ,
wherein a 10% cumulative particle diameter D10 based on a volume, which is measured by a laser diffraction and scattering method, is set to be in a range of 1 μm or more and 80 μm or less.

12 . The copper alloy powder for the metal AM according to claim 1 ,
wherein a 90% cumulative particle diameter D90 based on a volume, which is measured by a laser diffraction and scattering method, is set to be in a range of 10 μm or more and 150 μm or less.

13 . A method for manufacturing an additive manufacturing product, the method comprising:
a preparation step of preparing the copper alloy powder for the metal AM according to claim 1 ; and a molding step of sequentially repeating a first step of forming a powder bed including the copper alloy powder for the metal AM, and a second step of forming an additive bed by solidifying the copper alloy powder for the metal AM at a predetermined position in the powder bed to manufacture the additive manufacturing product.

14 . The copper alloy powder for the metal AM according to claim 1 ,
wherein the copper alloy powder includes one or more elements selected from a group consisting of Si, Mg, Ti, Ni, Al, Zn, Ca, Sn, Pb, Fe, Mn, Te, Nb, P, Co, Sb, Bi, Ag, Ta, W, and Mo, and a total amount of the one or more elements is 0.07 mass % or less.

Assignees

• Mitsubishi Materials Corp

Inventors

• Hirano Shingo
• Okubo Kiyoyuki
• Kumagai Satoshi
• Kato Jun
• Ikeda Hiroaki
• Mine Kazuhisa
• Nita Nobuyasu
• Kon Naochika

Classifications

• C22C9/00

  Alloys based on copper · CPC title

• B22F2304/10

  Micron size particles, i.e. above 1 micrometer up to 500 micrometer · CPC title

• B22F2301/10

  Copper · CPC title

• B22F10/28

  Powder bed fusion, e.g. selective laser melting [SLM] or electron beam melting [EBM] · CPC title

• B33Y70/00

  Materials specially adapted for additive manufacturing · CPC title