Dry electrode structure and method of manufacturing the same

Patent metadata

Field	Value
Publication number	US-2025174668-A1
Application number	US-202418634729-A
Country	US
Kind code	A1
Filing date	Apr 12, 2024
Priority date	Nov 24, 2023
Publication date	May 29, 2025
Grant date	—

Abstract

Provided are a dry electrode structure and a method of manufacturing the same. An electrode structure may include an electrode substrate including a conductive material, a dry electrode portion bonded to the electrode substrate, and a bonding reinforcement portion on the electrode substrate to reinforce bonding force between the electrode substrate and the dry electrode portion.

First claim

What is claimed is:

1 . An electrode structure comprising:
an electrode substrate comprising a conductive material; a dry electrode portion bonded to the electrode substrate; and a bonding reinforcement portion on the electrode substrate to reinforce bonding force between the electrode substrate and the dry electrode portion.

2 . The electrode structure as claimed in claim 1 , wherein the bonding reinforcement portion comprises recessed portions recessed downwardly from an upper surface of the electrode substrate to increase a contact area contacting the dry electrode portion.

3 . The electrode structure as claimed in claim 2 , wherein the recessed portions comprise concave portions provided in the upper surface of the electrode substrate, and convex portions protruding as compared to the concave portions.

4 . The electrode structure as claimed in claim 2 , wherein the recessed portions comprise trenches recessed downwardly from the upper surface of the electrode substrate, and remaining base material portions alternating with the trenches.

5 . The electrode structure as claimed in claim 2 , wherein the recessed portions have a depth of about 1 μm to about 5 μm, and a width of about 1 μm to about 5 μm.

6 . The electrode structure as claimed in claim 1 , wherein the bonding reinforcement portion comprises protrusions protruding upwardly from an upper surface of the electrode substrate.

7 . The electrode structure as claimed in claim 6 , wherein the protrusions comprise a saw tooth shape, a column shape, a hemispherical shape, or a tree branch shape comprising branches branching from the column shape.

8 . The electrode structure as claimed in claim 6 , wherein the protrusions comprise electrolytic plated portions comprising a same material as the electrode substrate.

9 . The electrode structure as claimed in claim 6 , wherein the protrusions have a height of about 1 μm to about 5 μm, and
wherein a gap of about 1 μm to about 5 μm is between adjacent ones of the protrusions.

10 . The electrode structure as claimed in claim 1 , wherein the dry electrode portion comprises a dry electrode film produced by a dry electrode process without a dispersant for dispersing an active material, a conductive material, or a binder.

11 . The electrode structure as claimed in claim 10 , wherein the dry electrode portion comprises a negative active material, and
wherein the electrode substrate and the bonding reinforcement portion comprise a thin copper film, a nickel thin film, a stainless-steel thin film, a titanium thin film, a nickel foam, a copper foam, a polymer substrate coated with a conductive metal, or a combination thereof.

12 . The electrode structure as claimed in claim 10 , wherein the dry electrode portion comprises a positive active material, and
wherein the electrode substrate and the bonding reinforcement portion comprise aluminum.

13 . A method of manufacturing an electrode structure, the method comprising:
preparing an electrode substrate; forming a bonding reinforcement portion for reinforcing bonding force of the electrode substrate by processing an upper surface of the electrode substrate; and bonding a dry electrode portion onto the electrode substrate in direct contact with the bonding reinforcement portion.

14 . The method as claimed in claim 13 , wherein the forming of the bonding reinforcement portion comprises:
forming plating seeds on the upper surface of the electrode substrate; and forming protrusions having a plating height from the upper surface by precipitating a plating metal material on the plating seeds by a plating process.

15 . The method as claimed in claim 14 , wherein adjacent ones of the plating seeds have a gap of about 1 μm to about 5 μm.

16 . The method as claimed in claim 14 , wherein the plating height is about 1 μm to about 5 μm.

17 . The method as claimed in claim 13 , wherein the forming of the bonding reinforcement portion comprises:
forming a mask pattern on the upper surface of the electrode substrate; forming trenches having a line shape and spaced apart a gap from each other by partially removing the electrode substrate by an etching process using the mask pattern as an etching mask; and forming a line pattern comprising the trenches and remaining substrate portions by removing the mask pattern from the electrode substrate.

18 . The method as claimed in claim 17 , wherein the forming of the mask pattern comprises:
forming a photoresist film on the electrode substrate; performing an exposure process to the photoresist film to have the line shape; and developing the photoresist film.

19 . The method as claimed in claim 13 , further comprising forming the dry electrode portion by repeating a calendaring process on electrode powder in which an electrode active material, a conductive material, and a binder are mixed.

20 . The method as claimed in claim 19 , wherein the bonding of the dry electrode portion onto the electrode substrate comprises a laminating process of thermally pressing the electrode substrate and the dry electrode portion by feeding the electrode substrate and the dry electrode portion between a pair of lamination rollers.

Assignees

• Samsung Sdi Co Ltd

Inventors

• Lee Seunghun
• Park Gwangwon
• Jung Daeun
• Lee Miyoung
• Moon Jeunggi
• Lee Jinhyon
• Kim Janghwan

Classifications

• H01M4/70

  characterised by shape or form · CPC title

• H01M4/139

  Processes of manufacture · CPC title

• H01M4/13 Primary

  Electrodes for accumulators with non-aqueous electrolyte, e.g. for lithium-accumulators; Processes of manufacture thereof · CPC title

• H01M4/0435

  Rolling or calendering · CPC title

• H01M4/04

  Processes of manufacture in general · CPC title