Multilayer electronic component

Patent metadata

Field	Value
Publication number	US-2025233572-A1
Application number	US-202519017850-A
Country	US
Kind code	A1
Filing date	Jan 13, 2025
Priority date	Jan 15, 2024
Publication date	Jul 17, 2025
Grant date	—

Abstract

A multilayer electronic component includes a first inductor, a second inductor, a capacitor, and a multilayer stack. The first inductor and the second inductor are arranged so that a first opening of the first inductor and a second opening of the second inductor do not face each other. The capacitor includes a capacitor conductor layer. The capacitor conductor layer includes a first overlapping portion overlapping with at least one first inductor conductor layer forming the first inductor when seen in a stacking direction.

First claim

What is claimed is:

1 . A multilayer electronic component comprising:
a first inductor; a second inductor; a capacitor; and a multilayer stack configured to integrate the first inductor, the second inductor, and the capacitor with each other and including a plurality of dielectric layers stacked together, wherein the first inductor includes at least one first inductor conductor layer wound about a first axis extending in a direction parallel to a stacking direction of the plurality of dielectric layers, the second inductor includes at least one second inductor conductor layer wound about a second axis extending in a direction parallel to the stacking direction, the first inductor and the second inductor are arranged so that a first opening surrounded by the at least one first inductor conductor layer and a second opening surrounded by the at least one second inductor conductor layer do not overlap with each other when seen in the stacking direction, the capacitor includes a capacitor conductor layer, and the capacitor conductor layer includes a first overlapping portion extending from the at least one second inductor conductor layer toward the at least one first inductor conductor layer when seen in the stacking direction and overlapping with the at least one first inductor conductor layer when seen in the stacking direction.

2 . The multilayer electronic component according to claim 1 , wherein the capacitor conductor layer is electrically connected to the at least one second inductor conductor layer.

3 . The multilayer electronic component according to claim 1 , wherein the at least one first inductor conductor layer includes a second overlapping portion overlapping with the first overlapping portion when seen in the stacking direction and forming the capacitor together with the first overlapping portion.

4 . The multilayer electronic component according to claim 3 , wherein
the at least one first inductor conductor layer includes an extending portion having a predetermined length and a smooth outer edge, and the second overlapping portion is a part of the extending portion.

5 . The multilayer electronic component according to claim 1 , wherein
the capacitor conductor layer is present within an imaginary rectangular region including four sides when seen in the stacking direction, and when seen in the stacking direction, each of the four sides overlaps with an outer edge of one of the at least one first inductor conductor layer and the at least one second inductor conductor layer, and does not overlap with a portion except for an outer edge of the other of the at least one first inductor conductor layer and the at least one second inductor conductor layer.

6 . The multilayer electronic component according to claim 1 , wherein
the at least one first inductor conductor layer includes a plurality of first inductor conductor layers, the plurality of first inductor conductor layers includes a first specific inductor conductor layer and a second specific inductor conductor layer that are arranged at a predetermined interval in the stacking direction, and the capacitor conductor layer are arranged between the first specific inductor conductor layer and the second specific inductor conductor layer in the stacking direction.

7 . The multilayer electronic component according to claim 6 , wherein
the plurality of first inductor conductor layers further include a third specific inductor conductor layer arranged between the first specific inductor conductor layer and the second specific inductor conductor layer in the stacking direction, and the first overlapping portion overlaps with the third specific inductor conductor layer when seen in the stacking direction.

8 . The multilayer electronic component according to claim 6 , wherein
the at least one second inductor conductor layer includes a plurality of second inductor conductor layers, the plurality of second inductor conductor layers includes a third specific inductor conductor layer located at a distal end of one direction parallel to the stacking direction and a fourth specific inductor conductor layer located at a distal end of a direction opposite to the one direction, and the capacitor conductor layer is arranged between the third specific inductor conductor layer and the fourth specific inductor conductor layer in the stacking direction.

9 . The multilayer electronic component according to claim 1 , wherein the capacitor conductor layer further includes a non-overlapping portion being connected to the first overlapping portion and overlapping with the first opening when seen in the stacking direction.

10 . The multilayer electronic component according to claim 9 , wherein an area of the non-overlapping portion is smaller than an area of the first overlapping portion.

11 . The multilayer electronic component according to claim 9 , wherein the non-overlapping portion includes an end edge having a shape in conformity with a curve shape of the at least one first inductor conductor layer.

12 . The multilayer electronic component according to claim 1 , wherein
the first inductor includes a first end and a second end, and the capacitor is connected between the first end and the second end of the first inductor in circuit configuration.

13 . A multilayer electronic component comprising:
an inductor; a capacitor; a multilayer stack configured to integrate the inductor and the capacitor with each other and including a plurality of dielectric layers stacked together, wherein the inductor includes at least one inductor conductor layer wound about an axis extending in a direction parallel to a stacking direction of the plurality of dielectric layers, the at least one inductor conductor layer includes an extending portion having a predetermined length and a smooth outer edge, the capacitor includes a capacitor conductor layer, and the capacitor conductor layer includes a first overlapping portion extending from an outer side of the at least one inductor conductor layer toward an opening surrounded by the at least one inductor conductor layer when seen in the stacking direction and overlapping with the extending portion when seen in the stacking direction.

14 . The multilayer electronic component according to claim 13 , wherein the extending portion includes a second overlapping portion overlapping with the first overlapping portion when seen in the stacking direction and forming the capacitor together with the first overlapping portion.

15 . The multilayer electronic component according to claim 13 , wherein
the at least one inductor conductor layer includes a plurality of inductor conductor layers, the plurality of inductor conductor layers include a first specific inductor conductor layer and a second specific inductor conductor layer that are arranged at a predetermined interval in the stacking direction, and the capacitor conductor layer is arranged between the first specific inductor conductor layer and the second specific inductor conductor layer in the stacking direction.

16 . The multilayer electronic component according to claim 15 , wherein
the plurality of inductor conductor layers further include a third specific inductor conductor layer arranged between the first specific inductor conductor layer and the second specific inductor conductor layer in the stacking direction, and the first overlapping portion overlaps with the third specific inductor conductor layer when seen in the stacking direction.

17 . The multilayer electronic component according

Assignees

• Tdk Corp

Inventors

• Tsukamoto Kazuhiro

Classifications

• H03H9/64

  using surface acoustic waves · CPC title

• H03H9/542 Primary

  including passive elements (H03H9/545 takes precedence) · CPC title

• H03H2001/0085

  Multilayer, e.g. LTCC, HTCC, green sheets · CPC title

• H03H7/0115 Primary

  comprising only inductors and capacitors (H03H7/075, H03H7/09, H03H7/12, H03H7/13 take precedence) · CPC title

• H01F2017/0026

  Multilayer LC-filter · CPC title