Printed circuit board and manufacturing method thereof

Patent metadata

Field	Value
Publication number	US-2025176103-A1
Application number	US-202418883680-A
Country	US
Kind code	A1
Filing date	Sep 12, 2024
Priority date	Nov 29, 2023
Publication date	May 29, 2025
Grant date	—

Abstract

A printed circuit board includes a first insulating layer; a pad portion located on the first insulating layer; a connection layer located on the pad portion and including a central portion and an extension portion extending from the central portion toward an edge of the pad portion; and a second insulating layer located on a portion of the pad portion and a portion of the connection layer, in which the extension portion of the connection layer may be located within a groove portion formed in the second insulating layer, and an upper surface of the extension portion of the connection layer may be covered with the second insulating layer.

First claim

What is claimed is:

1 . A printed circuit board, comprising:
a first insulating layer; a pad portion located on the first insulating layer; a connection layer located on the pad portion and including a central portion and an extension portion extending from a bottom of the central portion toward a top surface edge of the pad portion; and a second insulating layer disposed on the first insulating layer and covering an exposed portion of the pad portion and a portion of the connection layer, wherein the extension portion of the connection layer is located within a groove portion which is a space formed between the second insulating layer and the pad portion, and an upper surface of the extension portion of the connection layer is covered with the second insulating layer.

2 . The printed circuit board of claim 1 , wherein
the groove portion is located on a lower surface of the second insulating layer and on a top of the pad portion.

3 . The printed circuit board of claim 2 , wherein:
a lower surface of the extension portion of the connection layer is in contact with the pad portion.

4 . The printed circuit board of claim 3 , wherein
the central portion of the connection layer protrudes above the second insulating layer.

5 . The printed circuit board of claim 2 , wherein
the connection layer further includes a convex portion extending downward from the central portion and the extension portion.

6 . The printed circuit board of claim 5 , wherein
the pad portion includes a concave portion in an upper surface of the pad portion.

7 . The printed circuit board of claim 6 , wherein
the convex portion of the connection layer is located within the concave portion of the pad portion.

8 . The printed circuit board of claim 7 , wherein
the convex portion of the connection layer is in contact with the pad portion.

9 . The printed circuit board of claim 8 , wherein
the central portion of the connection layer protrudes above the second insulating layer.

10 . The printed circuit board of claim 1 , wherein
the central portion of the connection layer protrudes above the second insulating layer.

11 . A manufacturing method of a printed circuit board, comprising:
forming a pad portion on a first insulating layer; stacking a photosensitive film on the pad portion and the first insulating layer; forming a hole in the photosensitive film; forming a groove portion extending from a bottom of the hole in the photosensitive film; and depositing a metal layer in the hole and the groove portion to form a connection layer including a central portion located in the hole and an extension portion located in the groove portion.

12 . The manufacturing method of claim 11 , further comprising:
removing the photosensitive film; and stacking a second insulating layer on the pad portion, the connection layer, and the first insulating layer.

13 . The manufacturing method of claim 12 , further comprising:
removing a portion of the second insulating layer such that the central portion of the connection layer protrudes above the second insulating layer.

14 . The manufacturing method of claim 11 , wherein
the groove portion is formed on a lower surface of the photosensitive film.

15 . The manufacturing method of claim 14 , wherein:
a lower surface of the extension portion of the connection layer is formed on the pad portion to be in contact with the pad portion.

16 . The manufacturing method of claim 11 , further comprising:
removing a portion of an upper surface of the pad portion overlapping the hole of the photosensitive film to form a concave portion in the upper surface of the pad portion.

17 . The manufacturing method of claim 16 , wherein
the forming of the connection layer further includes forming a convex portion extending downward from the central portion and the extension portion.

18 . The manufacturing method of claim 17 , wherein
the convex portion of the connection layer is formed within the concave portion of the pad portion.

19 . The manufacturing method of claim 18 , wherein:
the convex portion of the connection layer is formed on the pad portion to be in contact with the pad portion.

Assignees

• Samsung Electro Mech

Inventors

• Kim Sanghyeok
• Han Sanghyun
• Min Taehong
• Kim Sanghoon

Classifications

• H05K3/4007

  Surface contacts, e.g. bumps (H05K3/4092 takes precedence; deposition of finish layers on pads H05K3/24; forming solder bumps H05K3/3465) · CPC title

• H05K3/34

  by soldering · CPC title

• H05K1/116 Primary

  Lands, clearance holes or other lay-out details concerning the surrounding of a via · CPC title

• H05K3/107

  by filling grooves in the support with conductive material (H05K3/045, H05K3/101, H05K3/1258 and H05K3/465 take precedence) · CPC title

• H05K2201/099

  Coating over pads, e.g. solder resist partly over pads · CPC title