Piezoelectric device and method of forming the same
US-2024032429-A1 · Jan 25, 2024 · US
US2025221314A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2025221314-A1 |
| Application number | US-202418999251-A |
| Country | US |
| Kind code | A1 |
| Filing date | Dec 23, 2024 |
| Priority date | Dec 27, 2023 |
| Publication date | Jul 3, 2025 |
| Grant date | — |
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There is provided a stacked substrate including: a substrate; and a piezoelectric film provided on the substrate and composed of an alkali niobium oxide containing potassium, sodium, niobium, and oxygen, wherein SIMS analysis of a region of the substrate ranging from a surface of the substrate on which the piezoelectric film is provided to a depth of 1 μm toward a surface of the substrate opposite to the surface on which the piezoelectric film is provided, reveals that a concentration of potassium is 5E15 cm −3 or less, and a concentration of sodium is 5E15 cm −3 or less, and an orientation rate of crystals constituting the piezoelectric film in a (001) direction is 96% or more.
Opening claim text (preview).
1 . A stacked substrate comprising: a substrate; and a piezoelectric film provided on the substrate and composed of an alkali niobium oxide containing potassium, sodium, niobium, and oxygen, wherein SIMS analysis of a region of the substrate ranging from a surface of the substrate on which the piezoelectric film is provided to a depth of 1 μm toward a surface of the substrate opposite to the surface on which the piezoelectric film is provided, reveals that a concentration of potassium is 5E15 cm −3 or less, and a concentration of sodium is 5E15 cm −3 or less, and an orientation rate of crystals constituting the piezoelectric film in a (001) direction is 96% or more. 2 . The stacked substrate according to claim 1 , wherein the piezoelectric film has a piezoelectric constant e 31 of 7 C/m 2 or more. 3 . The stacked substrate according to claim 1 , wherein the substrate is any one of a semiconductor substrate, a resin substrate, a glass substrate, and a metal substrate. 4 . The stacked substrate according to claim 1 , wherein the substrate is a silicon substrate, and has a semiconductor element on the substrate. 5 . The stacked substrate according to claim 4 , wherein the substrate has a protective film that protects the semiconductor element. 6 . A method for manufacturing a stacked substrate, the method comprising: preparing a substrate; and depositing a piezoelectric film composed of an alkali niobium oxide containing potassium, sodium, niobium, and oxygen on the substrate by a sputtering method, wherein in the depositing the piezoelectric film, a depositing temperature is 400° C. or more and less than 500° C., an oxygen partial pressure is 0.0025 Pa or more and less than 0.01 Pa, and an atmospheric pressure is 0.03 Pa or more and less than 0.1 Pa. 7 . A piezoelectric element comprising: a substrate; and a piezoelectric film provided on the substrate and composed of an alkali niobium oxide containing potassium, sodium, niobium, and oxygen, wherein SIMS analysis of a region of the substrate ranging from a surface of the substrate on which the piezoelectric film is provided to a depth of 1 μm toward a surface of the substrate opposite to the surface on which the piezoelectric film is provided, reveals that a concentration of potassium is 5E15 cm −3 or less, and a concentration of sodium is 5E15 cm −3 or less, and an orientation rate of crystals constituting the piezoelectric film in a (001) direction is 96% or more.
Membrane type · CPC title
by vapour phase deposition · CPC title
Integrated devices, or assemblies of multiple devices, comprising at least one piezoelectric, electrostrictive or magnetostrictive element covered by groups H10N30/00 – H10N35/00 · CPC title
Alkali metal based oxides, e.g. lithium, sodium or potassium niobates · CPC title
of the type ABO3 with A representing alkali, alkaline earth metal or Pb and B representing a refractory or rare earth metal · CPC title
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