Composition, molded body, laminate, and resin

US2025223495A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2025223495-A1
Application numberUS-202519092339-A
CountryUS
Kind codeA1
Filing dateMar 27, 2025
Priority dateSep 28, 2022
Publication dateJul 10, 2025
Grant date

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

The disclosure aims to provide a composition capable of suppressing fluororesin agglomeration, which may lead to strands with a poor appearance, even when the proportion of the fluororesin is increased, and also aims to provide a molded article, a laminate, and a resin. The disclosure relates to a composition containing: a fluororesin A; and a resin B other than the fluororesin A, the resin B having a melt flow rate of 30 g/10 min or higher at a melting point +12° C., at least one of the fluororesin A or the resin B containing a group (I) represented by the following formula:wherein R1 and R2 are the same as or different from each other, are each hydrogen or an organic group, and optionally bond to each other to form a ring structure; and a double line composed of a solid line and a dotted line represents a single bond or a double bond.

First claim

Opening claim text (preview).

1 . A composition comprising: a fluororesin A; and a resin B other than the fluororesin A, the resin B having a melt flow rate of 30 g/10 min or higher at a melting point +12° C., at least one of the fluororesin A or the resin B containing a group (I) represented by the following formula: wherein R 1 and R 2 are the same as or different from each other, are each hydrogen or an organic group, and optionally bond to each other to form a ring structure; and a double line composed of a solid line and a dotted line represents a single bond or a double bond. 2 . The composition according to claim 1 , wherein at least one of the fluororesin A or the resin B has a thermal decomposition temperature of 330° C. or higher. 3 . The composition according to claim 1 or 2 , wherein the fluororesin A includes at least one selected from the group consisting of polytetrafluoroethylene, a tetrafluoroethylene/perfluoro(alkyl vinyl ether)copolymer, and a tetrafluoroethylene/hexafluoropropylene copolymer. 4 . The composition according to any one of claims 1 to 3 , wherein the resin B includes at least one selected from the group consisting of a liquid crystal polymer, polyetherimide, polyphenylene sulfide, polyaryl ether ketone, polysulfone, and polyethersulfone. 5 . The composition according to any one of claims 1 to 4 , wherein the fluororesin A is contained in an amount of 10% by volume or more. 6 . The composition according to any one of claims 1 to 5 , wherein the group (I) is an oxazoline group. 7 . The composition according to claim 6 , wherein the oxazoline group is derived from an oxazoline compound. 8 . A molded article comprising the composition according to any one of claims 1 to 7 . 9 . The molded article according to claim 8 , which is intended to be used for a dielectric material. 10 . A laminate comprising: metal foil; and the molded article according to claim 8 or 9 . 11 . The laminate according to claim 10 , wherein the metal foil comprises copper. 12 . A resin comprising a group (I) represented by the following formula and having a thermal decomposition temperature of 330° C. or higher: wherein R 1 and R 2 are the same as or different from each other, are each hydrogen or an organic group, and optionally bond to each other to form a ring structure; and a double line composed of a solid line and a dotted line represents a single bond or a double bond. 13 . The resin according to claim 12 , further comprising an amide group and an ester group. 14 . The resin according to claim 12 or 13 , wherein the group (I) is an oxazoline group. 15 . The resin according to claim 14 , wherein the oxazoline group is derived from an oxazoline compound. 16 . The resin according to any one of claims 12 to 15 , wherein the resin has a melt flow rate of 30 g/10 min or higher at a melting point +12° C. 17 . The resin according to claim 16 , wherein the resin is a liquid crystal polymer, polyetherimide, polyphenylene sulfide, polyaryl ether ketone, polysulfone, or polyethersulfone. 18 . The resin according to any one of claims 12 to 15 , wherein the resin is a fluororesin. 19 . The resin according to claim 18 , wherein the fluororesin includes at least one selected from the group consisting of polytetrafluoroethylene, a tetrafluoroethylene/perfluoro(alkyl vinyl ether)copolymer, and a tetrafluoroethylene/hexafluoropropylene copolymer. 20 . The resin according to claim 18 or 19 , wherein the fluororesin is insoluble in an aprotic solvent. 21 . The resin according to claim 20 , wherein the aprotic solvent includes at least one selected from the group consisting of a perfluorinated aromatic compound, a perfluorinated trialkylamine, a perfluorinated alkane, a hydrofluorocarbon, a perfluorinated cyclic ether, a hydrofluoroether, and an olefin compound containing at least one chlorine atom. 22 . The resin according to any one of claims 12 to 21 , wherein the resin is a resin modifier.

Assignees

Inventors

Classifications

  • the heterocyclic ring containing nitrogen and oxygen atoms · CPC title

  • C09K19/542Primary

    Macromolecular compounds · CPC title

  • characterised by the presence of specified groups {, e.g. terminal or pendant functional groups} · CPC title

  • Compositions of unspecified macromolecular compounds · CPC title

  • Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain (of polyester-amides C08L77/12; of polyester-imides C08L79/08); Compositions of derivatives of such polymers · CPC title

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What does patent US2025223495A1 cover?
The disclosure aims to provide a composition capable of suppressing fluororesin agglomeration, which may lead to strands with a poor appearance, even when the proportion of the fluororesin is increased, and also aims to provide a molded article, a laminate, and a resin. The disclosure relates to a composition containing: a fluororesin A; and a resin B other than the fluororesin A, the resin B h…
Who is the assignee on this patent?
Univ Yamagata Nat Univ Corp, Daikin Ind Ltd
What technology area does this patent fall under?
Primary CPC classification C09K19/3486. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Thu Jul 10 2025 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).