Resin composition, prepreg, resin sheet, laminate, metal foil-clad laminate, and printed wiring board

Patent metadata

Field	Value
Publication number	US-2025254792-A1
Application number	US-202318846740-A
Country	US
Kind code	A1
Filing date	Mar 16, 2023
Priority date	Mar 23, 2022
Publication date	Aug 7, 2025
Grant date	—

Abstract

An object is to provide a resin composition having a high permittivity and a low dissipation factor, and having excellent heat resistance and moisture absorption and heat resistance, and suitably used for producing an insulation layer of a printed wiring board, and a prepreg, a resin sheet, a laminate, a metal foil-clad laminate, and a printed wiring board obtainable by using the resin composition. The resin composition of the present invention contains (A) a surface coated titanium oxide in which a mass reduction rate in heating from 30° C. to 300° C. at a heating rate of 10° C./min is 0.5 mass % or less, and (B) a thermosetting compound.

First claim

1 . A resin composition comprising:
(A) a surface coated titanium oxide in which a mass reduction rate in heating from 30° C. to 300° C. at a heating rate of 10° C./min is 0.5 mass % or less, and (B) a thermosetting compound.

2 . The resin composition according to claim 1 , wherein the surface coated titanium oxide (A) has an organic layer and/or an inorganic oxide layer on the surface of a titanium oxide particle.

3 . The resin composition according to claim 2 , wherein the surface coated titanium oxide (A) further has the organic layer on the surface of the inorganic oxide layer.

4 . The resin composition according to claim 2 , wherein a total amount of the organic layer and the inorganic oxide layer is 0.1 to 10 mass % based on 100 mass % of the surface coated titanium oxide (A).

5 . The resin composition according to claim 2 , wherein the inorganic oxide layer is one or more selected from the group consisting of a layer comprising silica, a layer comprising zirconia, and a layer comprising alumina.

6 . The resin composition according to claim 2 , wherein the organic layer is a layer obtained by surface treating with an organosilicon compound.

7 . The resin composition according to claim 6 , wherein the organosilicon compound comprises one or more selected from the group consisting of silane coupling agents, organosilane, and organopolysiloxane.

8 . The resin composition according to claim 2 , wherein a content of the titanium oxide in the surface coated titanium oxide (A) is 90 to 99.9 mass % based on 100 mass % of the surface coated titanium oxide (A).

9 . The resin composition according to claim 1 , wherein a content of the surface coated titanium oxide (A) is 50 to 500 parts by mass, based on 100 parts by mass of a total resin solid content in the resin composition.

10 . The resin composition according to claim 1 , wherein the thermosetting compound (B) comprises one or more selected from the group consisting of maleimide compounds, epoxy compounds, modified polyphenylene ether compounds, cyanate ester compounds, phenol compounds, alkenyl-substituted nadiimide compounds, oxetane resins, benzoxazine compounds, and compounds having a polymerizable unsaturated group.

11 . The resin composition according to claim 10 , wherein the maleimide compound comprises one or more selected from the group consisting of bis(4-maleimidephenyl)methane, 2,2-bis(4-(4-maleimidephenoxy)-phenyl)propane, bis(3-ethyl-5-methyl-4-maleimidephenyl)methane, maleimide compounds represented by the following formula (1), and maleimide compounds represented by the following formula (2):

wherein R 1 each independently represents a hydrogen atom or a methyl group, and n1 is an integer of 1 to 10;

wherein R 2 each independently represents a hydrogen atom, an alkyl group having 1 to 5 carbon atoms, or a phenyl group, and n2 is an average value and represents 1<n2≤5.

12 . The resin composition according to claim 10 , wherein the epoxy compound comprises one or more selected from the group consisting of biphenyl aralkyl-type epoxy resins, naphthalene-type epoxy resins, and naphthylene ether-type epoxy resins.

13 . The resin composition according to claim 10 , wherein the modified polyphenylene ether compound comprises a compound represented by the following formula (3):

wherein X represents an aromatic group, —(Y—O)m- represents a polyphenylene ether moiety, R 1 , R 2 , and R 3 each independently represent a hydrogen atom, an alkyl group, an alkenyl group, or an alkynyl group, m represents an integer of 1 to 100, n represents an integer of 1 to 6, and q represents an integer of 1 to 4.

14 . The resin composition according to claim 10 , wherein the cyanate ester compound comprises one or more selected from the group consisting of phenol novolac-type cyanate ester compounds, naphthol aralkyl-type cyanate ester compounds, naphthylene ether-type cyanate ester compounds, xylene resin-type cyanate ester compounds, bisphenol M-type cyanate ester compounds, bisphenol A-type cyanate ester compounds, diallylbisphenol A-type cyanate ester compounds, bisphenol E-type cyanate ester compounds, bisphenol F-type cyanate ester compounds, and biphenyl aralkyl-type cyanate ester compounds, and prepolymers or polymers of these cyanate ester compounds.

15 . The resin composition according to claim 1 , further comprising a filler (C) different from the surface coated titanium oxide (A).

16 . The resin composition according to claim 15 , wherein the filler (C) comprises one or more selected from the group consisting of silica, alumina, barium titanate, strontium titanate, calcium titanate, aluminum nitride, boron nitride, boehmite, aluminum hydroxide, zinc molybdate, silicone rubber powder, and silicone-composite powder.

17 . The resin composition according to claim 15 , wherein a content of the filler (C) is 50 to 300 parts by mass, based on 100 parts by mass of a total resin solid content in the resin composition.

18 . The resin composition according to claim 1 , wherein the resin composition is for a printed wiring board.

19 . A prepreg, comprising:
abase material, and the resin composition according to claim 1 penetrating or coating the base material.

20 . A resin sheet comprising the resin composition according to claim 1 .

21 . A laminate comprising the prepreg according to claim 19 .

22 . A laminate comprising the resin sheet according to claim 20 .

23 . A metal foil-clad laminate, comprising:
the laminate according to claim 21 , and a metal foil disposed on one side or each of both sides of the laminate.

24 . A metal foil-clad laminate, comprising:
the laminate according to claim 22 , and a metal foil disposed on one side or each of both sides of the laminate.

25 . A printed wiring board, comprising:
an insulation layer, and a conductor layer disposed on one side or each of both sides of the insulation layer, wherein the insulation layer comprises a cured product of the resin composition according to claim 1 .

Assignees

• Mitsubishi Gas Chemical Co

Inventors

• Ito Sayaka
• TAKAMURA Tatsuro
• Kashima Naoki
• Miyahira Tetsuro
• Ogashiwa Takaaki

Classifications

• C08K9/08

  Ingredients agglomerated by treatment with a binding agent · CPC title

• C08K9/02

  Ingredients treated with inorganic substances · CPC title

• C08K2003/2241

  Titanium dioxide · CPC title

• C08K9/06

  with silicon-containing compounds · CPC title

• C08G65/485

  Polyphenylene oxides · CPC title