Apparatus and method of brush cleaning using periodic chemical treatments

Patent metadata

Field	Value
Publication number	US-2025183060-A1
Application number	US-202519045165-A
Country	US
Kind code	A1
Filing date	Feb 4, 2025
Priority date	Apr 3, 2023
Publication date	Jun 5, 2025
Grant date	—

Abstract

A chemical mechanical polishing (CMP) system include apparatus and methods to clean brushes used to scrub substrates, including brush cleaning using periodic chemical treatment. One or more embodiments include a method of operating the CMP system to rotate a first one or more scrubber brushes while the first one or more scrubber brushes are in contact with a first substrate, performing, concurrent with the rotating during the first time duration, a cleaning operation for a second one or more scrubber brushes, performing, during a second time duration of the cleaning cycle, the cleaning operation for the first one or more scrubber brushes, and rotating, concurrent with the performing the cleaning operation during the second time duration, the second one or more scrubber brushes while the second one or more scrubber brushes are in contact with a second substrate.

First claim

What is claimed is:

1 . A method of operating a chemical mechanical polishing (CMP) system, comprising:
rotating, in a first brush cleaner of the CMP system during a first time duration of a cleaning cycle, a first one or more scrubber brushes while the first one or more scrubber brushes are in contact with one or more surface of a first substrate and a first substrate cleaning fluid is provided to the one or more surfaces of the first substrate; performing, concurrent with the rotating during the first time duration, a cleaning operation for a second one or more scrubber brushes in a second brush cleaner of the CMP system, wherein the cleaning operation comprises delivering a brush cleaning fluid to a surface of the second one or more scrubber brushes; performing, during a second time duration of the cleaning cycle, a cleaning operation on the first one or more scrubber brushes in the first brush cleaner, wherein the cleaning operation comprises delivering the brush cleaning fluid to a surface of the first one or more scrubber brushes; rotating, in a second brush cleaner of the CMP system, and concurrent with the performing the cleaning operation during the second time duration, the second one or more scrubber brushes while the second one or more scrubber brushes are in contact with a second substrate and the first substrate cleaning fluid is provided to the one or more surfaces of the second substrate; and rotating, in a third brush cleaner of the CMP system, and concurrent with the performing the cleaning operation during the second time duration, a third one or more scrubber brushes while the third one or more scrubber brushes are in contact with the first substrate and a second substrate cleaning fluid is provided to the one or more surfaces of the first substrate.

2 . The method of claim 1 , further comprising:
rotating, in the third brush cleaner during the first time duration, the third one or more scrubber brushes while the third one or more scrubber brushes are in contact with one or more surface of a third substrate and the first substrate cleaning fluid is provided to the one or more surfaces of the third substrate.

3 . The method of claim 1 , further comprising:
rotating, in the first brush cleaner during a third time duration of the cleaning cycle, the first one or more scrubber brushes while the first one or more scrubber brushes are in contact with a third substrate; and rotating, in the second brush cleaner during a fourth time duration, the second one or more scrubber brushes while the second one or more scrubber brushes are in contact with the third substrate.

4 . The method of claim 1 , wherein:
the brush cleaning fluid comprises a different chemical composition from the first substrate cleaning fluid, or the second substrate cleaning fluid, or both.

5 . The method of claim 1 , wherein the first substrate cleaning fluid, the second substrate cleaning fluid, or both, comprise a same chemical composition as the brush cleaning fluid.

6 . The method of claim 1 , wherein:
directing, during the first time duration, the first substrate cleaning fluid to the first substrate using a first set of nozzles of the first brush cleaner; and directing, during the second time duration, the brush cleaning fluid to the first one or more scrubber brushes using a second set of nozzles of the first brush cleaner.

7 . The method of claim 1 , further comprising:
rotating, concurrent with the rotating during the first time duration, the first one or more scrubber brushes while at least one conditioning bar is in contact with one or more scrubber brushes of the first one or more scrubber brushes.

8 . The method of claim 1 , wherein the cleaning cycle is periodic according to a first time period.

9 . A method of operating a chemical mechanical polishing (CMP) system, comprising:
performing, during a first time duration of a cleaning cycle, a first cleaning operation comprising:
rotating a first scrubber brush while in contact with a first substrate disposed within a first tank and causing a substrate cleaning fluid from a source to translate through a supply pipe to be provided to the first substrate; and
delivering a brush cleaning fluid from the supply pipe to a second scrubber brush disposed in a second tank without a substrate disposed in the second tank, the supply pipe configured to receive the brush cleaning fluid from the source; and
performing, during a second time duration of the cleaning cycle, a second cleaning operation comprising:
delivering the brush cleaning fluid to the first scrubber brush without a substrate disposed in the first tank; and
rotating, during the second time duration, the second scrubber brush while the second scrubber brush in contact with a second substrate disposed in the second tank and cause the substrate cleaning fluid to be provided to the second substrate.

10 . The method of claim 9 , further comprising removing the first substrate after the first time duration.

11 . The method of claim 9 , further comprising removing the first substrate before the second time duration.

12 . The method of claim 9 , wherein the first substrate is disposed vertically when in contact with the first scrubber brush.

13 . The method of claim 9 , wherein delivering the brush cleaning fluid to the second scrubber brush disposed in a second tank happens concurrently with the rotating the first scrubber brush while in contact with the first substrate disposed within the first tank.

14 . The method of claim 9 , further comprising:
performing, during a third time duration of the cleaning cycle, a cleaning operation comprising:
rotating the first scrubber brush while in contact with a third substrate disposed within the first tank and causing the substrate cleaning fluid from the source to translate through the supply pipe to be provided to the third substrate; and
delivering a brush cleaning fluid from the supply pipe to the second scrubber brush without a substrate disposed in the second tank.

15 . A method of operating a chemical mechanical polishing (CMP) system, comprising:
performing, during a first time duration of a cleaning cycle, a first cleaning operation comprising:
rotating a first scrubber brush while in contact with a first substrate disposed within a first tank and causing a substrate cleaning fluid from a source to translate through a supply pipe to be provided to the first substrate;
rotating, during the first time duration, a second scrubber brush disposed in a second tank while the second scrubber brush is in contact with a second substrate disposed in the second tank and causing the substrate cleaning fluid to be provided to the second substrate; and
delivering a brush cleaning fluid from the supply pipe to a third scrubber brush disposed in a third tank without a substrate disposed in the third tank, the supply pipe configured to receive the brush cleaning fluid from the source; and
performing, during a second time duration of the cleaning cycle, a second cleaning operation comprising:
delivering the brush cleaning fluid to the first scrubber brush without a substrate disposed in the first tank;
rotating, during the second time duration, the second scrubber brush while the second scrubber brush in contact with the first substrate disposed in the second tank and causing the substrate cleaning fluid to be provided to the first substrate; and
rotating, during the second time duration, the third scrubber brush while the third scrubber brush in contact with the second substrate disposed in the third tank and cause the substrate cle

Assignees

• Applied Materials Inc

Inventors

• Brown Brian J

Classifications

• H10P72/0412

  using mainly scrubbing means, e.g. brushes · CPC title

• H10P70/60

  Cleaning only by mechanical processes · CPC title

• B24B53/017

  Devices or means for dressing, cleaning or otherwise conditioning lapping tools · CPC title

• B08B1/34

  rotating about an axis parallel to the surface · CPC title

• B08B1/12

  Brushes · CPC title