Bezel-less camera and sensor hole with functional sub-pixel

US2025169326A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2025169326-A1
Application numberUS-202418949389-A
CountryUS
Kind codeA1
Filing dateNov 15, 2024
Priority dateNov 17, 2023
Publication dateMay 22, 2025
Grant date

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Embodiments described herein relate to sub-pixel circuits, displays including sub-pixel circuits, and a method of forming sub-pixel circuits that may be utilized in a display such as an organic light-emitting diode (OLED) display. Some configurations of the displays described herein include a backplane and a plurality of sub-pixel circuits separated by adjacent overhang structures disposed over the backplane. The at least one sub-pixel circuit has sub-pixels surrounded by adjacent overhang structures. The sub-pixel circuit includes one or more organic light-emitting diode (OLED) sub-pixels and an organic photodiode (OPD) sub-pixel. The OLED sub-pixels include a transistor disposed in the backplane, an electrode disposed over the transistor, an OLED material disposed over the electrode. The electrode is connected to the transistor of the backplane. The OPD sub-pixel includes an electrode and an organic photodiode (OPD) material disposed over the electrode.

First claim

Opening claim text (preview).

What is claimed is: 1 . A display, comprising: a backplane; a plurality of sub-pixel circuits separated by adjacent overhang structures disposed over the backplane, at least one sub-pixel circuit has sub-pixels defined by adjacent overhang structures, wherein the sub-pixel circuit comprises: one or more organic light-emitting diode (OLED) sub-pixels comprising: a transistor disposed in the backplane; an electrode disposed over the transistor, the electrode being connected to the transistor of the backplane; and an OLED material disposed over the electrode; and a photo-electrode sub-pixel comprising: an electrode; and a photo-electrode material disposed over the electrode. 2 . The display of claim 1 , wherein the electrode comprises chromium, titanium, gold, silver, copper, aluminum, ITO, combinations thereof. 3 . The display of claim 1 , wherein the electrode comprises metal-containing layers that are pre-patterned on the backplane. 4 . The display of claim 1 , where each over overhang structure is defined by an extension of a second structure extending laterally past a first structure. 5 . The display of claim 1 , wherein the photo-electrode material comprises an organic polymer or an organic small molecule. 6 . The display of claim 1 , wherein the photo-electrode material further comprises an emitter. 7 . The display of claim 6 , wherein the emitter is an IR emitter or a light-emitting diode (LED). 8 . A sub-pixel circuit, comprising: one or more organic light-emitting diode (OLED) sub-pixels comprising: a transistor disposed in a backplane; an electrode disposed over the transistor, the electrode being connected to the transistor of the backplane; and an OLED material disposed over the electrode; and a photo-electrode sub-pixel comprising: an electrode; and a photo-electrode material over the electrode. 9 . The sub-pixel circuit of claim 8 , wherein sub-pixel of the sub-pixel circuit is defined by adjacent overhang structures. 10 . The sub-pixel circuit of claim 9 , each over overhang structure is defined by an extension of a second structure extending laterally past a first structure. 11 . The sub-pixel circuit of claim 8 , wherein the electrode comprises chromium, titanium, gold, silver, copper, aluminum, ITO, combinations thereof. 12 . The sub-pixel circuit of claim 8 , wherein the photo-electrode material further comprises an emitter. 13 . The sub-pixel circuit of claim 12 , wherein the emitter is an IR emitter or a light-emitting diode (LED). 14 . The sub-pixel circuit of claim 8 , wherein the photo-electrode material comprises an organic polymer or an organic small molecule. 15 . A method, comprising: forming adjacent overhang structures on a backplane, wherein the overhang structures define an OLED sub-pixel area and an organic photodiode (OPD) sub-pixel area; depositing an organic light emitting diode (OLED) material in the OLED sub-pixel area and the OPD sub-pixel area; depositing a cathode over the OLED material; depositing an encapsulation layer over the cathode; forming a first resist layer in the OLED sub-pixel area; removing one or more exposed portions of the encapsulation layer; removing one or more exposed portions of the OLED material; removing the resist layer; depositing an OPD material layer in the OLED sub-pixel area and the OPD sub-pixel area; depositing the encapsulation layer; forming a second resist layer in the OPD sub-pixel area; and removing one or more exposed portions of the OPD material layer and encapsulation layer to form a OPD material in the OPD sub-pixel area. 16 . The method of claim 15 , wherein the OPD material comprises an organic polymer or an organic small molecule. 17 . The method of claim 15 , wherein the overhang structures comprise at least a second structure disposed over a first structure. 18 . The method of claim 15 , wherein the organic photodiode comprises an organic polymer or an organic small molecule. 19 . The method of claim 15 , wherein an electrode is disposed on the backplane. 20 . The method of claim 19 , wherein the OPD material is disposed over the electrode.

Assignees

Inventors

Classifications

  • Pixel-defining structures or layers, e.g. banks · CPC title

  • OLEDs integrated with inorganic light-emitting elements, e.g. with inorganic electroluminescent elements · CPC title

  • Manufacture or treatment · CPC title

  • Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element and at least one organic radiation-sensitive element, e.g. organic opto-couplers (organic image sensors integrated with organic light-emitting devices H10K39/34; OLED displays integrated with photosensors H10K59/13) · CPC title

  • comprising indium oxides, e.g. ITO · CPC title

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What does patent US2025169326A1 cover?
Embodiments described herein relate to sub-pixel circuits, displays including sub-pixel circuits, and a method of forming sub-pixel circuits that may be utilized in a display such as an organic light-emitting diode (OLED) display. Some configurations of the displays described herein include a backplane and a plurality of sub-pixel circuits separated by adjacent overhang structures disposed over…
Who is the assignee on this patent?
Applied Materials Inc
What technology area does this patent fall under?
Primary CPC classification H10K59/60. Mapped technology areas include Electricity.
When was this patent published?
Publication date Thu May 22 2025 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).