Positive photosensitive resin composition, cured product of the same, and display device including the same

Patent metadata

Field	Value
Publication number	US-2025199402-A1
Application number	US-202318843313-A
Country	US
Kind code	A1
Filing date	Mar 1, 2023
Priority date	Mar 25, 2022
Publication date	Jun 19, 2025
Grant date	—

Abstract

A positive photosensitive resin composition may include (a) polysiloxane, and (b) a naphthoquinone diazide compound represented by formula (1):

(in the formula (1), R 1 is an alkyl group having 1 to 8 carbon atoms; Q is a naphthoquinone diazide sulfonyl group represented by the structure shown below or a hydrogen atom, and at least one of all Qs in the formula (1) is a naphthoquinone diazide sulfonyl group: n is an integer of 0 to 4; m is an integer of 4 to 8; and X is a tetravalent to octavalent organic group having 4 to 30 carbon atoms)

(in the above structure, * represents a binding site).

First claim

1 . A positive photosensitive resin composition comprising:
(a) polysiloxane (hereinafter referred to as “component (a)”), and (b) a naphthoquinone diazide compound represented by formula (1) (hereinafter referred to as “component (b)”):

(in the formula (1), R 1 is an alkyl group having 1 to 8 carbon atoms;
Q is a naphthoquinone diazide sulfonyl group represented by the structure shown below or a hydrogen atom, and at least one of all Qs in the formula (1) is a naphthoquinone diazide sulfonyl group:
n is an integer of 0 to 4;
m is an integer of 4 to 8; and
X is a tetravalent to octavalent organic group having 4 to 30 carbon atoms)

(in the above structure, * represents a binding site).

2 . The positive photosensitive resin composition according to claim 1 ,
wherein the component (b) is represented by the formula (1) in which n is 1 or 2; and R 1 is bonded at ortho position with respect to-OQ group.

3 . The positive photosensitive resin composition according to claim 1 ,
wherein an average esterification ratio of the component (b) is 75% or more.

4 . The positive photosensitive resin composition according to claim 1 ,
wherein the component (b) is represented by the formula (1) in which X includes an alicyclic structure.

5 . The positive photosensitive resin composition according to claim 1 ,
wherein the component (a) includes either or both of an epoxy group-containing repeating structural unit and an oxetane group-containing repeating structural unit; and the total amount of the epoxy group-containing repeating structural unit and the oxetane group-containing repeating structural unit is 1 to 8 mol % with respect to 100 mol % of the total repeating structural units in the component (a).

6 . The positive photosensitive resin composition according to claim 1 ,
wherein the component (a) includes an aromatic group-containing repeating structural unit, and in the component (a), the amount of the aromatic group-containing repeating structural unit is 60 mol % or more with respect to 100 mol % of the total repeating structural units of the component (a).

7 . The positive photosensitive resin composition according to claim 1 ,
wherein the component (a) includes an ethylenically unsaturated group-containing repeating structural unit, and in the component (a), an amount of the ethylenically unsaturated group-containing repeating structural unit is 10 mol % or more and 70 mol % or less with respect to 100 mol % of the total repeating structural units of the component (a).

8 . The positive photosensitive resin composition according to claim 6 ,
wherein the component (a) includes a styryl group-containing repeating structural unit, and in polysiloxane that is the component (a), an amount of the styryl group-containing repeating structural unit is 10 to 70 mol % with respect to 100 mol % of the total repeating structural units of the component (a).

9 . The positive photosensitive resin composition according to claim 1 ,
wherein the component (a) includes a dicarboxylic acid group-containing repeating structural unit, and in the component (a), an amount of the dicarboxylic acid group-containing repeating structural unit is 1 mol % or more with respect to 100 mol % of the total repeating structural units of the component (a).

10 . The positive photosensitive resin composition according to claim 9 ,
wherein a ratio M1/M2 is 0.2 to 2.5 where M1 (mol) is a mole number of the dicarboxylic acid group contained in the component (a), and M2 (mol) is a mole number of the naphthoquinone diazide group contained in the component (b).

11 . A cured product of the positive photosensitive resin composition according to claim 1 that was subjected to heat treatment.

12 . A display device comprising:
a first electrode formed on a substrate; an insulating layer formed on the first electrode so as to partially expose the first electrode; a display function section which is provided between the partially exposed first electrode and a second electrode described below and which causes an optical change upon application of a voltage; and the second electrode provided opposed to the first electrode, wherein the insulating layer includes the cured product according to claim 11 .

13 . A display device comprising a planarization film provided so as to cover bumps and dips on a substrate having a thin film transistor (TFT) formed thereon,
wherein the planarization film includes the cured product according to claim 11 .

Assignees

• Toray Industries

Inventors

• Tanaka Susumu
• Yuba Tomoyuki
• Suwa Mitsuhito

Classifications

• G03F7/0226

  characterised by the non-macromolecular additives · CPC title

• G03F7/0757 Primary

  Macromolecular compounds containing Si-O, Si-C or Si-N bonds (G03F7/0752 takes precedence) · CPC title

• G03F7/0233

  characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides · CPC title

• G03F7/0392

  the macromolecular compound being present in a chemically amplified positive photoresist composition · CPC title

• G03F7/008 Primary

  Azides (G03F7/075 takes precedence) · CPC title