High resolution advanced oled sub-pixel circuit and patterning method

Patent metadata

Field	Value
Publication number	US-2025194347-A1
Application number	US-202418956077-A
Country	US
Kind code	A1
Filing date	Nov 22, 2024
Priority date	Dec 8, 2023
Publication date	Jun 12, 2025
Grant date	—

Abstract

Embodiments described herein generally relate to a display. In one or more embodiments, a sub-pixel circuit includes at least two anodes disposed over a substrate. Adjacent anodes define a well. Adjacent overhang structures are disposed in the well. The overhang structures have an overhang thickness from the substrate to an upper surface of the overhang structures. The overhang thickness and the anode thickness are substantially equivalent. The overhang structures include overhang extensions extending past lower sidewalls. The well has a trench area defined by the lower sidewalls and a bottom surface of the overhang extensions, with a gap between the overhang extensions of the adjacent overhang structures. An organic light emitting diode (OLED) material is disposed over the anode, the upper surface of the overhang structures, under the overhang structures, and within the trench area. A cathode is disposed over the OLED material.

First claim

1 . A method, comprising:
forming a plurality of anodes over a substrate, adjacent anodes defining a respective well; depositing a first material over the plurality of anodes and within each well defined by the plurality of anodes; depositing a second material over the first material; removing the first material and the second material disposed over the plurality of anodes; etching the first material and the second material within the well to form adjacent overhang structures within each well, the overhang structures comprising a first portion disposed in the well below an uppermost surface of the anode and overhang extensions extending past lower sidewalls of the first portion, wherein the well has a trench area defined by the lower sidewalls and a bottom surface of the overhang extensions with a gap between the overhang extensions of the adjacent overhang structures; and depositing an organic light emitting diode (OLED) material over the anodes, the adjacent overhang structures, and within the well.

2 . The method of claim 1 , further comprising depositing a protective layer over the plurality of anodes and within the well.

3 . The method of claim 2 , further comprising removing a portion of the protective layer disposed over an upper surface of the plurality of anodes.

4 . The method of claim 1 , wherein the first material and the second material are different, wherein the first material has a first etch rate and the second material has a second etch rate when exposed to an etchant.

5 . The method of claim 1 , wherein etching the first material and the second material further comprises:
depositing a photoresist over the plurality of anodes and a portion of the well, wherein an opening is formed in the photoresist over a center portion of the well; widening the opening with a first etching process; etching a channel through the second material and into the first material disposed within the well with a second etching process; and selectively etching the first material within the well to form the adjacent overhang structures using a third etching process.

6 . The method of claim 5 , wherein the first etching process is an anisotropic process, the second etching process is an anisotropic process, and the third etching process is an isentropic process.

7 . The method of claim 1 , further comprising depositing a cathode material over the OLED material.

8 . The method of claim 1 , further comprising depositing an encapsulation material over the OLED material and depositing a global encapsulation material over the encapsulation material.

9 . The method of claim 1 , wherein a thickness of the adjacent overhang structures and a thickness of the plurality of anodes is substantially equivalent.

10 . The method claim 1 , wherein the plurality of anodes have a thickness from about 200 nm to about 400 nm.

11 . A method, comprising:
forming a plurality of anodes over a substrate, each anode having an uppermost surface, adjacent anodes defining a well; depositing a first material over the plurality of anodes and within the well; depositing a second material over the first material; removing the first material and the second material disposed over the plurality of anodes; etching the first material and the second material within the well to form adjacent overhang structures within the well, the adjacent overhang structures comprising:
a first portion disposed in the well below the uppermost surface of the anodes having lower sidewalls; and
a second portion disposed over the first portion, the second portion having overhang extensions, wherein at least a portion of the overhang extensions extend past the lower sidewalls, wherein the well has a trench area defined by the lower sidewalls and a bottom surface of the overhang extensions with a gap between the overhang extensions of the adjacent overhang structures;
depositing an organic light emitting diode (OLED) material over the anodes, the adjacent overhang structures, and within the trench area; depositing a cathode material over the OLED material; and depositing an encapsulation material over the cathode material.

12 . The method of claim 11 , further comprising depositing a protective layer over the plurality of anodes and within the well.

13 . The method of claim 12 , further comprising removing a portion of the protective layer disposed over an upper surface of the plurality of anodes.

14 . The method of claim 11 , wherein the first material and the second material are different, wherein the first material has a first etch rate and the second material has a second etch rate when exposed to an etchant.

15 . The method of claim 11 , wherein etching the first material and the second material further comprises:
depositing a photoresist over the plurality of anodes and a portion of the well, wherein an opening is formed in the photoresist over a center portion of the well; widening the opening with a first etching process; etching a channel through the second material and into the first material disposed within the well with a second etching process; and selectively etching the first material within the well to form the adjacent overhang structures using a third etching process.

16 . The method of claim 15 , wherein the first etching process is an anisotropic process, the second etching process is an anisotropic process, and the third etching process is an isentropic process.

17 . The method of claim 11 , wherein the first portion under the overhang extensions has a thickness less than an anode thickness.

18 . The method of claim 11 , wherein a thickness of the adjacent overhang structures and a thickness of the plurality of anodes is substantially equivalent.

19 . The method claim 11 , wherein the plurality of anodes have a thickness from about 200 nm to about 400 nm.

20 . A method, comprising:
forming a plurality of anodes over a substrate, adjacent anodes defining a well; depositing a protective layer over the plurality of anodes and within the well; depositing a first material over the plurality of anodes and within the well; depositing a second material over the first material; removing the first material and the second material disposed over the plurality of anodes; depositing a photoresist over the plurality of anodes and a portion of the well, wherein an opening is formed in the photoresist over a center portion of the well; widening the opening with a first etching process; etching a channel through the second material and into the first material disposed within the well with a second etching process; and selectively etching the first material within the well to form adjacent overhang structures using a third etching process, the adjacent overhang structures comprising:
lower sidewalls; and
overhang extensions, wherein at least a portion of the overhang extensions extend past the lower sidewall, the lower sidewalls and the overhang extensions at least partially defining a trench area within the well;
depositing an organic light emitting diode (OLED) material over the anodes, the adjacent overhang structures, and within the trench area; depositing a cathode material over the OLED material; and depositing an encapsulation material over the cathode material.

Assignees

• Applied Materials Inc

Inventors

• Lee Jungmin
• Haas Dieter

Classifications

• H10K59/873

  Encapsulations · CPC title

• H10K2102/351

  Thickness · CPC title

• H10K71/233

  by photolithographic etching · CPC title

• H10K59/35

  comprising red-green-blue [RGB] subpixels · CPC title

• H10K59/80515 Primary

  characterised by their shape · CPC title