Glue for boards

US2025170745A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2025170745-A1
Application numberUS-202318730550-A
CountryUS
Kind codeA1
Filing dateJan 24, 2023
Priority dateFeb 4, 2022
Publication dateMay 29, 2025
Grant date

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  1. Title

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  2. Abstract

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A board includes cellulose-containing materials, such as plant fibres and/or wood chips and/or wood parts, and a glue which connects these cellulose-containing materials to each other. The glue is a glue based on hyperbranched polyamides. A method is provided for making such boards and a glue for such boards

First claim

Opening claim text (preview).

1 .- 23 . (canceled). 24 . A board comprising cellulose-containing materials, such as plant fibres and/or wood chips and/or wood parts, and a glue which connects these cellulose-containing materials to each other, wherein the glue is a glue based on hyperbranched polyamides. 25 . The board according to claim 24 , wherein said hyperbranched polyamides are obtained by polycondensation of amino acids. 26 . The board according to claim 24 , wherein the hyperbranched polyamides comprise a first group of hyperbranched polyamides having an average molecular weight of between 500 and 100 000 g/mol. 27 . The board according to claim 24 , wherein the board comprises one or more layers, wherein at least one aforementioned layer comprises said cellulose-containing materials and said glue, wherein the weight ratio of hyperbranched polyamides to cellulose-containing materials in this layer is between 0.03 and 0.15. 28 . The board according to claim 27 , wherein the board comprises three or more layers, namely two outer layers and one or more central layers, wherein at least one central layer comprises said cellulose-containing materials and said glue, and wherein the outer layers each comprise cellulose-containing materials and a glue based on hyperbranched polyamides, wherein the weight ratio of hyperbranched polyamides to cellulose-containing materials in the outer layers is higher than the weight ratio of hyperbranched polyamides to cellulose-containing materials in the last-mentioned central layer. 29 . The board according to claim 24 , wherein the hyperbranched polyamides comprise a first group of hyperbranched polyamides and a second group of hyperbranched polyamides, wherein the average molecular weight of the first group of hyperbranched polyamides is at least three times higher than the average molecular weight of the second group of hyperbranched polyamides and/or wherein the average molecular weight of the first group of hyperbranched polyamides is at most 15 times higher than the average molecular weight of the second group of hyperbranched polyamides. 30 . The board according to claim 29 , wherein the second group of hyperbranched polyamides constitutes between 5 and 30 percent by weight of the total weight of the hyperbranched polyamides. 31 . The board according to claim 24 , wherein the glue comprises crosslinkers, wherein these crosslinkers are selected from the group comprising polyketones, polyesters, isocyanate dispersions, epoxides, glyoxal and other dialdehydes. 32 . The board according to claim 31 , wherein the weight ratio of crosslinkers to hyperbranched polyamides is between 0.02 and 0.15. 33 . A method for forming boards comprising cellulose-containing materials, such as plant fibres and/or wood chips and/or wood parts, wherein cellulose-containing materials are provided and a glue is applied to these cellulose-containing materials, after which these cellulose-containing materials provided with glue are pressed to form a board-like material in order to thus form boards, wherein the glue is a glue based on hyperbranched polyamides. 34 . The method according to claim 33 , wherein said hyperbranched polyamides of the glue are obtained by polycondensation of amino acids. 35 . The method according to claim 33 , wherein the hyperbranched polyamides comprise a first group of hyperbranched polyamides having an average molecular weight of between 500 and 100 000 g/mol, and wherein the hyperbranched polyamides comprise a second group of hyperbranched polyamides, wherein the average molecular weight of the first group of hyperbranched polyamides is at least three times higher, than the average molecular weight of the second group of hyperbranched polyamides and/or wherein the average molecular weight of the first group of hyperbranched polyamides is at most 15 times higher than the average molecular weight of the second group of hyperbranched polyamides. 36 . The method according to claim 33 , wherein the board comprises one or more layers, wherein these layers are pressed together and wherein at least one aforementioned layer comprises said cellulose-containing materials and said glue, wherein the weight ratio of hyperbranched polyamides to cellulose-containing materials in this layer is between 0.03 and 0.15. 37 . The method according to claim 33 , wherein the glue comprises crosslinkers and/or wherein crosslinkers are applied to the cellulose-containing materials, wherein these crosslinkers are selected from the group comprising polyketones, polyesters, isocyanate dispersions, epoxides, glyoxal and other dialdehydes. 38 . The method according to claim 33 , wherein the glue comprises water as solvent and thus forms an aqueous solution. 39 . A glue for connecting cellulose-containing materials, such as plant fibres and/or wood chips and/or wood parts, to form boards, wherein the glue is based on hyperbranched polyamides. 40 . The glue according to claim 39 , wherein the hyperbranched polyamides are obtained by polycondensation of amino acids, wherein these amino acids are selected from the group comprising arginine, glutamine, asparagine and lysine. 41 . The glue according to claim 39 , wherein the hyperbranched polyamides comprise a first group of hyperbranched polyamides having an average molecular weight of between 500 and 100 000 g/mol, and wherein the hyperbranched polyamides comprise a second group of hyperbranched polyamides, wherein the average molecular weight of the first group of hyperbranched polyamides is at least three times higher, than the average molecular weight of the second group of hyperbranched polyamides and/or wherein the average molecular weight of the first group of hyperbranched polyamides is at most 15 times higher, than the average molecular weight of the second group of hyperbranched polyamides. 42 . The glue according to claim 39 , wherein the glue comprises crosslinkers, wherein these crosslinkers are selected from the group comprising polyketones, polyesters, isocyanate dispersions, epoxides, glyoxal and other dialdehydes and wherein the weight ratio of crosslinkers to hyperbranched polyamides is between 0.02 and 0.15. 43 . The glue according to claim 39 , wherein the glue comprises water as solvent and thus forms an aqueous solution.

Assignees

Inventors

Classifications

  • C09J177/04Primary

    Polyamides derived from alpha-amino carboxylic acids (C09J177/10 takes precedence) · CPC title

  • with heating or cooling means · CPC title

  • from fibres · CPC title

  • and at least partly composed of recycled material · CPC title

  • B27N3/002Primary

    characterised by the type of binder (compositions of macromolecular compounds C08L) · CPC title

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What does patent US2025170745A1 cover?
A board includes cellulose-containing materials, such as plant fibres and/or wood chips and/or wood parts, and a glue which connects these cellulose-containing materials to each other. The glue is a glue based on hyperbranched polyamides. A method is provided for making such boards and a glue for such boards
Who is the assignee on this patent?
Unilin Bv
What technology area does this patent fall under?
Primary CPC classification C09J177/04. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Thu May 29 2025 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).