Substrate processing apparatus and substrate processing method using the same

Patent metadata

Field	Value
Publication number	US-2025167012-A1
Application number	US-202418794556-A
Country	US
Kind code	A1
Filing date	Aug 5, 2024
Priority date	Nov 20, 2023
Publication date	May 22, 2025
Grant date	—

Abstract

A substrate processing apparatus includes a stage configured to support a substrate, a rotation driving portion configured to rotate the stage around a first axis extending in a vertical direction, a first nozzle arm disposed on the stage and configured to rotate around a second axis parallel to the first axis, and a second nozzle arm disposed on the stage and configured to rotate around a third axis parallel to the second axis. The first nozzle arm includes a first nozzle supporting member extended parallel to the stage, a first connection member coupled to an end of the first nozzle supporting member, the first connection member having a stepwise shape, and a first nozzle coupled to the first connection member and configured to spray a fluidic material.

First claim

What is claimed is:

1 . A substrate processing apparatus, comprising:
a stage configured to support a substrate; a rotation driving portion configured to rotate the stage around a first axis extending in a vertical direction; a first nozzle arm disposed on the stage and configured to rotate around a second axis parallel to the first axis; and a second nozzle arm disposed on the stage and configured to rotate around a third axis parallel to the second axis, wherein the first nozzle arm comprises:
a first nozzle supporting member extended parallel to the stage;
a first connection member coupled to an end of the first nozzle supporting member, the first connection member having a stepwise shape; and
a first nozzle coupled to the first connection member and configured to spray a fluidic material.

2 . The apparatus of claim 1 , wherein an angle between a first straight line and a second straight line ranges from 10 degrees to 180 degrees,
wherein the first straight line extends from the first axis to the second axis in a horizontal direction, and wherein the second straight line extends from the first axis to the third axis in a horizontal direction.

3 . The apparatus of claim 1 , wherein the second axis is same as the third axis,
wherein the second nozzle arm comprises:
a second nozzle supporting member disposed perpendicular to the third axis;
a second connection member coupled to an end of the second nozzle supporting member; and
a second nozzle coupled to the second connection member, and
wherein the second nozzle supporting member is disposed on the first nozzle supporting member.

4 . The apparatus of claim 3 , wherein the second connection member is extended in a vertical direction,
wherein a level of a top surface of the second nozzle supporting member is higher than a level of a top surface of the first nozzle supporting member, and wherein a level of a bottom surface of the second connection member is lower than the level of the top surface of the first nozzle supporting member.

5 . The apparatus of claim 2 , wherein the second nozzle arm comprises:
a second nozzle supporting member disposed perpendicular to the third axis; a second connection member coupled to an end of the second nozzle supporting member; and a second nozzle coupled to the second connection member and configured to spray another fluidic material, wherein the second connection member comprises a stepwise portion extended from the end of the second nozzle supporting member, and wherein the first connection member and the second connection member are engaged with each other.

6 . The apparatus of claim 2 , wherein the first nozzle arm and the second nozzle arm are disposed at a same level, and
wherein a first range of rotation of the first nozzle arm and a second range of rotation of the second nozzle arm meet at a one or two points.

7 . The apparatus of claim 1 , wherein the stage comprises:
a stage body having a shape of a circular plate; and a substrate supporting fixture configured to dispose the substrate at a level that is spaced apart from a top surface of the stage body.

8 . The apparatus of claim 7 , further comprising:
a third nozzle arm extended to at least partially penetrate the stage body in a vertical direction, wherein a level of a top surface of the third nozzle arm is lower than a level of a top surface of the substrate supporting fixture.

9 . A substrate processing apparatus, comprising:
a stage configured to support a substrate; a rotation driving portion configured to rotate the stage around a first axis; a first nozzle arm disposed on the stage and configured to rotate around a second axis parallel to the first axis; and a second nozzle arm disposed on the first nozzle arm and configured to rotate around the second axis, wherein the first nozzle arm comprises:
a first nozzle supporting member extended parallel to the stage;
a first connection member coupled to an end of the first nozzle supporting member, the first connection member having a stepwise shape; and
a first nozzle coupled to the first connection member and extended in a vertical direction.

10 . The apparatus of claim 9 , wherein the second nozzle arm comprises:
a second nozzle supporting member extended in a direction perpendicular to the second axis; a second connection member coupled to an end of the second nozzle supporting member; and a second nozzle coupled to the second connection member and configured to spray a fluidic material, wherein the second nozzle and the second connection member are extended in a vertical direction.

11 . The apparatus of claim 10 , wherein the first nozzle arm and the second nozzle arm are configured to rotate in opposite directions.

12 . The apparatus of claim 9 , wherein the stage comprises:
a stage body having a shape of a circular plate; and a substrate supporting fixture configured to dispose the substrate at a level that is spaced apart from a top surface of the stage body.

13 . The apparatus of claim 12 , further comprising:
a third nozzle arm configured to at least partially penetrate the stage body in a vertical direction and to spray a fluidic material.

14 . The apparatus of claim 10 , wherein a level of a bottom surface of the second connection member is lower than a level of a top surface of the first nozzle supporting member, and
wherein the second connection member hinders the first nozzle arm from being rotated toward the second nozzle supporting member.

15 . A substrate processing method, comprising:
placing a substrate in a substrate processing apparatus; and processing the substrate, wherein the processing of the substrate comprises:
spraying, from a first nozzle, organic solvent onto a stage of the substrate processing apparatus;
spraying, from a second nozzle, deionized (DI) water toward a center region of the stage; and
spraying, from a third nozzle, a chemical solution,
wherein the first nozzle is coupled to a first connection member, the first connection member being coupled to an end of a first nozzle supporting member, the first connection member having a stepwise shape, the first nozzle supporting member being extended toward the center region of the stage and parallel to the stage, a first nozzle arm of the substrate processing apparatus comprising the first nozzle supporting member, the first connection member, and the first nozzle, the first nozzle arm being disposed on the stage to rotate around a second axis perpendicular to the top surface of the stage, wherein a second nozzle arm of the substrate processing apparatus comprises the second nozzle and the third nozzle, the second nozzle arm being disposed on the stage to rotate around a third axis parallel to the second axis, and wherein the substrate processing apparatus comprises a rotation driving portion rotating the stage around a first axis perpendicular to a top surface of the stage.

16 . The substrate processing method of claim 15 , wherein the spraying of the organic solvent comprises:
spraying, from the first nozzle, the organic solvent having a surface tension less than or equal to 72 dyne/cm.

17 . The substrate processing method of claim 15 , wherein the spraying of the organic solvent comprises:
spraying, from the first nozzle, the organic solvent comprising at least one of ether, acetate, alcohol, or isopropyl alcohol (IPA).

18 . The substrate processing method of claim 15 , wherein the spraying of the organic solvent comprises:
spraying, from the

Assignees

• Samsung Electronics Co Ltd

Inventors

• Jeong Jihoon
• Yoon Junho
• Kim Young-Hoo
• Kim Taeheon
• Shim Woogwan
• Lee Jongwon
• Lee Junho
• Jung Jiwoong

Classifications

• H10P70/20

  Cleaning during device manufacture · CPC title

• H10P72/0414 Primary

  using mainly spraying means, e.g. nozzles · CPC title

• H10P72/0424

  using mainly spraying means, e.g. nozzles · CPC title

• B05B3/04

  driven by the liquid or other fluent material discharged, e.g. the liquid actuating a motor before passing to the outlet · CPC title

• B08B3/08

  the liquid having chemical or dissolving effect · CPC title