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US-2024431075-A1 · Dec 26, 2024 · US
Refrigerants for and methods of cooling electronics
US2025203808A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2025203808-A1 |
| Application number | US-202418976675-A |
| Country | US |
| Kind code | A1 |
| Filing date | Dec 11, 2024 |
| Priority date | Dec 15, 2023 |
| Publication date | Jun 19, 2025 |
| Grant date | — |
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- Title
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Abstract
Official abstract text for this publication.
Methods of heating and/or cooling of electronic components, articles and/or devices during the manufacture and/or operation thereof comprising: providing an electronic component, article or device which is being manufactured and/or being operated for its intended purpose; and transferring heat to and/or from said electronic component, article and/or device during at least a portion of said manufacturing and/or operating process by directly or indirectly transferring heat between said electronic component, article and/or device and a refrigerant fluid comprising at least 1,3,4,4,4-pentafluoro-(3-trifluoromethyl)-but-1-ene.
First claim
Opening claim text (preview).
1 . A method of heating and/or cooling of electronic components, articles and/or devices during the manufacture and/or operation thereof comprising: (a) providing an electronic component, article or device which is being manufactured and/or being operated for its intended purpose; and (b) transferring heat to and/or from said electronic component, article and/or device during at least a portion of said manufacturing and/or operating process by directly or indirectly transferring heat between said electronic component, article and/or device and a refrigerant fluid comprising at least trans-1,3,4,4,4-pentafluoro-(3-trifluoromethyl)-but-1-ene (hereinafter “HFO-1438ezy(E)”). 2 . The method of claim 1 wherein said step of transferring heat comprises direct heat transfer. 3 . The method of claim 1 wherein said step of transferring heat comprises indirect heat transfer. 4 . The method of claim 1 wherein said refrigerant fluid comprises at least about 10% by weigh of HFO-1438ezy(E). 5 . The method of claim 1 wherein said refrigerant fluid comprises at least about 50% by weigh of HFO-1438ezy(E). 6 . The method of claim 1 wherein said refrigerant fluid comprises at least about 75% by weigh of HFO-1438ezy(E). 7 . The method of claim 1 wherein said refrigerant fluid comprises at least about 90% by weigh of HFO-1438ezy(E). 8 . The method of claim 1 wherein said refrigerant fluid consists essentially of HFO-1438ezy(E). 9 . The method of claim 1 wherein said refrigerant fluid consists of HFO-1438ezy(E). 10 . The method of claim 1 wherein said step of transferring heat comprises cooling said electronic component, article and/or device by transferring heat from said electronic component, article and/or device to said refrigerant during at least a portion of said manufacturing and/or operating process. 11 . The method of claim 1 wherein said providing step comprises providing an electronic component comprising an integrated circuit. 12 . The method of claim 1 wherein said electronic component is in a server. 13 . The method of claim 12 wherein said server is a data center server. 14 . The method of claim 1 wherein said providing step comprises providing a battery. 15 . The method of claim 14 wherein said battery is in an electric or hybrid vehicle. 16 . The method of claim 1 wherein said step of transferring heat comprises at least partially immersing said electronic component, article and/or device in said refrigerant fluid. 17 . The method of claim 16 wherein said step of transferring heat comprises fully immersing said electronic component, article and/or device in said refrigerant fluid. 18 . The method of claim 1 wherein said providing step comprises providing an electronic article during the process of manufacturing said electronic article. 19 . The method of claim 16 wherein said electronic article is a wafer. 20 . The method of claim 17 wherein said process of manufacturing said wafer comprises etching a portion of said wafer.
Assignees
Inventors
Classifications
Liquid cooling with phase change · CPC title
- H05K7/203Primary
by immersion · CPC title
Liquid cooling without phase change · CPC title
- H05K7/20236Primary
by immersion · CPC title
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Frequently asked questions
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- What does patent US2025203808A1 cover?
- Methods of heating and/or cooling of electronic components, articles and/or devices during the manufacture and/or operation thereof comprising: providing an electronic component, article or device which is being manufactured and/or being operated for its intended purpose; and transferring heat to and/or from said electronic component, article and/or device during at least a portion of said manu…
- Who is the assignee on this patent?
- Honeywell Int Inc
- What technology area does this patent fall under?
- Primary CPC classification H05K7/203. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Thu Jun 19 2025 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).