Adhesion promotion layer to prevent oh roof/body delamination from anode surface

Patent metadata

Field	Value
Publication number	US-2025248274-A1
Application number	US-202418959303-A
Country	US
Kind code	A1
Filing date	Nov 25, 2024
Priority date	Jan 30, 2024
Publication date	Jul 31, 2025
Grant date	—

Abstract

Embodiments described herein generally relate to a display. More specifically, embodiments described herein relate to sub-pixel circuits and methods of forming sub-pixel circuits that may be utilized in a display such as an organic light-emitting diode (OLED) display. In an embodiment, a sub-pixel circuit is provided. The sub-pixel circuit includes a substrate, a plurality of sub-pixels, and a cathode ring disposed around a perimeter of the sub-pixel circuit. Each sub-pixel of the plurality of sub-pixels includes a plurality of overhang structures disposed over the substrate, the overhang structures including a first structure, a second structure and an extension disposed past a sidewall of the first structure, a metal structure disposed over the substrate, an adhesion layer disposed under first structure of the plurality of overhang structures, an overhang gap fill structure, an organic OLED material disposed over the metal structure, and a cathode disposed over the OLED material.

First claim

1 . A sub-pixel circuit comprising:
a substrate; a plurality of metal structures disposed over the substrate; a plurality of overhang gap fill structures; a plurality of overhang structures, the plurality of overhang structures including an extension disposed past a sidewall of the overhang structure; an adhesion layer disposed over each overhang gap fill structure; an organic light-emitting diode (OLED) material disposed over each metal structure; a cathode disposed over the OLED material; and a cathode ring disposed over the substrate.

2 . The sub-pixel circuit of claim 1 , wherein adjacent overhang gap fill structures have at least one of the plurality of metal structures disposed therebetween.

3 . The sub-pixel circuit of claim 1 , wherein the cathode ring is disposed around a perimeter of the sub-pixel circuit.

4 . The sub-pixel circuit of claim 3 , wherein the sub-pixel circuit includes at least two sub-pixels.

5 . The sub-pixel circuit of claim 1 , wherein the adhesion layer comprises tin oxide (SnO 2 ).

6 . The sub-pixel circuit of claim 1 , further comprising an encapsulation layer disposed over the cathode and past an endpoint of the cathode.

7 . The sub-pixel circuit of claim 1 , wherein the cathode ring comprises a plurality of layers.

8 . The sub-pixel circuit of claim 1 , wherein the cathode ring and the metal structures comprise a same material.

9 . A sub-pixel circuit, the sub-pixel circuit comprising:
a substrate; a plurality of sub-pixels, each sub-pixel of the plurality of sub-pixels comprising:
a plurality of overhang structures disposed over the substrate, the overhang structures comprising:
a first structure;
a second structure; and
an extension disposed past a sidewall of the first structure;

a metal structure disposed over the substrate;
an adhesion layer disposed under first structure of the plurality of overhang structures;
an overhang gap fill structure;
an organic light-emitting diode (OLED) material disposed over the metal structure; and
a cathode disposed over the OLED material; and
a cathode ring disposed around a perimeter of the sub-pixel circuit.

10 . The sub-pixel circuit of claim 9 , wherein the adhesion layer is deposited using evaporation deposition.

11 . The sub-pixel circuit of claim 9 , wherein the overhang gap fill structure is disposed under the first structure of each overhang structure of the plurality of overhang structures.

12 . The sub-pixel circuit of claim 9 , wherein adjacent overhang gap fill structures have the metal structure disposed therebetween.

13 . The sub-pixel circuit of claim 9 , wherein the cathode ring and the metal structure comprise a same material.

14 . The sub-pixel circuit of claim 9 , further comprising:
an encapsulation layer disposed over the cathode and past an endpoint of the cathode, wherein the encapsulation layer extends under at least a portion of the extension of overhang structures, along the sidewall of the overhang structures, and contacts a bottom surface of the extension of the overhang structures.

15 . A method, comprising:
depositing an adhesion material over a substrate, the substrate including a plurality of metal structures, a plurality of overhang gap fill structures and a cathode ring; removing portions of the adhesion material, such that an adhesion layer is disposed at least partially over the plurality of overhang gap fill structures; forming overhang structures over the adhesion layer disposed over the plurality of overhang gap fill structures, the overhang structures including an extension disposed past a sidewall of the overhang structures; depositing an organic light-emitting diode (OLED) material over the substrate, the OLED material is disposed over the metal structures; and depositing a cathode, wherein the cathode is disposed under each extension of the overhang structures.

16 . The method of claim 15 , further comprising:
depositing an encapsulation layer over the cathode and past an endpoint of the cathode, wherein the encapsulation layer extends under at least a portion of the extension of overhang structures, along the sidewall of the overhang structures, and contacts a bottom surface of the extension of the overhang structures.

17 . The method of claim 15 , wherein the plurality of metal structures comprises a plurality of layers and the cathode ring comprises a plurality of layers.

18 . The method of claim 15 , wherein the plurality of metal structures and the cathode ring are deposited simultaneously onto the substrate.

19 . The method of claim 15 , wherein portions of the adhesion layer are removed by an etching process.

20 . The method of claim 15 , wherein the adhesion layer comprises tin oxide (SnO 2 ).

Assignees

• Applied Materials Inc

Inventors

• Lee Jungmin

Classifications

• H10K59/122

  Pixel-defining structures or layers, e.g. banks · CPC title

• H10K59/873 Primary

  Encapsulations · CPC title

• H10K59/8051

  Anodes · CPC title

• H10K71/60

  Forming conductive regions or layers, e.g. electrodes · CPC title

• H10K59/1201 Primary

  Manufacture or treatment · CPC title