Power electronic system with conductor having damping function

Patent metadata

Field	Value
Publication number	US-2025239378-A1
Application number	US-202418985924-A
Country	US
Kind code	A1
Filing date	Dec 18, 2024
Priority date	Dec 19, 2023
Publication date	Jul 24, 2025
Grant date	—

Abstract

A power electronic system with conductor having damping function is provided. The power electronic system includes power components and a conductor. The conductor is configured to connect the power components, and includes a damping part disposed on a surface of the conductor. The damping part is at least partially formed with a damping material having different resistances at different frequencies, and a relative permeability of the damping material is greater than 1 at a frequency higher than 1 MHz. The damping part forms first and second paths for first and second power currents flowing between the power components respectively, the first power current is at a frequency higher than 1 MHz, the second power current is at a frequency lower than 1 MHz, and a resistance of the first path is higher than a resistance of the second path.

First claim

What is claimed is:

1 . A power electronic system, comprising:
power components; and a conductor, configured to connect the power components, and comprising a damping part disposed on a surface of the conductor, wherein the damping part is at least partially formed with a damping material having different resistances at different frequencies, and a relative permeability of the damping material is greater than 1 at a frequency higher than 1 MHz, wherein the damping part forms first and second paths for first and second power currents flowing between the power components respectively, the first power current is at a frequency higher than 1 MHz, the second power current is at a frequency lower than 1 MHz, and a resistance of the first path is higher than a resistance of the second path.

2 . The power electronic system according to claim 1 , wherein the damping part comprises a first layer and a second layer, the first layer has an average roughness greater than 20 μm and/or a maximum height roughness greater than 50 μm, and the second layer is disposed on the first layer and is formed by the damping material.

3 . The power electronic system according to claim 2 , wherein the first layer is covered by the second layer.

4 . The power electronic system according to claim 2 , wherein the second layer is configured to fill in indentations of the first layer.

5 . The power electronic system according to claim 2 , wherein the conductor comprises two said damping parts on two opposite surfaces of the conductor.

6 . The power electronic system according to claim 5 , wherein two second layers of the two damping parts are formed by a first material and a second material, which are different and are both comprised by the damping material, respectively.

7 . The power electronic system according to claim 1 , wherein the conductor comprises two said damping parts on two opposite surfaces of the conductor.

8 . The power electronic system according to claim 7 , wherein the two damping parts are formed by a first material and a second material, which are different and are both comprised by the damping material, respectively.

9 . The power electronic system according to claim 1 , wherein the conductor comprises a plurality of body parts, two opposite surfaces of each of the plurality of body parts are covered by two said damping parts respectively, and any two of the plurality of body parts neighboring to each other are insulated by an insulation layer.

10 . The power electronic system according to claim 1 , wherein the damping material comprises nickel, iron and aluminum.

11 . The power electronic system according to claim 1 , wherein the conductor is configured as a trace of a printed circuit board, a terminal pin of a device package, or a trace, a clip or a lead frame terminal of a power module package.

12 . A power electronic system, comprising:
power components; and a conductor, configured to connect the power components, and comprising a damping part on a surface of the conductor, wherein the damping part has an average roughness greater than 20 μm and/or a maximum height roughness greater than 50 μm.

13 . The power electronic system according to claim 12 , wherein the conductor comprises two said damping parts on two opposite surfaces of the conductor.

Assignees

• Delta Electronics Inc

Inventors

• Zhang Boyi
• Wang Ruxi
• Barbosa Peter Mantovanelli

Classifications

• H10W70/66

  Conductive materials thereof · CPC title

• H10W70/40

  Leadframes · CPC title

• H10W72/50

  Bond wires · CPC title

• H02M1/00

  Details of apparatus for conversion · CPC title

• H02M1/44 Primary

  Circuits or arrangements for compensating for electromagnetic interference in converters or inverters · CPC title