Active bootstrapped-supply generator
US-2024429816-A1 · Dec 26, 2024 · US
US2025253759A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2025253759-A1 |
| Application number | US-202519094993-A |
| Country | US |
| Kind code | A1 |
| Filing date | Mar 30, 2025 |
| Priority date | Sep 30, 2022 |
| Publication date | Aug 7, 2025 |
| Grant date | — |
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An element evaluation device includes a target element connected between first and second nodes; a drive switching element connected between the second node and a third node; an inductor connected between the second node and a fourth node applied with a power supply voltage; a switching circuit that allows the drive switching element to perform switching, a voltage generation circuit connected between the first and fourth nodes, and a capacitor connected between the first and third nodes. After the drive switching element is turned off, when a circulation current flows from the fourth node back to the fourth node via the second node, the first node, and the voltage generation circuit, the voltage generation circuit generates a voltage between the first and fourth nodes, with the first node being a high potential side.
Opening claim text (preview).
1 . An element evaluation device comprising: a target element connected between a first node and a second node; a drive switching element connected between the second node and a third node; an inductor connected between the second node and a fourth node applied with a power supply voltage; a switching circuit configured to allow the drive switching element to perform switching; a voltage generation circuit connected between the first node and the fourth node; and a capacitor connected between the first node and the third node, wherein after the drive switching element is switched from ON state to OFF state, when a circulation current flows in a current loop from the fourth node back to the fourth node via the second node, the first node, and the voltage generation circuit, the voltage generation circuit generates a voltage between the first node and the fourth node, with the first node being a high potential side. 2 . The element evaluation device according to claim 1 , wherein the voltage generation circuit includes one or more diodes having a forward direction from the first node to the fourth node. 3 . The element evaluation device according to claim 1 , wherein the voltage generation circuit is a DC voltage source. 4 . The element evaluation device according to claim 1 , wherein the target element is a target transistor or a target diode. 5 . The element evaluation device according to claim 1 , wherein the target element is a target transistor having a drain or a collector connected to the first node, and a source or an emitter connected to the second node. 6 . The element evaluation device according to claim 5 , wherein the target transistor is a MOSFET having a drain connected to the first node and a source connected to the second node, and wherein the MOSFET is formed of silicon carbide. 7 . The element evaluation device according to claim 5 , wherein the target transistor is fixed to OFF state. 8 . The element evaluation device according to claim 1 , wherein the target element is a target diode having a cathode connected to the first node and an anode connected to the second node. 9 . The element evaluation device according to claim 1 , wherein a turn-on delay time of the drive switching element is 5 nanoseconds or less. 10 . The element evaluation device according to claim 1 , wherein the drive switching element is constituted of a semiconductor component including a semiconductor chip in which a MOSFET is formed, a package housing the semiconductor chip, and a drain terminal, a power source terminal, a driver source terminal, and a gate terminal, which are exposed from the package, a gate electrode of the MOSFET in the semiconductor chip is connected to the gate terminal, a drain electrode of the MOSFET in the semiconductor chip is connected to the second node via the drain terminal, a source electrode of the MOSFET in the semiconductor chip is connected to the third node via the power source terminal including a package inductance component and is connected to the driver source terminal without going through the power source terminal, and the switching circuit supplies a gate signal between the gate terminal and the driver source terminal, so as to allow the drive switching element to perform switching. 11 . The element evaluation device according to claim 1 , wherein the drive switching element is a MOSFET formed of silicon carbide. 12 . The element evaluation device according to claim 1 , wherein the switching circuit allows the drive switching element to perform switching at a frequency of 10 kHz or more. 13 . The element evaluation device according to claim 1 , wherein the switching circuit allows the drive switching element to perform switching at a predetermined frequency, and sets an ON time of the drive switching element to 500 nanoseconds or less in each period of switching of the drive switching element. 14 . The element evaluation device according to claim 1 , wherein the power supply voltage is 600 V or more with respect to the potential at the third node.
using semiconductor devices only · CPC title
for the simultaneous control of series or parallel connected semiconductor devices · CPC title
in field-effect transistor switches · CPC title
Testing of individual semiconductor devices (testing of photovoltaic devices H02S50/10; testing or measuring during manufacture or treatment {H10P74/00}) · CPC title
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