Light Emitting Display Device

Patent metadata

Field	Value
Publication number	US-2025212672-A1
Application number	US-202418916468-A
Country	US
Kind code	A1
Filing date	Oct 15, 2024
Priority date	Dec 20, 2023
Publication date	Jun 26, 2025
Grant date	—

Abstract

The present disclosure relates to a light emitting display device having a heat dissipation structure. A light emitting display device comprises: a substrate; a display layer on the substrate; a protective layer under the substrate; a heat insulating layer under the protective layer; a heat dissipation layer under the heat insulating layer; and a driving element under the heat dissipation layer.

First claim

What is claimed is:

1 . A light emitting display comprising:
a substrate; a display layer on the substrate; a protective layer under the substrate; a heat insulating layer under the protective layer; a heat dissipation layer under the heat insulating layer; and a driving element under the heat dissipation layer.

2 . The light emitting display according to claim 1 , wherein the heat insulating layer prevents first heat generated from the display layer from being transferred to the driving element, and prevents second heat generated from the driving element from being transferred to the display layer.

3 . The light emitting display according to claim 1 , wherein the heat dissipation layer discharges heat generated from the driving element outside through a horizontal surface direction of the substrate.

4 . The light emitting display according to claim 3 , wherein the heat insulating layer includes:
a metal layer under the heat insulating layer; and a thermal conductive adhesive layer under the metal layer.

5 . The light emitting display according to claim 4 , wherein the thermal conductive adhesive layer transfers the heat generated from the driving element to the metal layer,
wherein the metal layer discharges the heat transferred from the thermal conductive adhesive layer outside along a horizontal surface direction of the substrate.

6 . The light emitting display according to claim 4 , wherein the metal layer includes aluminum, and
wherein the thermal conductive adhesive layer includes a filler and a silicon-based resin with a volume content ratio in a range of 8:2 to 9:1, the filler including aluminum particles and silicon nitride particles with a volume content ratio of 8:2.

7 . The light emitting display according to claim 1 , further comprising:
a thermal conductive cover layer on the display layer.

8 . The light emitting display according to claim 7 , wherein the thermal conductive cover layer includes a filler and a silicon-based resin with a volume content ratio in a range of 8:2 to 9:1, the filler including aluminum particles and silicon nitride particles with a volume content ratio of 8:2.

9 . The light emitting display according to claim 1 , wherein the heat insulating layer includes:
a first non-thermal conductive adhesive layer under the protective layer; a shock absorbing layer under the first non-thermal conductive adhesive layer; and a second non-thermal conductive adhesive layer under the shock absorbing layer.

10 . The light emitting display according to claim 9 , wherein each of the first non-thermal conductive adhesive layer and the second non-thermal conductive adhesive layer includes a filler and an acryl-based resin with a volume content ratio in a range of 3:7 to 6:4, the filler including aluminum particles and silicon nitride particles with a volume content ratio of 2:8.

11 . The light emitting display according to claim 1 , further comprising:
a thermal conductive cover layer on the display layer, wherein the heat dissipation layer includes:
a metal layer under the heat insulating layer; and
a thermal conductive adhesive layer under the metal layer, and
wherein the heat insulating layer includes:
a first non-thermal conductive adhesive layer under the protective layer;
a shock absorbing layer under the first non-thermal conductive adhesive layer; and
a second non-thermal conductive adhesive layer under the shock absorbing layer.

12 . The light emitting display according to claim 11 , wherein each of the thermal conductive cover layer and the thermal conductive adhesive layer includes a filler and a silicon-based resin with a volume content ratio in a range of 8:2 to 9:1, the filler including aluminum particles and silicon nitride particles with a volume content ratio of 8:2, and
wherein each of the first non-thermal conductive adhesive layer and the second non-thermal conductive adhesive layer includes a filler and an acryl-based resin with a volume content ratio in a range of 3:7 to 6:4, the filler including aluminum particles and silicon nitride particles with a volume content ratio of 2:8.

13 . The light emitting display according to claim 1 , further comprising:
a heat dissipation element attached to the driving element.

14 . The light emitting display according to claim 13 , wherein the heat dissipation element includes a filler and a silicon-based resin with a volume content ratio in a range of 8:2 to 9:1, the filler including aluminum particles and silicon nitride particles with a volume content ratio of 8:2.

15 . The light emitting display according to claim 13 , wherein the heat dissipation element includes:
a base portion; and a pattern portion on the base portion, the pattern portion including a plurality of patterns arrayed with a predetermined interval on the base portion.

16 . The light emitting display according to claim 15 , wherein the pattern portion includes a cross-sectional shape of any one shape of triangle, rectangle, and semicircle.

Assignees

• Lg Display Co Ltd

Inventors

• Cho Wonjong
• Jung Jinhyung
• Kim Huyngguen

Classifications

• H10K59/129

  Chiplets · CPC title

• H10K59/87

  Passivation; Containers; Encapsulations · CPC title

• H10K77/10

  Substrates, e.g. flexible substrates · CPC title

• H10K59/8794 Primary

  Arrangements for heating and cooling · CPC title