Power converter system

Patent metadata

Field	Value
Publication number	US-2025203800-A1
Application number	US-202519063603-A
Country	US
Kind code	A1
Filing date	Feb 26, 2025
Priority date	Dec 18, 2019
Publication date	Jun 19, 2025
Grant date	—

Abstract

A power converter system includes a printed circuit board having a first connector for receiving low voltage control signals and a second connector for receiving input voltages from one or more power generators and transmitting output voltages to a power distribution unit. Power devices are mounted onto the printed circuit board to manage the input voltages and to generate the output voltages. An enclosure is mounted around the printed circuit board and power devices. The power devices engage interior surfaces of the enclosure forming a conductive heat path between the power devices, the interior surfaces, and exterior surfaces of the enclosure. The heat path conductively transfers heat from the power devices to the exterior surfaces.

First claim

1 - 11 . (canceled)

12 . A power converter system comprising:
a power distribution unit configured to distribute electrical power; a power conversion assembly configured to be integrated into the power distribution unit, the power conversion assembly including:
a printed circuit board having a first connector for receiving low voltage control signals and a second connector for receiving input voltages from the one or more power generators and transmitting output voltages to the power distribution unit;
power devices mounted onto the printed circuit board, the power devices being configured to manage the input voltages and generate the output voltages; and
control devices mounted onto the printed circuit board, the control devices being configured to receive the low voltage control signals to control the power devices;
wherein the power conversion assembly transfers heat to the power distribution unit by thermal transmission paths defined directly between the power devices and the power distribution unit when the power conversion assembly is integrated in the power distribution unit.

13 . The system of claim 12 , wherein the power devices are discrete devices that each have a single electrical switch suitable for managing electrical power loads.

14 . The system of claim 12 , wherein the power distribution unit distributes the output voltages from the power conversion assembly to one or more electrical loads on an aircraft.

15 . The system of claim 12 , wherein the power conversion assembly is an open frame unit that does not include an enclosure.

16 . The system of claim 12 , further comprising an enclosure mounted around the power conversion assembly, the enclosure having interior surfaces and exterior surfaces, the power devices engaging the interior surfaces of the enclosure forming a conductive heat path between the power devices, the interior surfaces, and the exterior surfaces that conductively transfers heat from the power devices to the exterior surfaces, the conductive heat path between the power devices and the enclosure having a combined cross-sectional area taken transverse to the direction of heat flow that is at least half the total surface area of the interior surfaces.

17 . The system of claim 16 , wherein the power devices are discrete devices that each have a single electrical switch suitable for managing electrical power loads.

18 . The system of claim 16 , wherein the enclosure includes first and second portions that assemble together and that each partially shape an internal cavity of the enclosure, and the exterior surfaces of the first and second portions include fins.

19 . The system of claim 16 , wherein the power devices engage the interior surfaces of the enclosure by a thermal interface material that eliminates air pockets between the power devices and the interior surfaces of the enclosure.

20 . The system of claim 19 , wherein the thermal interface material is a thermally conductive pad.

Assignees

• Eaton Intelligent Power Ltd

Inventors

• Baronian Armen
• Singh Yash Veer
• Suntharalingam Piranavan
• Goykhman Mikhail
• Chui Galen

Classifications

• H05K7/209 Primary

  Heat transfer by conduction from internal heat source to heat radiating structure (H05K7/20909 takes precedence) · CPC title

• H05K7/1457 Primary

  Power distribution arrangements · CPC title

• H05K7/20545

  Natural convection of gaseous coolant; Heat transfer by conduction from electronic boards · CPC title