Space-saving backplate assembly for a compression attached memory module
US-2025374433-A1 · Dec 4, 2025 · US
Carrier module for grounding stacked compression attached memory modules
US2025247983A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2025247983-A1 |
| Application number | US-202418428737-A |
| Country | US |
| Kind code | A1 |
| Filing date | Jan 31, 2024 |
| Priority date | Jan 31, 2024 |
| Publication date | Jul 31, 2025 |
| Grant date | — |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
A holder is provided for stacked compression attached memory modules (CAMMs). The holder includes a CAMM carrier having a first recessed area for receiving a bottom one of the CAMMs, and a second recessed area for receiving a top one of the CAMMs. The holder further includes a retention plate affixed to the CAMM carrier. The retention plate is configured to couple the bottom CAMM and the top CAMM to a ground plane of a motherboard.
First claim
Opening claim text (preview).
What is claimed is: 1 . A holder for stacked compression attached memory modules (CAMMs), the holder comprising: a CAMM carrier having a first recessed area for receiving a bottom one of the CAMMs, and a second recessed area for receiving a top one of the CAMMs; and a retention plate affixed to the CAMM carrier, the retention plate configured to couple the bottom CAMM and the top CAMM to a ground plane of a motherboard. 2 . The holder of claim 1 , wherein the retention plate includes a bottom CAMM retention screw hole. 3 . The holder of claim 2 , wherein the bottom CAMM retention screw hole is configured to couple the bottom CAMM to the ground plane. 4 . The holder of claim 1 , wherein the retention plate includes a bottom CAMM contact spring. 5 . The holder of claim 4 , wherein the bottom CAMM contact spring is configured to couple the bottom CAMM to the ground plane. 6 . The holder of claim 5 , wherein the retention plate further includes a top CAMM contact spring. 7 . The holder of claim 6 , wherein the top CAMM contact spring is configured to couple the top CAMM to the ground plane. 8 . The holder of claim 1 , wherein the retention plate is further configured to couple a shield can to the ground plane. 9 . The holder of claim 8 , wherein the retention plate further includes a shield can spring. 10 . The holder of claim 9 , wherein the shield can spring is configured to couple the shield canto the common ground. 11 . A method for grounding compression attached memory modules (CAMMs), the method comprising: installing a bottom one of the CAMMs to a motherboard; placing a CAMM carrier atop the bottom CAMM, the bottom CAMM fitting into a first recessed area for receiving the bottom CAMM; affixing a retention plate to the CAMM carrier; securing a top one of the CAMMS to the CAMM carrier, the top CAMM fitting into a second recessed area for receiving the top CAMM; and coupling, by the retention plate, the bottom CAMM and the top CAMM to a ground plane of the motherboard. 12 . The method of claim 11 , wherein the retention plate includes a bottom CAMM retention screw hole. 13 . The method of claim 12 , wherein the bottom CAMM retention screw hole is configured to couple the bottom CAMM to the ground plane. 14 . The method of claim 11 , wherein the retention plate includes a bottom CAMM contact spring. 15 . The method of claim 14 , wherein the bottom CAMM contact spring is configured to couple the bottom CAMM to the ground plane. 16 . The method of claim 15 , wherein the retention plate further includes a top CAMM contact spring. 17 . The method of claim 16 , wherein the top CAMM contact spring is configured to couple the top CAMM to the ground plane. 18 . The method of claim 11 , wherein the retention plate is further configured to couple a shield can to the ground plane. 19 . The method of claim 18 , wherein the retention plate further includes a shield can spring configured to couple the shield canto the common ground. 20 . An information handling system, comprising: a motherboard; a bottom compression attached memory module (CAMM); a top CAMM; and a holder to stack the bottom CAMM and the top CAMM, the holder including: a CAMM carrier having a first recessed area for receiving the bottom CAMM, and a second recessed area for receiving the top CAMM; and a retention plate affixed to the CAMM carrier, the retention plate configured to couple the bottom CAMM and the top CAMM to a ground plane of a motherboard.
Assignees
Inventors
Classifications
- G06F1/183Primary
Internal mounting support structures, e.g. for supporting printed circuit boards · CPC title
by turn-bolt or screw member · CPC title
- H05K7/1422Primary
Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames · CPC title
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Frequently asked questions
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- What does patent US2025247983A1 cover?
- A holder is provided for stacked compression attached memory modules (CAMMs). The holder includes a CAMM carrier having a first recessed area for receiving a bottom one of the CAMMs, and a second recessed area for receiving a top one of the CAMMs. The holder further includes a retention plate affixed to the CAMM carrier. The retention plate is configured to couple the bottom CAMM and the top CA…
- Who is the assignee on this patent?
- Dell Products Lp
- What technology area does this patent fall under?
- Primary CPC classification G06F1/183. Mapped technology areas include Physics.
- When was this patent published?
- Publication date Thu Jul 31 2025 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 7 related publications on this page (citations in our corpus or others sharing the same primary CPC).