Multilayer electronic component

Patent metadata

Field	Value
Publication number	US-2025182974-A1
Application number	US-202418944681-A
Country	US
Kind code	A1
Filing date	Nov 12, 2024
Priority date	Dec 1, 2023
Publication date	Jun 5, 2025
Grant date	—

Abstract

A multilayer electronic component includes a body including a dielectric layer and internal electrodes; and external electrodes disposed on the body, wherein the dielectric layer includes a plurality of dielectric grains, and at least one of the plurality of dielectric grains has a core-shell structure including a core and a shell surrounding at least a portion of the core, wherein a percentage of an average diameter of the core based on an average thickness of the dielectric layer is 15% or more and 19% or less, and wherein the shell includes rare earth elements and tin (Sn), and an average atomic percentage of a sum of rare earth elements and tin (Sn) in the shell is 0.8 at % or more and 1.2 at % or less.

First claim

What is claimed is:

1 . A multilayer electronic component, comprising:
a body including a dielectric layer and internal electrodes; and external electrodes disposed on the body, wherein the dielectric layer includes a plurality of dielectric grains, and at least one of the plurality of dielectric grains has a core-shell structure including a core and a shell surrounding at least a portion of the core, wherein an average diameter of the core is 15% or more and 19% or less of an average thickness of the dielectric layer, and wherein the shell includes rare earth elements and tin (Sn), and an average atomic percentage of a sum of the rare earth elements and tin (Sn) included in the shell is 0.8 at % or more and 1.2 at % or less with respect to a total atomic amount of the shell.

2 . The multilayer electronic component of claim 1 , wherein an average atomic percentage of the rare earth elements included in the shell is 0.2 at % or more and 0.7 at % or less.

3 . The multilayer electronic component of claim 1 , wherein an average atomic percentage of tin (Sn) included in the shell is 0.2 at % or more and 1.0 at % or less.

4 . The multilayer electronic component of claim 1 , wherein an average thickness of the dielectric layer is less than 0.8 μm.

5 . The multilayer electronic component of claim 1 , wherein an average diameter of the core is 70 nm or more and 120 nm or less.

6 . The multilayer electronic component of claim 1 , wherein an average atomic percentage of the rare earth elements in the core is 0 at % or more and less than 0.2 at %.

7 . The multilayer electronic component of claim 1 , wherein an average atomic percentage of tin (Sn) in the core is 0 at % or more and less than 0.2 at %.

8 . The multilayer electronic component of claim 1 , wherein an average atomic percentage of a sum of the rare earth elements and tin (Sn) included in the core is 0 at % or more and less than 0.4 at %.

9 . The multilayer electronic component of claim 1 , wherein the dielectric layer includes barium titanate (BaTiO 3 )-based material as a main component.

10 . The multilayer electronic component of claim 1 , wherein the rare earth elements include at least one of dysprosium (Dy) or terbium (Tb).

11 . The multilayer electronic component of claim 1 , wherein an average thickness of the internal electrode is 0.6 μm or less.

12 . The multilayer electronic component of claim 1 , wherein the multilayer electronic component has a length of 0.6 mm or less and a width of 0.3 mm or less.

Assignees

• Samsung Electro Mech

Inventors

• Park Si Taek
• Kim Hyoung Uk

Classifications

• H01G4/12

  Ceramic dielectrics {(H01G4/085 takes precedence)} · CPC title

• H01G4/30 Primary

  Stacked capacitors (H01G4/33 takes precedence) · CPC title

• Y02E60/13

  Energy storage using capacitors · CPC title

• H01G4/012 Primary

  Form of non-self-supporting electrodes · CPC title

• H01G4/232

  electrically connecting two or more layers of a stacked or rolled capacitor · CPC title