Resin molded body and method for producing the same

Patent metadata

Field	Value
Publication number	US-2025215172-A1
Application number	US-202318835227-A
Country	US
Kind code	A1
Filing date	Feb 1, 2023
Priority date	Feb 4, 2022
Publication date	Jul 3, 2025
Grant date	—

Abstract

To provide a resin molded body having AlN whiskers with excellent thermal conductivity, and a method for producing the same. The resin molded body includes at least, AlN whiskers each having a fibrous AlN single-crystal body having a surface and an oxygen-containing layer covering the surface of the fibrous AlN single-crystal body, and a resin material, wherein a weight ratio of the AlN whiskers is in a range of 3.0 wt % or more and 65.0 wt % or less.

First claim

1 . A resin molded body comprising: at least,
AlN whiskers each having a fibrous AlN single-crystal body having a surface and an oxygen-containing layer covering the surface of the fibrous AlN single-crystal body; and a resin material, wherein a weight ratio of the AlN whiskers is in a range of 3.0 wt % or more and 65.0 wt % or less.

2 . The resin molded body as claimed in claim 1 , wherein the weight ratio of the AlN whiskers is in the range of 3.0 wt % or more and 20.0 wt % or less, or 50.0 wt % or more and 65.0 wt % or less.

3 . The resin molded body as claimed in claim 1 , wherein the AlN whiskers are mainly composed of a diameter of 1.0 μm or more.

4 . The resin molded body as claimed in claim 1 , wherein the AlN whiskers come into contact with each other to form a sheet-like formed body having a network structure, and the resin material is impregnated in the sheet-like formed body.

5 . The resin molded body as claimed in claim 1 , wherein the resin material is formed of a plurality of spherical resin particles each having a surface, and
wherein the surface of the plurality of spherical resin particles is covered with the AlN whiskers, thereby forming a cover formed body.

6 . The resin molded body as claimed in claim 1 , wherein the resin molded body has a number of contact points being a total number of points at which the AlN whiskers contact with each other per unit volume, and the number of contact points is in a range of 0.015/μm 3 or more and 1/μm 3 or less.

7 . The resin molded body as claimed in claim 6 , wherein the number of contact points is in the range of 0.016/μm 3 or more and 1/μm 3 or less.

8 . The resin molded body as claimed in claim 6 , wherein the number of contact points is in the range of 0.020/μm 3 or more and 1/μm 3 or less.

9 . The resin molded body as claimed in claim 6 , wherein the number of contact points is in the range of 0.023/μm 3 or more and 1/μm 3 or less.

10 . The resin molded body as claimed in claim 1 , wherein each of the AlN whiskers has a diameter in a range of 1.0 μm or more and 10 μm or less.

11 . The resin molded body as claimed in claim 1 , wherein each of the AlN whiskers has a diameter in a range of 5.0 μm or more and 10 μm or less.

12 . A method for producing a resin molded body including at least, AlN whiskers each having a fibrous AlN single-crystal body having a surface and an oxygen-containing layer covering the surface of the fibrous AlN single-crystal body, and a resin material, the method comprising:
forming a sheet-like formed body having a network structure in which the AlN whiskers come into contact with each other; and impregnating the sheet-like formed body with the resin material.

13 . A method for producing a resin molded body including at least, AlN whiskers each having a fibrous AlN single-crystal body having a surface and an oxygen-containing layer covering the surface of the fibrous AlN single-crystal body, and a plurality of spherical resin particles each having a surface, the method comprising:
forming a cover formed body in which the surface of the plurality of spherical resin particles is covered with the AlN whiskers; and pressing the cover formed body.

Assignees

• National Univ Corporation Tokai National Higher Education And Research System
• U Map Co Ltd

Inventors

• Ujihara Toru
• Okuno Kazuki
• Okada Shiho
• Watanabe Shota
• Matsumoto Masaki

Classifications

• C08K2201/003

  Additives being defined by their diameter · CPC title

• C08K9/02

  Ingredients treated with inorganic substances · CPC title

• C08J2363/00

  Characterised by the use of epoxy resins; Derivatives of epoxy resins · CPC title

• C08J2361/04

  Condensation polymers of aldehydes or ketones with phenols only · CPC title

• C08J3/128

  Polymer particles coated by inorganic and non-macromolecular organic compounds · CPC title